柔性/可穿戴设备热管理的最新进展

Soft science Pub Date : 2023-01-01 DOI:10.20517/ss.2023.04
J. Yun
{"title":"柔性/可穿戴设备热管理的最新进展","authors":"J. Yun","doi":"10.20517/ss.2023.04","DOIUrl":null,"url":null,"abstract":"Thermal management for wearable devices is evolving to make ubiquitous applications possible based on advanced devices featuring miniaturization, integration, and ultrathin designs. Thermal management and control integrated with wearable devices are highly desirable for various applications for human body monitoring, including external heat exposure and metabolic heat generation, in various activities. Recently, dynamic change materials have been integrated with micro/nano thermal management platforms to address the potential for active thermal management. In this article, recent advances in the architecture of effective thermal management in wearable devices are reviewed, along with the essential mechanisms for managing thermal conditions for users in external/internal thermal environments. Appropriate thermal management approaches are proposed for the design and integration of materials/structures tailored to specific targets in wearable devices. In particular, this review is devoted to materials/structures based on five thermal management strategies: conduction, radiation, evaporation/convection, heat absorption/release, and thermoelectric (TE). Finally, the challenges and prospects for practical applications of thermal management in wearable devices are discussed.","PeriodicalId":74837,"journal":{"name":"Soft science","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Recent progress in thermal management for flexible/wearable devices\",\"authors\":\"J. Yun\",\"doi\":\"10.20517/ss.2023.04\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal management for wearable devices is evolving to make ubiquitous applications possible based on advanced devices featuring miniaturization, integration, and ultrathin designs. Thermal management and control integrated with wearable devices are highly desirable for various applications for human body monitoring, including external heat exposure and metabolic heat generation, in various activities. Recently, dynamic change materials have been integrated with micro/nano thermal management platforms to address the potential for active thermal management. In this article, recent advances in the architecture of effective thermal management in wearable devices are reviewed, along with the essential mechanisms for managing thermal conditions for users in external/internal thermal environments. Appropriate thermal management approaches are proposed for the design and integration of materials/structures tailored to specific targets in wearable devices. In particular, this review is devoted to materials/structures based on five thermal management strategies: conduction, radiation, evaporation/convection, heat absorption/release, and thermoelectric (TE). Finally, the challenges and prospects for practical applications of thermal management in wearable devices are discussed.\",\"PeriodicalId\":74837,\"journal\":{\"name\":\"Soft science\",\"volume\":\"1 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soft science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.20517/ss.2023.04\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soft science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.20517/ss.2023.04","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

基于小型化、集成化和超薄设计的先进设备,可穿戴设备的热管理正在不断发展,使无处不在的应用成为可能。与可穿戴设备集成的热管理和控制非常适合各种人体监测应用,包括各种活动中的外部热暴露和代谢热产生。最近,动态变化材料已与微/纳米热管理平台集成,以解决主动热管理的潜力。本文回顾了可穿戴设备中有效热管理架构的最新进展,以及在外部/内部热环境中管理用户热条件的基本机制。提出了适合可穿戴设备中特定目标的材料/结构的设计和集成的适当热管理方法。本文特别介绍了基于五种热管理策略的材料/结构:传导、辐射、蒸发/对流、热吸收/释放和热电(TE)。最后,讨论了热管理在可穿戴设备中的实际应用所面临的挑战和前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent progress in thermal management for flexible/wearable devices
Thermal management for wearable devices is evolving to make ubiquitous applications possible based on advanced devices featuring miniaturization, integration, and ultrathin designs. Thermal management and control integrated with wearable devices are highly desirable for various applications for human body monitoring, including external heat exposure and metabolic heat generation, in various activities. Recently, dynamic change materials have been integrated with micro/nano thermal management platforms to address the potential for active thermal management. In this article, recent advances in the architecture of effective thermal management in wearable devices are reviewed, along with the essential mechanisms for managing thermal conditions for users in external/internal thermal environments. Appropriate thermal management approaches are proposed for the design and integration of materials/structures tailored to specific targets in wearable devices. In particular, this review is devoted to materials/structures based on five thermal management strategies: conduction, radiation, evaporation/convection, heat absorption/release, and thermoelectric (TE). Finally, the challenges and prospects for practical applications of thermal management in wearable devices are discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
3.10
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信