Surface Engineering and Applied Electrochemistry最新文献_第2页

Calculation of the Main Averaged Characteristics of the Drift of Lone Electrons in a Metal Conductor with a Conduction Current 计算有传导电流的金属导体中孤电子漂移的主要平均特性

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-10-28 DOI: 10.3103/S1068375524700212

M. I. Baranov

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Investigating Ultrasonically Assisted CdxCryFe3 – (x + y)O4 for Its Electrochemical Efficacy towards Water Electrolysis, Ethanol and Methanol Oxidation 研究超声辅助 CdxCryFe3 - (x + y)O4 对水电解、乙醇和甲醇氧化的电化学功效

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-10-28 DOI: 10.3103/S1068375524700200

Prakhar Mishra, Divya Singh, Faishal Khan, Reena Parihar, Narendra Kumar Singh

{"title":"Investigating Ultrasonically Assisted CdxCryFe3 – (x + y)O4 for Its Electrochemical Efficacy towards Water Electrolysis, Ethanol and Methanol Oxidation","authors":"Prakhar Mishra, Divya Singh, Faishal Khan, Reena Parihar, Narendra Kumar Singh","doi":"10.3103/S1068375524700200","DOIUrl":"10.3103/S1068375524700200","url":null,"abstract":"To increase the effectiveness of various electrochemical energy conversion and storage systems, electroactive and affordable electrocatalysts must be developed. Herein, the developed ultrasonic approach in the design and synthesis of the Fe-based spinel oxide (Fe3O4, CdFe2O4, CrFe2O4, and Cd0.2Cr0.8Fe2O4) nano-boxes, whose electrochemical performance was studied, is reported. The X-ray diffraction patterns proved the presence of the complete solitary-phase nano-spinel oxides. The Fourier-transform infrared spectra also supported the developed oxide structures. The thermogravimetric analysis showed a notable decline in the sample’s weights, with the most significant weight loss observed at approximately 35.46%. The cyclic voltammetry and the Tafel measurements were applied to investigate the electrochemical merits of the synthesized nanoparticles on a titanium supported electrode for different electrocatalytic applications. The results from cyclic voltammetry revealed that the substitution of the A site of the Fe atom with Cr or Cd had a detrimental impact on the current density value, and the ferrite with only chromium substitution exhibited the minimal current density at 0.7 V. The electrocatalytic activity estimated by Tafel curves towards an oxygen evolution reaction, ethanol and methanol oxidation reactions showed that the ternary ferrite with cadmium and chromium substitution (Cd0.8Cr0.2Fe2O4) had the highest current density of 0.224 mA/cm2 at 850 mV towards an oxygen evolution reaction and was the most active towards a methanol oxidation reaction.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 4","pages":"618 - 625"},"PeriodicalIF":0.9,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142524396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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The Effect of Preparation Conditions on the Characteristics of Anodized Copper Oxide 制备条件对阳极氧化铜特性的影响

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-10-28 DOI: 10.3103/S1068375524700194

Haitham Ibraheem Salih, Mustafa Shakir Hashim

{"title":"The Effect of Preparation Conditions on the Characteristics of Anodized Copper Oxide","authors":"Haitham Ibraheem Salih,  Mustafa Shakir Hashim","doi":"10.3103/S1068375524700194","DOIUrl":"10.3103/S1068375524700194","url":null,"abstract":"The rapid breakdown anodization process was used to modify the copper surface. The effects of the chemical solution mechanical movement (CSMM), anode edge isolation, applied voltage, and activity of hydrogen ions in the solution on the morphology of anodized copper were studied. The X-ray diffraction test confirmed the formation of Cu2O on the anode as the dominant phase. Increasing the applied voltage changed the ratio of the produced Cu2O powders phases. The CSMM and the isolation of samples edges did not affect the type of the powder components or their ratio, but the applied voltage did. The CuO phase appeared only when the anode became outside the container. The shapes of the produced particles on the anode were cubic or irregular sphere depending on the applied conditions. Rather than in the solution, the growth of cubic forms took place on the anode itself. The particles formed on the cathode had the same shapes as those found in powders. When the CSMM was absent, the applied voltages had less influence on corrosion; but when edges were exposed, the effect was greater. The obtained results revealed increases in the corrosion activity at low pH values.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 5","pages":"666 - 676"},"PeriodicalIF":0.9,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142524414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Protective Heterophase Coatings Produced by Electrospark Deposition and High-Power Impulse Magnetron Sputtering 电火花沉积和大功率脉冲磁控溅射产生的保护性异相涂层

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-10-28 DOI: 10.3103/S1068375524700182

E. I. Zamulaeva, A. E. Kudryashov, Ph. V. Kiryukhantsev-Korneev, E. A. Bashkirov, S. K. Mukanov, Yu. S. Pogozhev, E. A. Levashov

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Chapter 6. Surface Mount Assembly of Electronic Modules 第 6 章表面贴装电子模块的表面贴装

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S1068375524700066

V. L. Lanin, V. A. Emel’yanov, I. B. Petukhov

{"title":"Chapter 6. Surface Mount Assembly of Electronic Modules","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petukhov","doi":"10.3103/S1068375524700066","DOIUrl":"10.3103/S1068375524700066","url":null,"abstract":"Surface mounting, as a constructive-technological approach in miniaturizing fourth-generation electronic equipment, has yielded significant advancements. These include the miniaturization of structural elements, a two- to three-fold increase in mounting density, decreased material consumption, and enhanced resistance to vibration—a critical factor ensuring equipment reliability. Shortening the lead length has correspondingly diminished parasitic inductance, capacitance, and resistance, thereby improving electrical parameters and bolstering equipment reliability. This chapter presents a classification of surface mounting varieties and discusses the technological equipment used for applying solder paste, placement and soldering components. The soldering of SMD components using solder pastes necessitates precise individual temperature profiling of heating for each board size, typically facilitated by a microcontroller. Soldering modes, governed by the melting of solder pastes, are determined by a temperature–time diagram, which is meticulously optimized for IR ovens with multiple heating zones. The chapter also addresses the primary defects encountered in surface mounting processes and delineates measures for their effective elimination.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"374 - 407"},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Chapter 8. Assembly and Mounting of Microwave Micromodules and Microblocks 第 8 章装配和安装微波微模块和微块的组装与安装

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S106837552470008X

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov

{"title":"Chapter 8. Assembly and Mounting of Microwave Micromodules and Microblocks","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/S106837552470008X","DOIUrl":"10.3103/S106837552470008X","url":null,"abstract":"The examination of structural and technological features of microwave (MW) modules, along with trends in their development, is a focal point of this chapter. Detailed descriptions are given concerning the technological operations entailed in assembling MW microblocks, capable of operating at frequencies up to 20 GHz, inclusive of vibrational and ultrasonic soldering. Investigative efforts delve into dependences concerning the degree of wetting of microstrips in response to exposure time to ultrasonic (US) vibrations. These investigations reveal that optimal wetting within a 15-s timeframe is achieved for Sn–Pb solder and galvanic coating with a tin–bismuth alloy. This favorable outcome is attributed to the superior fluidity exhibited by this solder in comparison to Sn–In solder, as well as the absence of intermetallic formation during the soldering process of tin–bismuth coatings, which deteriorates the wetting process, as in the case of gold coatings. The implementation of US vibrations in pulse mode, characterized by pulse frequencies ranging from 0.5 to 10 Hz and depths of 2 to 6, aims to mitigate the formation of wave superpositions leading to the development of nodes and lobes of displacement amplitude in the solder. By localizing a homogeneous cavitation process within the molten solder, this methodology facilitates the simultaneous destruction of oxide films across the entire soldered surface of the microstrip board, thereby creating conducive conditions for complete wetting of the board surface by the solder, without the use of fluxes. The use of high-frequency heating in combination with a ferrite magnetic circuit during the sealing of microblock packages composed of diamagnetic alloys is explored. This approach serves to enhance process efficiency, augment the reliability of microelectronic devices, and facilitate the substitution of lead-free solders for conventional tin–cadmium and tin–bismuth solders, thus addressing environmental concerns and regulatory requirements.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"454 - 462"},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Chapter 4. Physicochemical Foundations of Electric Mounting Soldering 第 4 章物理化学基础电安装焊接的物理化学基础

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S1068375524700042

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov

{"title":"Chapter 4. Physicochemical Foundations of Electric Mounting Soldering","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/S1068375524700042","DOIUrl":"10.3103/S1068375524700042","url":null,"abstract":"To ensure the formation of high-quality solder joints, it is imperative to engage in surface preparation of the materials being joined, activate both the materials and solder, eliminate oxide films in the contact zone, facilitate interaction at the interfacial boundary, and induce crystallization of the liquid metal layer. This chapter delves into the processes involved in removing surface oxide films from solderable surfaces and discusses the pertinent equipment employed. Additionally, it highlights the potential efficacy of ultrasonic methods in oxide film removal through the introduction of elastic mechanical vibrations into the molten solder. Mathematical expressions are derived to elucidate the dynamics at the solder-surface interface, during the capillary penetration of solder into gaps and the diffusion process. The formation of a soldered joint with a specific structure results from the physicochemical interaction between the solder and the base metal. This joint typically encompasses a melting zone and diffusion zone at the solder and the base metal interface. The ultimate structure and composition of the solder joint depend on the nature of the interacting metals, their chemical affinity, and the soldering conditions, including time and temperature.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"332 - 341"},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Chapter 12: Microassembly of Integrated Circuits and Micromodules 第 12 章：集成电路和微型模块的微组装

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S1068375524700121

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov

{"title":"Chapter 12: Microassembly of Integrated Circuits and Micromodules","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/S1068375524700121","DOIUrl":"10.3103/S1068375524700121","url":null,"abstract":"Wire bonding remains a primary method for assembling integrated circuits and micromodules due to its high process automation and versatility across manufacturing technological options, as well as the geometric dimensions of the products. Significant progress has been made in the development of interconnection methods in integrated electronic devices, mitigating the complexity of these operations and notable successes towards their full automation. Various processes such as thermocompression bonding, ultrasonic (US) bonding, and thermo-ultrasonic bonding during the assembly of integrated circuits and micromodules are extensively examined. The characteristics of automatic equipment for bonding, along with the peculiarities of the tools employed, are provided for comprehensive understanding. In ultrasonic bonding, mechanical vibrations of ultrasonic frequency are introduced into the contact zone, resulting in the plastic deformation of the wire lead and the removal of oxide films, thereby creating atomically clean juvenile surfaces. This process intensifies the formation of active centers during the bond formation without significant wire deformation or substantial heating. Thermo-ultrasonic bonding involves the combined action of ultrasonic energy, tool loading force, and heating temperature up to 200–220°C. This combination enhances the reproducibility of bond quality and eliminates sensitivity to variations in the properties of the materials being bonded, leading to more consistent and reliable results.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"520 - 552"},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment 第 1 章.电子设备的组装和安装：技术和设备的进步

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S1068375524700017

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov

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Chapter 15: Quality Control of Assembly and Mounting 第 15 章：装配和安装的质量控制

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Surface Engineering and Applied Electrochemistry Pub Date : 2024-09-09 DOI: 10.3103/S1068375524700157

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov

{"title":"Chapter 15: Quality Control of Assembly and Mounting","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/S1068375524700157","DOIUrl":"10.3103/S1068375524700157","url":null,"abstract":"This chapter delineates detailed methods and tools for the visual inspection of soldered joints. It enumerates the primary types of defects and the capabilities of automatic visual and electrical inspection for their detection and highlights the use of automatic equipment for thermographic, acoustic, and X-ray inspection of soldered and microsoldered joints. The methodology for monitoring transient electrical resistance in contact connections is also examined. For automatic electrical inspection of connections, systems equipped with flying probes are used. These systems supply power and receive signals from the inspected connection on the board or component, automatically verifying functionality. The criteria for assessing the strength of soldered joints include the magnitude of the pull-off force, the durability of the joints under alternating loads, and vibration resistance. Destructive testing is employed to ascertain the mechanical and physico-mechanical properties of soldered joints. In metallographic inspection, the diffusion zone between the solder and the base metal is identified, and the quality of the soldered joint is assessed based on its width. Typical defects of soldered joints and their causes are considered.","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"572 - 598"},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0