2021 IEEE 21st International Conference on Nanotechnology (NANO)最新文献_第4页

Emerging Technology Solutions Towards REASSURED Point-of-Need Diagnostics 新兴技术解决方案，确保定点诊断

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514275

Suzanne Smith, K. Land, T. Joubert

引用次数: 2

The application of the plasmonic nanopaper in the optical-based sensing approaches 等离子体纳米纸在光学传感中的应用

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514314

Bentolhoda Heli, A. Ajji

引用次数: 0

Triboelectric nanogenerator based E-skin for wearable energy harvesting and pressure sensing 基于摩擦电纳米发电机的可穿戴能量收集和压力传感电子皮肤

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514293

Jiwon Park, Daeun Kim, Youn Tae Kim

{"title":"Triboelectric nanogenerator based E-skin for wearable energy harvesting and pressure sensing","authors":"Jiwon Park, Daeun Kim, Youn Tae Kim","doi":"10.1109/NANO51122.2021.9514293","DOIUrl":"https://doi.org/10.1109/NANO51122.2021.9514293","url":null,"abstract":"The market for wearable sensors is growing rapidly as interest in personal health has recently increased, and the Internet of Things (IoT) has developed. However, supplying power to wearable sensors, such as body-attached flexible devices and E-skin, is still a matter of concern. Herein, we report a triboelectric nanogenerator (TENG)-based E-skin that can harvest bio-friendly energy and self-powered pressure sensing with its own power source. Au-coated Cu yarn and polytetrafluoroethylene-molded micro-patterned polydimethylsiloxane were used to fabricate E-skin with excellent stability, high sensitivity, elasticity, and flexibility. The TENG-based E-skin generates an output peak voltage and current of up to 200 V and 2.7 µA, respectively, and is stable with 4,500 cycles of pushing motion without any deterioration of the output signal. In addition, it is possible to operate an electronic watch by charging a capacitor and measuring the arterial pulse of the wrist as a pressure sensor. The results of this study present potential solutions for power source and signal monitoring within soft/wearable devices and human-machine interfaces.","PeriodicalId":6791,"journal":{"name":"2021 IEEE 21st International Conference on Nanotechnology (NANO)","volume":"45 1","pages":"306-309"},"PeriodicalIF":0.0,"publicationDate":"2021-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84960133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

CNT/Epoxy-Masterbatch Based Nanocomposites: Thermal and Electrical Properties 碳纳米管/环氧树脂-母粒基纳米复合材料:热学和电学性能

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514322

H. Butt, M. Owais, A. Sulimov, D. Ostrizhiniy, S. Lomov, I. Akhatov, S. Abaimov, Y. Popov

{"title":"CNT/Epoxy-Masterbatch Based Nanocomposites: Thermal and Electrical Properties","authors":"H. Butt, M. Owais, A. Sulimov, D. Ostrizhiniy, S. Lomov, I. Akhatov, S. Abaimov, Y. Popov","doi":"10.1109/NANO51122.2021.9514322","DOIUrl":"https://doi.org/10.1109/NANO51122.2021.9514322","url":null,"abstract":"In this work, three masterbatches of carbon nanotubes (CNTs) were utilized to manufacture electrically and thermally conductive epoxy nanocomposites at three weight percentages using a scalable, economic processing route. Two masterbatches contained multi-wall carbon nanotubes (MWCNT) of similar aspect ratios while the third contained single-wall carbon nanotubes (SWCNTs) with a higher aspect ratio. Each masterbatch was produced industrially using a different processing technique. It was seen that the functional properties of the produced nanocomposites were directly tied to the particle dispersion and the masterbatch production route. For samples produced with better masterbatch production technology (SWCNTs), the dispersion degree was better compared to samples produced using less effective production techniques (MWCNTs). Electrical and thermal conductivity for SWCNT nanocomposites reached as high as 0.5 S/cm and 0.48 Wm−1 K−1 at 2.0% wt. respectively, whereas MWCNT samples showed values between 1.37×10−5 – 1.5×10−7 S/cm and 0.22 Wm−1 K−1 for electrical and thermal conductivity at the same weight percentage. SWCNT samples outperformed MWCNT samples by 4–6 orders of magnitude in terms of electrical conductivity and 4 times for thermal conductivity.","PeriodicalId":6791,"journal":{"name":"2021 IEEE 21st International Conference on Nanotechnology (NANO)","volume":"34 1","pages":"417-420"},"PeriodicalIF":0.0,"publicationDate":"2021-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84655601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Parameters guiding the self-assembly of quantum dots and DNA origami by peptide-PNA 多肽- pna诱导量子点自组装和DNA折纸的参数

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514331

Christopher M. Green, D. Hastman, Divita Mathur, K. Susumu, Igor L. Medintz, S. A. Díaz

引用次数: 0

Hybridization of Spin Decision Logics for Ising Machine with Logic Circuits 带有逻辑电路的伊辛机自旋决策逻辑的杂交

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514319

T. Miki, A. Yoshida, M. Shimada, J. Shirakashi

引用次数: 2

Probing Human Osteogenic Differentiation Using Double-Stranded Locked Nucleic Acid Biosensors 利用双链锁定核酸生物传感器探测人类成骨分化

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514340

Yuwen Zhao, Rui Yang, Zoe Bousraou, Shue Wang

引用次数: 3

The contributions of nanowires and nanowire-nanowire junctions in chemiresistors based on metal oxide nanowire networks 基于金属氧化物纳米线网络的化学电阻器中纳米线和纳米线-纳米线结的贡献

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514316

A. Ponzoni

引用次数: 0

Molecular Beam Epitaxy of AlGaN Nanowires for Ultraviolet Light Emitting 紫外光发射用AlGaN纳米线的分子束外延

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514283

S. Zhao, J. Lu, Y. Zhong

引用次数: 0

Next-generation Packaging Enabled by an Engineered Copper Nanomaterial 由工程铜纳米材料实现的下一代封装

2021 IEEE 21st International Conference on Nanotechnology (NANO) Pub Date : 2021-07-28 DOI: 10.1109/NANO51122.2021.9514346

R. Stoltenberg, Alexander Capanzana, Agustin Vega, Nhi T. Ngo, Reynaldo Joven, Lian Zhenggang, C. Gan, Y. Lam, A. Zinn

{"title":"Next-generation Packaging Enabled by an Engineered Copper Nanomaterial","authors":"R. Stoltenberg, Alexander Capanzana, Agustin Vega, Nhi T. Ngo, Reynaldo Joven, Lian Zhenggang, C. Gan, Y. Lam, A. Zinn","doi":"10.1109/NANO51122.2021.9514346","DOIUrl":"https://doi.org/10.1109/NANO51122.2021.9514346","url":null,"abstract":"Current and next-generation high power devices require a new set of materials with higher electrical and thermal conductivity to efficiently spread and remove increased waste heat. Kuprion's ActiveCopper technology enables the formation of bulk copper joints at typical soldering temperatures, yet the resulting interconnects are stable up to 500°C or more. This technology has been developed for a number of applications including die attach, thermal vias, and a replacement for WCu heat spreaders. Die attach materials can be dispensed, screened, or stenciled like traditional solder pastes followed by a solder-like thermal profile in a reflow oven under an inert atmosphere. Sintering can be achieved with or without pressure. Thermal vias are generated by stenciling an ActiveCopper paste directly into open circuit board cavities up to 4 mm in diameter followed by hot pressing under conditions similar to those used for traditional PCB manufacture. The resulting copper vias have thermal conductivity up to 330 W/mK, are solder compatible with or without further surface finish, and show excellent bonding to electroplated copper on the via sidewalls. Near net shape heat spreaders akin to WCu or AlSiC can also be generated via hot pressing or injection molding. The CTE of vias and spreaders can be tuned by adjusting the formulation of the original paste. ActiveCopper technology enables the design of all-Copper systems that can handle the increased thermal demands of next-generation electronics while avoiding failure modes attributed to intermetallic formation. Copper also presents an advantage over silver-based systems which show increased migration, dendritic growth, and voiding under higher thermal and electrical loads.","PeriodicalId":6791,"journal":{"name":"2021 IEEE 21st International Conference on Nanotechnology (NANO)","volume":"30 1","pages":"295-298"},"PeriodicalIF":0.0,"publicationDate":"2021-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85169975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0