{"title":"焊料体积和回流工艺对LED照明元件和结构封装中Sn-0.3Ag-0.7Cu/6061Al焊点可焊性和可靠性的影响","authors":"Yuan-Jiang Lin, Min-bo Zhou, X. Ma, Xin-Ping Zhang","doi":"10.1109/ICEPT.2016.7583302","DOIUrl":null,"url":null,"abstract":"Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"71 1","pages":"1028-1032"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures\",\"authors\":\"Yuan-Jiang Lin, Min-bo Zhou, X. Ma, Xin-Ping Zhang\",\"doi\":\"10.1109/ICEPT.2016.7583302\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"71 1\",\"pages\":\"1028-1032\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583302\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583302","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures
Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance of the paste on 6061Al increases, and the tensile strength and shear strength of 6061Al/SAC0307/6061Al solder joints increase observably, which is due to the fact that the activity of the aluminum solder paste increases with the increase of heating rate in reflow process. However, the effects of peak soldering temperature on the solderability of the aluminum solder paste and the reliability of the soldered joints may be negligible. There is no intermetallic compound or transition layer formed at the interface. In addition, the shear strength of the joints increases with the increase of joint thickness because of the less voids formed in the solder matrix.
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