Soft science最新文献_第6页

A lamellar-ordered poly[bi(3,4-ethylenedioxythiophene)-alt-thienyl] for efficient tuning of thermopower without degenerated conductivity 一种层状有序聚[双(3,4-乙基二氧噻吩)-邻噻吩]，用于有效调节热功率而不使电导率退化

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.10

L. Shen, Meng-ting Liu, Peipei Liu, Jingkun Xu, N. Li, Zhiliang Wan, Zhihong Chen, Cong-cong Liu, Weiqiang Zhou, Yu-Jie Liang, F. Jiang

{"title":"A lamellar-ordered poly[bi(3,4-ethylenedioxythiophene)-alt-thienyl] for efficient tuning of thermopower without degenerated conductivity","authors":"L. Shen, Meng-ting Liu, Peipei Liu, Jingkun Xu, N. Li, Zhiliang Wan, Zhihong Chen, Cong-cong Liu, Weiqiang Zhou, Yu-Jie Liang, F. Jiang","doi":"10.20517/ss.2023.10","DOIUrl":"https://doi.org/10.20517/ss.2023.10","url":null,"abstract":"Modulating the structural order of conjugated polymers has emerged as a significant approach to enhance the organic thermoelectric performance. Among these materials, poly(3,4-ethylenedioxythiophene) is considered a promising candidate due to its high conductivity. However, its low thermopower remains a major obstacle to further improve its performance as an organic thermoelectric material. To address this issue, a series of thiophene derivatives with high rigidity and containing dioxyethylene groups were synthesized, and polymer films were prepared through a simple and mild in-situ polymerization method. The polymer molecule containing a thiophene block, named poly[bi(3,4-ethylenedioxy)-alt-thienyl] , exhibits significant self-rigidification due to non-covalent interactions between oxygen and sulfur atoms, resulting in highly ordered assembly. By adding thiophene and thieno[3,2-b]thiophene structures to the intermediate precursor bi(3,4-ethylenedioxy), the 3,4-ethylenedioxy content in the polymer molecule is altered, leading to an almost four-fold increase in the thermopower of the thin film polymer and achieving a maximum thermopower of around 26 μV·K-1. Although poly[bi(3,4-ethylenedioxy)-alt-thienyl] shows a significant increase in thermopower compared to poly[bi(3,4-ethylenedioxy)], the thin film conductivity exhibits a nearly imperceptible decreasing trend due to its highly ordered microstructure. This work highlights the potential to control the aggregation state of polymer molecules and achieve an approximate decoupling between the conductivity and thermopower of thermoelectric materials by rationally designing polymer molecules.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Recent progress in thermal management for flexible/wearable devices 柔性/可穿戴设备热管理的最新进展

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.04

J. Yun

{"title":"Recent progress in thermal management for flexible/wearable devices","authors":"J. Yun","doi":"10.20517/ss.2023.04","DOIUrl":"https://doi.org/10.20517/ss.2023.04","url":null,"abstract":"Thermal management for wearable devices is evolving to make ubiquitous applications possible based on advanced devices featuring miniaturization, integration, and ultrathin designs. Thermal management and control integrated with wearable devices are highly desirable for various applications for human body monitoring, including external heat exposure and metabolic heat generation, in various activities. Recently, dynamic change materials have been integrated with micro/nano thermal management platforms to address the potential for active thermal management. In this article, recent advances in the architecture of effective thermal management in wearable devices are reviewed, along with the essential mechanisms for managing thermal conditions for users in external/internal thermal environments. Appropriate thermal management approaches are proposed for the design and integration of materials/structures tailored to specific targets in wearable devices. In particular, this review is devoted to materials/structures based on five thermal management strategies: conduction, radiation, evaporation/convection, heat absorption/release, and thermoelectric (TE). Finally, the challenges and prospects for practical applications of thermal management in wearable devices are discussed.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Challenges and progress of chemical modification in piezoelectric composites and their applications 压电复合材料化学改性及其应用的挑战与进展

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2022.33

Weiwei Zhang, Yanhu Zhang, Xiaodong Yan, Ying Hong, Zhengbao Yang

引用次数: 0

Reduced graphene oxide reinforced PDA-Gly-PVA composite hydrogel as strain sensors for monitoring human motion 还原氧化石墨烯增强PDA-Gly-PVA复合水凝胶作为监测人体运动的应变传感器

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.14

Xiaoling Ke, Xiaojiang Mu, Siyi Chen, Zhixiang Zhang, Jianhua Zhou, Yulian Chen, Jie Gao, Jing Liu, Xiaoyang Wang, Chuanguo Ma, Lei Miao

{"title":"Reduced graphene oxide reinforced PDA-Gly-PVA composite hydrogel as strain sensors for monitoring human motion","authors":"Xiaoling Ke, Xiaojiang Mu, Siyi Chen, Zhixiang Zhang, Jianhua Zhou, Yulian Chen, Jie Gao, Jing Liu, Xiaoyang Wang, Chuanguo Ma, Lei Miao","doi":"10.20517/ss.2023.14","DOIUrl":"https://doi.org/10.20517/ss.2023.14","url":null,"abstract":"Hydrogels with soft, skin-friendly properties and high biocompatibility are promising alternatives to traditional sensors. However, balancing electrical conductivity and sensitivity remains a significant challenge. The sensitivity-improved strain sensor was designed by reduced graphene oxide (rGO) reinforced polydopamine (PDA)-glycerol (Gly)-polyvinyl alcohol composite hydrogels (PGPHs). The hydrogels exhibited excellent sensing sensitivity with a gauge factor of 2.78, conductivity of 2.2 S/m, tensile deformation of 200%, fast response time of 370 ms, and recovery time of 260 ms, surpassing those of most previously reported hydrogel-based strain sensors. This improvement can be attributed to the high electrical conductivity and uniform distribution of the rGO associated with Gly and PDA. PGPHs also exhibited an attractive monitoring effect for hand movements and precise detection feedback for the slight dynamics of the pharynx. Hydrogel-based strain sensors have been demonstrated as a potentially sustainable solution for dynamic detection and communication.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Shape memory behaviors of 3D printed liquid crystal elastomers 3D打印液晶弹性体的形状记忆行为

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2022.28

引用次数: 1

Stretchable synaptic transistors based on the field effect for flexible neuromorphic electronics 柔性神经形态电子学中基于场效应的可拉伸突触晶体管

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.06

Xiumei Wang, Longqi Qi, Huihuang Yang, Yuan Rao, Huipeng Chen

{"title":"Stretchable synaptic transistors based on the field effect for flexible neuromorphic electronics","authors":"Xiumei Wang, Longqi Qi, Huihuang Yang, Yuan Rao, Huipeng Chen","doi":"10.20517/ss.2023.06","DOIUrl":"https://doi.org/10.20517/ss.2023.06","url":null,"abstract":"Using flexible neuromorphic electronics that emulate biological neuronal systems is an innovative approach for facilitating the implementation of next-generation artificial intelligence devices, including wearable computers, soft robotics devices, and neuroprosthetics. Stretchable synaptic transistors based on field-effect transistors (FETs), which have functions and structures resembling those of biological synapses, are promising technological devices in flexible neuromorphic electronics owing to their high flexibility, excellent biocompatibility, and easy processability. However, obtaining stretchable synaptic FETs with various synaptic characteristics and good stretching stabilities is challenging. Significant efforts to produce stretchable synaptic FETs have been undertaken; and remarkable advances in materials, fabrication processes, and applications have been achieved. From this perspective, we discuss the requirements for neuromorphic devices in flexible neuromorphic electronics and the advantages of stretchable synaptic FETs. Moreover, representative methods used to implement stretchable synaptic transistors, including the structural design and development of intrinsically stretchable devices, are introduced. Additionally, the application of stretchable synaptic transistors in artificial sensory systems such as light, tactile, and multisensory artificial nervous systems is also discussed. Finally, we highlight the possible challenges in implementing and using stretchable synaptic transistors, propose solutions to overcome the current limitations of these devices, and suggest future research directions.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Energy harvesting through thermoelectrics: topological designs and materials jetting technology 热电能量收集:拓扑设计和材料喷射技术

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2022.29

Danwei Zhang, Seng Ann Sia, Samantha Faye Duran, Jianwei Xu, A. Suwardi

{"title":"Energy harvesting through thermoelectrics: topological designs and materials jetting technology","authors":"Danwei Zhang, Seng Ann Sia, Samantha Faye Duran, Jianwei Xu, A. Suwardi","doi":"10.20517/ss.2022.29","DOIUrl":"https://doi.org/10.20517/ss.2022.29","url":null,"abstract":"The vast amount of waste heat released into the environment, from body heat to factories and boilers, can be exploited for electricity generation. Thermoelectrics is a sustainable clean energy solution that converts a heat flux directly into electrical power and vice versa and therefore has the potential for both energy harvesting and cooling technologies. However, the usage of thermoelectrics for large-scale applications is restrained by its device topologies and energy conversion cost efficiency trade-offs. The increase in complex topological designs reported in literature shows a shift towards customizability and improvement of thermoelectric devices for maximum energy conversion efficiency. Increasing design complexity will require an innovative, cost-effective fabrication method with design freedom capabilities. In light of this, this review paper seeks to summarize various thermoelectric topological designs as well as how 3D Printing technology can be a solution to the fabrication of cost-and performance-efficient thermoelectric devices. Specifically, as a process category of 3D Printing technology, Materials Jetting will be elaborated for its usefulness in the fabrication of thermoelectric devices. With in-depth research in materials jetting of thermoelectrics, the gap between small-scale materials research and scaled-up industry applications for energy harvesting through thermoelectric devices is expected to be bridged.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Applications of flexible and stretchable three-dimensional structures for soft electronics 柔性和可拉伸三维结构在软电子中的应用

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.07

Jang Hwan Kim, Su Eon Lee, Bong Hoon Kim

{"title":"Applications of flexible and stretchable three-dimensional structures for soft electronics","authors":"Jang Hwan Kim, Su Eon Lee, Bong Hoon Kim","doi":"10.20517/ss.2023.07","DOIUrl":"https://doi.org/10.20517/ss.2023.07","url":null,"abstract":"The development of devices that can be mechanically deformed in geometrical layouts, such as flexible/stretchable devices, is important for various applications. Conventional flexible/stretchable devices have been demonstrated using two-dimensional (2D) geometry, resulting in dimensional constraints on device operations and functionality limitations. Accordingly, expanding the dimensions in which such devices can operate and acquiring unique functionality that is difficult to implement in 2D planar structures remain challenging. As a solution, the development of a flexible/stretchable device embedding a three-dimensional (3D) structure fabricated through the precise control of a 2D structure or direct construction has been attracting significant attention. Because of a significant amount of effort, several 3D material systems with distinctive engineering properties, including electrical, optical, thermal, and mechanical properties, which are difficult to occur in nature or to obtain in usual 2D material systems, have been demonstrated. Furthermore, 3D advanced material systems with flexibility and stretchability can provide additional options for developing devices with various form factors. In this review, novel fabrication methods and unprecedented physical properties of flexible/stretchable 3D material systems are reviewed through multiple application cases. In addition, we summarized the latest advances and trends in innovative applications implemented through the introduction of advanced 3D systems in various fields, including microelectromechanical systems, optoelectronics, energy devices, biomedical devices, sensors, actuators, metamaterials, and microfluidic systems.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67660435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Recent advances in the design, fabrication, actuation mechanisms and applications of liquid crystal elastomers 液晶弹性体的设计、制造、驱动机构及应用的最新进展

Soft science Pub Date : 2023-01-01 DOI: 10.20517/ss.2023.03

Yue Xiao, Jun Wu, Yihui Zhang

引用次数: 1

A systematic review of fused deposition modeling process parameters 熔融沉积建模工艺参数的系统综述

Soft science Pub Date : 2022-01-01 DOI: 10.20517/ss.2022.08

N. N. Ahmad, Y. H. Wong, N. Ghazali

引用次数: 5