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2015 IEEE Hot Chips 27 Symposium (HCS)最新文献

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10G | 5G | 2.5G | 1G | 100M physical layer PHY: HOT CHIPS 2015 conference 10G | 5G | 2.5G | 1G | 100M物理层PHY: HOT CHIPS 2015大会
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477466
R. Shirani, R. Farjad-Rad
{"title":"10G | 5G | 2.5G | 1G | 100M physical layer PHY: HOT CHIPS 2015 conference","authors":"R. Shirani, R. Farjad-Rad","doi":"10.1109/HOTCHIPS.2015.7477466","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477466","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. The ever growing data requirements in the cloud and mobility are creating a bandwidth constraint in global IT infrastructure. In 2012, Aquantia focused on adding 2.5G/5G speeds on Cat5e/Cat6 Links to address the next generation wireless access bottleneck. Aquantia's five speed ICs (single, dual, and quad) are the only commercially available NBASE-T compliant ICs since 2013. Five speed ICs from Aquantia has been shipping in large volumes in all major switch and AP platforms since 2014.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"34 1","pages":"1-27"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85045484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design of a low power SoC testchip for wearables and IoTs 可穿戴设备和物联网的低功耗SoC测试芯片设计
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477326
May Wu, R. Iyer, Y. Hoskote, Steven Zhang, J. Zamora-Esquivel, German Fabila Garcia, Ilya V. Klotchkov, Mukesh Bhartiya
{"title":"Design of a low power SoC testchip for wearables and IoTs","authors":"May Wu, R. Iyer, Y. Hoskote, Steven Zhang, J. Zamora-Esquivel, German Fabila Garcia, Ilya V. Klotchkov, Mukesh Bhartiya","doi":"10.1109/HOTCHIPS.2015.7477326","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477326","url":null,"abstract":"","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"30 1","pages":"1-27"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90920183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Implementing software defined radio on the paralella 在并行上实现软件定义无线电
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477323
A. Olofsson
{"title":"Implementing software defined radio on the paralella","authors":"A. Olofsson","doi":"10.1109/HOTCHIPS.2015.7477323","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477323","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation. What is Software Defined Radio? (SDR) \"Radio in which some or all of the physical layer functions are software defined\" -- Wireless Innovation Forum.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"36 1","pages":"1-32"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86788562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Raven: A 28nm RISC-V vector processor with integrated switched-capacitor DC-DC converters and adaptive clocking Raven: 28纳米RISC-V矢量处理器，集成开关电容DC-DC转换器和自适应时钟
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477469
Yunsup Lee, B. Zimmer, Andrew Waterman, A. Puggelli, Jaehwa Kwak, R. Jevtic, Ben Keller, Stevo Bailey, Milovan Blagojevic, P. Chiu, Henry Cook, Rimas Avizienis, B. Richards, E. Alon, B. Nikolić, K. Asanović
{"title":"Raven: A 28nm RISC-V vector processor with integrated switched-capacitor DC-DC converters and adaptive clocking","authors":"Yunsup Lee, B. Zimmer, Andrew Waterman, A. Puggelli, Jaehwa Kwak, R. Jevtic, Ben Keller, Stevo Bailey, Milovan Blagojevic, P. Chiu, Henry Cook, Rimas Avizienis, B. Richards, E. Alon, B. Nikolić, K. Asanović","doi":"10.1109/HOTCHIPS.2015.7477469","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477469","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. The topics discussed included: Motivation/Raven Project Goals; On-Chip Switched Capacitor DC-DC Converters; Raven3 Chip Architecture; Raven3 Implementation; Raven3 Evaluation; and RISC-V Chip Building at UC Berkeley.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"27 1","pages":"1-45"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85342540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Ultra-low power wireless SoCs enabling a batteryless IoT 超低功耗无线soc，实现无电池物联网
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477327
B. Calhoun, D. Wentzloff
{"title":"Ultra-low power wireless SoCs enabling a batteryless IoT","authors":"B. Calhoun, D. Wentzloff","doi":"10.1109/HOTCHIPS.2015.7477327","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477327","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. One Trillion IoT devices can ONLY happen WITHOUT batteries.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"57 1","pages":"1-45"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77905139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A low-power and real-time augmented reality processor for the next generation smart glasses 用于下一代智能眼镜的低功耗实时增强现实处理器
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477476
Gyeonghoon Kim, H. Yoo
{"title":"A low-power and real-time augmented reality processor for the next generation smart glasses","authors":"Gyeonghoon Kim, H. Yoo","doi":"10.1109/HOTCHIPS.2015.7477476","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477476","url":null,"abstract":"This article consists of a single slide from the authors' conference presentation. Topics covered include: hardware requirements of augmented reality in smart glasses systems; algorithm-hardware mapping and network congestion problem; neural network scheduler for 2-D-mesh network-on-chip; and chip and smart glass system implementation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84053351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ultra-low-light CMOS biosensor helps tackle infectious diseases 超低光CMOS生物传感器有助于应对传染病
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477465
Zhimin Ding
{"title":"Ultra-low-light CMOS biosensor helps tackle infectious diseases","authors":"Zhimin Ding","doi":"10.1109/HOTCHIPS.2015.7477465","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477465","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation. Summary: Ultra-low-light CMOS biosensor enables compact and low-cost instrumentation for point-of-care molecular diagnostics. Future plan: 1. Further miniaturization of opto system - Smaller camera system for mobile integration - Direct coating and patterning of thin film filters on chip to achieve truly single chip multi-channel fluorescent imaging; 2. Create high speed variation of the chip - Targeting cell sorting and cancer screening application; 3. Further refinement of integrated opto-thermal-fluidic system platform - For handheld sample-to-answer MDx system.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"64 1","pages":"1-23"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74321008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Knights landing (KNL): 2nd Generation Intel® Xeon Phi processor 骑士登陆(KNL):第二代英特尔®Xeon Phi处理器
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477467
Avinash Sodani
{"title":"Knights landing (KNL): 2nd Generation Intel® Xeon Phi processor","authors":"Avinash Sodani","doi":"10.1109/HOTCHIPS.2015.7477467","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477467","url":null,"abstract":"","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"26 1","pages":"1-24"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81075481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 260
Flexible video processing platform for 8K UHD TV 灵活的8K超高清电视视频处理平台
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477475
Suk-Jeong Kim, Young-Hwan Park, Jaehyun Kim, Minsoo Kim, Wonchang Lee, Shihwa Lee
{"title":"Flexible video processing platform for 8K UHD TV","authors":"Suk-Jeong Kim, Young-Hwan Park, Jaehyun Kim, Minsoo Kim, Wonchang Lee, Shihwa Lee","doi":"10.1109/HOTCHIPS.2015.7477475","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477475","url":null,"abstract":"This article consists of one slide from the authors' conference presentation. The Samsung Reconfigurable Processor is Samsung's proprietary DSP processor since 2005.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"46 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79504203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
AMD's next generation GPU and high bandwidth memory architecture: FURY AMD的下一代GPU和高带宽内存架构:FURY
2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI: 10.1109/HOTCHIPS.2015.7477461
Joe Macri
{"title":"AMD's next generation GPU and high bandwidth memory architecture: FURY","authors":"Joe Macri","doi":"10.1109/HOTCHIPS.2015.7477461","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477461","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Overview of AMD Radeon R9 Fury; Why HBM and Die Stacking; The Journey to Fury; Performance; Form Factor Innovation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"15 1","pages":"1-26"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72897475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 67
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