2016 17th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第9页

Conductive property of inkjet printed film by reactive silver inks on PET flexible substrate 活性银油墨在PET柔性基板上喷墨印刷薄膜的导电性能

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583360

Xingming Tang, Hongbo Xu, Ximing Liu, Hongyun Zhao

{"title":"Conductive property of inkjet printed film by reactive silver inks on PET flexible substrate","authors":"Xingming Tang, Hongbo Xu, Ximing Liu, Hongyun Zhao","doi":"10.1109/ICEPT.2016.7583360","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583360","url":null,"abstract":"The particle-free silver conductive ink and the PET film were used as the reactive ink and the substrate respectively. During the printing process, a layer of ink drops would be printed. After that, the printed liquid drops were sintered in an oven to obtain a compact silver layer. Repeat the “printing and sintering” process to form a silver film by a layer-by-layer way. Silver film with several layers was characterized by SEM observation, EDS composition analysis and XRD phase analysis. The result showed that sintered compact of silver film was composed of homogeneously distributed nano-silver particles. The film resistivity was measured by the four-point probe method. The effects of the printed layer number on the film property and the resistivity of the silver sintered compact were studied. The results showed that the film property and the resistivity varied with the number of printed layers. When the number was up to 14, the electric conductivity reached its optimum value 4.8μΩ·cm, and the sintered compact of nano-silver covered 94.5% area of the PET substrate. In the final part of this work, a circuit including LED and printed wires were set up to demonstrate the conductivity of the printed flexible electronics under various conditions.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"69 1","pages":"1293-1296"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86158930","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures 焊料体积和回流工艺对LED照明元件和结构封装中Sn-0.3Ag-0.7Cu/6061Al焊点可焊性和可靠性的影响

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583302

Yuan-Jiang Lin, Min-bo Zhou, X. Ma, Xin-Ping Zhang

{"title":"Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures","authors":"Yuan-Jiang Lin, Min-bo Zhou, X. Ma, Xin-Ping Zhang","doi":"10.1109/ICEPT.2016.7583302","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583302","url":null,"abstract":"Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"71 1","pages":"1028-1032"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86943280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effects of nano-structured reinforcements on the recrystallizationand damage mode of of Sn-3.0Ag-0.5Cu solder joints 纳米结构增强剂对Sn-3.0Ag-0.5Cu焊点再结晶及损伤模式的影响

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583141

Penghao Gu, Jing Han, F. Guo

{"title":"Effects of nano-structured reinforcements on the recrystallizationand damage mode of of Sn-3.0Ag-0.5Cu solder joints","authors":"Penghao Gu, Jing Han, F. Guo","doi":"10.1109/ICEPT.2016.7583141","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583141","url":null,"abstract":"The research on lead-free solders has become the focus in electronic industry, conventional lead-free solder technology may not meet the increasingly severe service environment, so an attractive and potentially method to enhance the performance of a lead-free solder is to introduce reinforcements into a conventional alloy. This study employed polyhedral oligomeric silsesquioxanes (POSS) nano-particles as reinforcements for Sn3.5Ag0.5Cu (SAC) solder matrix. It was aimed at investigating the effect of POSS on the microstructure evolution and recrystallization behavior of ball grid array (BGA) solder joints under thermal fatigue. 3wt% POSS were incorporated into Sn3.5Ag0.5Cu (SAC) solder matrix by mechanical ball milling followed by reflow process, and found to be homogeneously dispersed into the solder matrix by EDX analysis. Then, two kinds of different components BGA assemblies were subjected to thermal cycling, and the surface morphology change and orientation evolution of solder joints before and after the thermal shock was respectively characterized by using SEM and EBSD. Experimental results revealed that the microstructure of solder matrix could be markedly refined with the addition of POSS, because of the reinforcements retarded the element diffusion and intermetallic compound aggregation. Vickers hardness has obviously improved, composite solder joint shows a better mechanical properties. After the thermal fatigue test of 928 cycles, at the interfaces extrusion deformation produced, the recrystallization accompanied with initiation and propagation of cracks in the BGA of SAC305 solder joint. But after the addition of nanoparticles, composite solder resulted in less grain boundaries in the same time, and it can prevent the appearance of recrystallization in solder.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"55 1","pages":"304-309"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87256978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects Ni/Sn-3.0Ag-0.5Cu/Cu焊料互连界面反应的交叉焊料相互作用

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583192

M. Fan, M. Huang, N. Zhao

引用次数: 0

Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings 单调和循环加载下含铅和无铅焊料的热粘塑性本构模型

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583084

X. Long, Bingjie Chen, Yao Yao

{"title":"Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings","authors":"X. Long, Bingjie Chen, Yao Yao","doi":"10.1109/ICEPT.2016.7583084","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583084","url":null,"abstract":"Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations are preferred compared with experimental studies. In the present study, a thermo-visco-plastic constitutive model is proposed for both lead-containing and lead-free solders under monotonic and cyclic loading conditions. Due to a simple formulation form and only a few parameters, the proposed thermo-visco-plastic constitutive model can be implemented into finite element software at minor effort and the determination of parameters can be achieved conveniently by regression to experimental data. The validations against experimental data show that the proposed model is capable of well simulating the tensile behavior of various solder materials at different strain rates and working temperatures. In addition, the required parameters in the proposed model are proved to be well defined as good changing patterns are achieved by revealing the intrinsic characteristic properties of solder material under various conditions.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"39 1","pages":"31-36"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85627097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Novel underfill material with low coefficient of thermal expansione 新型低热膨胀系数底填料

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583282

Baotan Zhang, Pengli Zhu, Gang Li, R. Sun, C. Wong

引用次数: 0

Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints Sn63Pb37焊点PBGA热疲劳可靠性分析

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583318

L. Huaicheng, An Tong, Bie Xiaorui, S. Ge, Q. Fei

引用次数: 8

The nonlinear voltage-current characteristics of three-phase SiC/CNTs/epoxy composite 三相SiC/CNTs/环氧复合材料的非线性电压电流特性

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583167

Wang Jian, Yanbin Shen, S. Luo, Wenhu Yang, Shuhui Yu, R. Sun, C. Wong

引用次数: 0

Effect of resin content on PCB warpage and anti-shock performance of BGA solder joint 树脂含量对BGA焊点PCB翘曲及抗冲击性能的影响

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583224

Ma Lili, C. Hang

引用次数: 0

Effect of electromigration on interfacial reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects 电迁移对Cu/Sn-9Zn/Cu和Cu/Sn-9Zn/Ni互连界面反应的影响

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583178

Q. Zhou, Q. Li, Y. Zhou, X. J. Wang, M. Huang

{"title":"Effect of electromigration on interfacial reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects","authors":"Q. Zhou, Q. Li, Y. Zhou, X. J. Wang, M. Huang","doi":"10.1109/ICEPT.2016.7583178","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583178","url":null,"abstract":"The interfacial reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects during electromigration (EM) were investigated under a current density of 5.0 × 103 A/cm2 at 150 °C. An obvious reverse polarity effect in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects during EM was demonstrated, i.e., the interfacial IMCs at the cathode grew continuously and were remarkably thicker than those at the anode. The formed IMC was always Cu5Zn8 at the cathode and anode interfaces during EM in Cu/Sn-9Zn/Ni interconnect. And a little Cu6Sn5 phase formed at the cathode interface after EM for 400h. When electrons flowed from the Cu side to the Ni side in Cu/Sn-9Zn/Ni interconnect, the (Ni,Cu)3(Sn,Zn)4 replaced Ni5Zn21 at the Ni/Sn-Zn interface, while the formed IMC was always Cu5Zn8 at Cu/Sn-Zn interface. More Zn atoms diffused toward Sn-9Zn/Cu interface (cathode) in Cu/Sn-9Zn/Ni interconnect during EM and the Cu5Zn8 layer at the cathode in Cu/Sn-9Zn/Cu interconnect is obviously thicker than that in Cu/Sn-9Zn/Ni interconnect during EM for 400h.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"29 1","pages":"473-476"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74795203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0