热电能量收集:拓扑设计和材料喷射技术

Soft science Pub Date : 2023-01-01 DOI:10.20517/ss.2022.29
Danwei Zhang, Seng Ann Sia, Samantha Faye Duran, Jianwei Xu, A. Suwardi
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引用次数: 1

摘要

从人体热量到工厂和锅炉释放到环境中的大量废热可以用于发电。热电是一种可持续的清洁能源解决方案,可以将热流直接转化为电能,反之亦然,因此在能量收集和冷却技术方面都有潜力。然而,热电在大规模应用中的使用受到其器件拓扑结构和能量转换成本效率权衡的限制。文献中报道的复杂拓扑设计的增加表明了向可定制性和改进热电器件以实现最大能量转换效率的转变。不断增加的设计复杂性将需要一种具有设计自由能力的创新、经济高效的制造方法。鉴于此,本文旨在总结各种热电拓扑设计,以及3D打印技术如何成为制造成本和性能高效的热电器件的解决方案。具体来说,作为3D打印技术的一个工艺类别,材料喷射将阐述其在热电器件制造中的实用性。随着热电材料喷射研究的深入,热电装置能量收集的小规模材料研究与大规模工业应用之间的差距有望弥合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Energy harvesting through thermoelectrics: topological designs and materials jetting technology
The vast amount of waste heat released into the environment, from body heat to factories and boilers, can be exploited for electricity generation. Thermoelectrics is a sustainable clean energy solution that converts a heat flux directly into electrical power and vice versa and therefore has the potential for both energy harvesting and cooling technologies. However, the usage of thermoelectrics for large-scale applications is restrained by its device topologies and energy conversion cost efficiency trade-offs. The increase in complex topological designs reported in literature shows a shift towards customizability and improvement of thermoelectric devices for maximum energy conversion efficiency. Increasing design complexity will require an innovative, cost-effective fabrication method with design freedom capabilities. In light of this, this review paper seeks to summarize various thermoelectric topological designs as well as how 3D Printing technology can be a solution to the fabrication of cost-and performance-efficient thermoelectric devices. Specifically, as a process category of 3D Printing technology, Materials Jetting will be elaborated for its usefulness in the fabrication of thermoelectric devices. With in-depth research in materials jetting of thermoelectrics, the gap between small-scale materials research and scaled-up industry applications for energy harvesting through thermoelectric devices is expected to be bridged.
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