{"title":"Sn63Pb37焊点PBGA热疲劳可靠性分析","authors":"L. Huaicheng, An Tong, Bie Xiaorui, S. Ge, Q. Fei","doi":"10.1109/ICEPT.2016.7583318","DOIUrl":null,"url":null,"abstract":"Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"40 1","pages":"1104-1107"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints\",\"authors\":\"L. Huaicheng, An Tong, Bie Xiaorui, S. Ge, Q. Fei\",\"doi\":\"10.1109/ICEPT.2016.7583318\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"40 1\",\"pages\":\"1104-1107\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583318\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583318","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last.
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