2019 42nd International Spring Seminar on Electronics Technology (ISSE)最新文献_第8页

Investigating the Effect of Viscosity Models on the Stencil Printing by Numerical Modelling 用数值模拟方法研究黏度模型对模版印刷的影响

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810210

O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek

{"title":"Investigating the Effect of Viscosity Models on the Stencil Printing by Numerical Modelling","authors":"O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek","doi":"10.1109/ISSE.2019.8810210","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810210","url":null,"abstract":"In this paper, the effect of different viscosity models on the numerical results of stencil printing modelling was addressed. The numerical model was established by defining the geometry of the printing squeegee, the stencil, and the shape of the rolling solder paste. The squeegee had a 53° attack angle, which was determined by prior measurements, and the blade height was 20 mm. The output parameters of the model included the shear rate distribution and velocity field within the rolling solder paste, and the pressure profile on the stencil. The material properties of the solder paste were set by measuring the rheological behaviour of Type3 (particle size: 20–45μm), Type4 (particle size: 20–38 μm), Type5 (particle size: 15–25 μm)solder pastes and by fitting viscosity models onto the measurement results. Two different material models were compared, the Cross and the Carreau-Yasuda models, where the effect of the different models on the numerical results was evaluated The results showed a significant difference in the pressure during stencil printing between the cases using the viscosity of solder pastes in initial state (Cross model)and in steady state (Carreu-Yasuda model). The difference was about 25% in the case of Type-3, Type-4, and Type-5 solder pastes respectively. These differences proved that appropriate material models should be used in the numerical models of the stencil printing, to be able to apply that in early-stage prediction in the concept of Industry 4.0.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"17 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85257300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Cost Optimization and Day-Ahead Scheduling for a Renewable Energy Microgrid 可再生能源微电网的成本优化与日前调度

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810290

A. Ignat, D. Petreus, E. Lazar

引用次数: 3

Real-Time System with Integrated PID Algorithm Used for DC Motor Control 实时系统集成PID算法用于直流电机控制

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810310

M. Taut, G. Chindris, D. Pitica

引用次数: 0

Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering 气相焊接过程中印刷电路板内部热分布的解析解

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810286

Dániel Straubinger, I. Bozsóki, B. Illés, A. Géczy

引用次数: 1

Early Stage Whisker Development from Sn Thin Film on Cu Substrate Cu衬底上Sn薄膜早期晶须的形成

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810272

B. Illés, T. Hurtony, O. Krammer, R. Bátorfi, B. Medgyes, G. Harsányi

{"title":"Early Stage Whisker Development from Sn Thin Film on Cu Substrate","authors":"B. Illés, T. Hurtony, O. Krammer, R. Bátorfi, B. Medgyes, G. Harsányi","doi":"10.1109/ISSE.2019.8810272","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810272","url":null,"abstract":"The Sn thin film on Cu substrate has high Sn whisker growth susceptibility because of the intensive Cu6Sn5 intermetallic formation at the Sn-Cu interface. In this study, the whisker development on vacuum evaporated Sn thin film deposited on Cu substrates was investigated, starting directly from the Sn deposition. The aim was to obtain more information about the whiskering behavior of Sn thin film in the early stage of the life cycle. For the study, 99.99% pure tin was vacuum evaporated onto Cu substrates. Two different Cu substrates were applied with different surface roughness to investigate the effect of surface roughness on the whisker development. The average thickness of the evaporated Sn layer was ~2 μ m. Samples were stored at room temperature for 10 weeks. Whisker development was observed by scanning electron microscope. It was found that the large compressive stress in the Sn layer because of the intermetallic formation initiates the whisker development even after 1 day of the Sn layer deposition. Almost only filament type whiskers were detected. The characteristics of the whisker density showed exponential saturation up to 10 days of the study, while the length of the whiskers was growing further still the end of the study. It was also found that the surface roughness of the Cu substrate affects the rate of whisker growth.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"9 35","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91508045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Sheet Resistance Measurement of Inkjet Printed Layers 喷墨印刷层的片材电阻测量

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810284

E. Gieva, G. Nikolov, B. Nikolova

引用次数: 8

Data Acquisition System for Solar Panels 太阳能板数据采集系统

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810289

Vladimir Voicu, D. Petreus, R. Etz

{"title":"Data Acquisition System for Solar Panels","authors":"Vladimir Voicu, D. Petreus, R. Etz","doi":"10.1109/ISSE.2019.8810289","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810289","url":null,"abstract":"PV plants require monitoring to determine their performance ratio which is observed over time. Before constructing a solar energy system, it is important to know in advance how much energy such a project could potentially harvest from the sun and to identify the sources of losses which usually are pollution, cloudiness, and heat. For this reason it is essential to consider the solar irradiance. This paper describes the design and implementation of a data acquisition system used to determine the Global Horizontal Irradiance (GHI). It also uses and open-source clear sky model to estimate if the full potential of the solar energy is harvested on cloud free days. The necessary data travels with the aid of a Raspberry Pi from the pyranometer to a virtual machine hosted in the university. This VM uses a suite of available open-source solutions through its application of visualization, monitoring and analysis software. The collected solar radiation values from the pyranometer are cross referenced with the ones obtained from the solar radiation prediction model. This monitoring and analysis system is integrated alongside a PV plant to determine the performance of the energy harvested from the solar panels.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"70 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86312549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

White Light AC Electroluminescent Displays 白光交流电致发光显示器

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810240

Michal Hrabal, I. Zhivkov, Patrícia Guricová, G. Dobrikov, R. Yordanov, M. Vala

{"title":"White Light AC Electroluminescent Displays","authors":"Michal Hrabal, I. Zhivkov, Patrícia Guricová, G. Dobrikov, R. Yordanov, M. Vala","doi":"10.1109/ISSE.2019.8810240","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810240","url":null,"abstract":"Alternating Current Electroluminescence (ACEL)was measured in orange and blue phosphors and a mixture of them in a ratio of 2: 1. The phosphor, dielectric and top silver electrodes were prepared by screen printing. Nowadays ACEL is presented on the market as the only technique for quick and easy preparation of large area, low cost electroluminescent panels by the means of material printing. From the optical microscope images, we could conclude that the radiation of blue phosphor dominates over the orange one. These results are confirmed in the absolute irradiance spectra. Moreover, using samples, based on phosphor stripes leads to a decrease of the total irradiance, but, on the other hand, the uniformity of the emitted EL light is improved. Printing of striped active layer is preferred from the point of view of achieving more uniformly distributed light. The summarized fitting parameters show that driving frequency around 300 Hz will produce white light with reasonable intensity and with values of x, y coordinates higher than 0.31. The somewhat lower intensity of the emitted light can be improved by setting higher driving AC voltage. The voltage tested in this work was set to be constant at 250 Vpp.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"92 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79551813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Measuring Component Self-Alignment by Automatic Image Processing Method 自动图像处理方法测量元件自对准

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810280

P. Martinek, B. Villányi, O. Krammer

{"title":"Measuring Component Self-Alignment by Automatic Image Processing Method","authors":"P. Martinek, B. Villányi, O. Krammer","doi":"10.1109/ISSE.2019.8810280","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810280","url":null,"abstract":"A method was developed for detecting the position of electronics components automatically before and after reflow soldering, allowing the analysis of component self-alignment. The method is based on image processing techniques like filtering, pattern recognition and particle swarm analysis. In the experiment, an FR4 based testboard was designed, which allows the measurement of component placement offsets by utilizing registration marks (fiducial points). Chip resistors (0603 size $-1.5times 0.75 {mm})$ were placed onto the testboard with intentional component misplacement in × (0–800 μ m) and in y $({0-300} mu m)$ direction. The position of the components of a test set was measured both before and after soldering, and the image processing method was customized based on the difference found between manual and automatic evaluation. Results showed that image processing techniques can successfully be applied to automatically evaluate component self-alignment. The error of the automatic position detection is only 10–15 μ m in average which means only a mistake of a 3–4 pixels during the image processing. The deviation of the error was also in the acceptable range taking also into account that results were validated against our former data created by manual evaluation of the exact positions.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"61 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81451049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Methods for Reusing Li-Ion Cells from Discarded Battery Packs 废弃电池组中锂离子电池的再利用方法

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810304

Adelina Ioana Ilieş, I. Ciascai, D. Pitica

引用次数: 2