Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering

Abstract

Vapour Phase Soldering (VPS)is a reflow soldering method, which is under investigation from many aspects, due to its unique heat transfer mechanism: condensation-based heating. To maintain and improve the quality of the solder joints the heat transient and distribution of a given assembly must be known paramters. In this paper, one dimensional modelling of heat distribution within the thickness of a Printed Circuit Board (PCB)is investigated. Heat transient is calculated for the VPS process at different positions within the PCB. The results are calculated in the confines of VPS, where heat transfer occurs on both sides of the PCB due to the occurring filmwise condensation. The results present information about temperature distribution along the thickness of the PCB in the time domain. This data can be incorporated into more complex simulation approaches and profile predicting algorithms for better temperature control.