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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)最新文献

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Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing 具有多层气隙和三金属绝缘体-金属电容器的低k互连堆栈，适用于14nm大批量生产
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI: 10.1109/IITC-MAM.2015.7325600
K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, S. Natarajan
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引用次数: 42
Fabrication, assembly, failure estimations of for ultra-thin chips stacking by using pre-molding technology 采用预成型技术的超薄芯片堆垛制造、装配及失效评估
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI: 10.1109/IITC-MAM.2015.7325659
Chang-Chun Lee, Yu-Min Lin, Yan-Yu Liou, C. Zhan, Tao-Chih Chang
{"title":"Fabrication, assembly, failure estimations of for ultra-thin chips stacking by using pre-molding technology","authors":"Chang-Chun Lee, Yu-Min Lin, Yan-Yu Liou, C. Zhan, Tao-Chih Chang","doi":"10.1109/IITC-MAM.2015.7325659","DOIUrl":"https://doi.org/10.1109/IITC-MAM.2015.7325659","url":null,"abstract":"To overcome the severe challenges of achieving an extra-thin thickness down to 10 μm for chip stacking of 3D-IC module such as the mechanical damages appear at chip grinding, subsequent steps of wafer handling, and robust assembly, a novel pre-molding technology applied to assembled stacked module prior to chip thinning procedure is presented in this study. Packaging vehicle is fabricated to demonstrate the feasibility of proposed approach. Moreover, failure estimation and mechanical reliability are also implemented by using a 3D nonlinear finite element analysis.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"74 1","pages":"237-240"},"PeriodicalIF":0.0,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89205174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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