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2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.最新文献

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Applications of FSV to EMC and SI data FSV在电磁兼容和SI数据中的应用
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513514
G. Antonini, A. Scogna, A. Orlandi, C. Ritona, A. Duffy
{"title":"Applications of FSV to EMC and SI data","authors":"G. Antonini, A. Scogna, A. Orlandi, C. Ritona, A. Duffy","doi":"10.1109/ISEMC.2005.1513514","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513514","url":null,"abstract":"This paper is concerned with the usability of the feature selective validation (FSV) method for comparing validation data. It addresses how it can help in the validation process and how the resulting validation data can be interpreted. It does this by considering two different case studies. The first considers two approaches to modeling electric fields in an equipment rack, and the second compares a Spice model for coupled circuit boards with a reference full wave model. The paper concludes that while the single value summary metrics are helpful to give an overall level of agreement, the detailed point-by-point information is very helpful when considering how to improve the models or measurements involved.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"22 1","pages":"278-283 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74733681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Lightning strikes to elevated structures: influence grounding conditions on currents and electromagnetic fields 雷击对高架结构的影响:电流和电磁场的接地条件
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513543
E. Petrache, F. Rachidi, D. Pavanello, W. Janischewskyj, A. Hussein, M. Rubinstein, V. Shostak, W. Chisholm, J. Chang
{"title":"Lightning strikes to elevated structures: influence grounding conditions on currents and electromagnetic fields","authors":"E. Petrache, F. Rachidi, D. Pavanello, W. Janischewskyj, A. Hussein, M. Rubinstein, V. Shostak, W. Chisholm, J. Chang","doi":"10.1109/ISEMC.2005.1513543","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513543","url":null,"abstract":"This paper presents an analysis of lightning return strokes to tall structures. The interaction of lightning with a tall structure is modeled using the antenna theory. The finite ground conductivity as well as the buried grounding system of the tall structure are taken into account in the analysis. It is shown that the current waveform, in sections of the tower close to ground, is somewhat affected by a finite ground conductivity. However, for sections further up the tower, it is not significantly influenced. Furthermore, our simulations show that some fine structure associated with current waveforms measured on the Toronto CN tower can be attributed to the finite ground conductivity. It is also shown that the current path down the tower structure is notably subjected to the skin effect. The current distribution along the buried grounding structure of the tower is also presented, illustrating the dispersion effect as a function of the ground conductivity. Finally, the lightning return-stroke generated electric and magnetic fields computed at a distance of 2 km from the tower are presented. It is shown that some late-time subsidiary peaks are smoothed out by the effect of the propagation along a finitely-conducting ground.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"33 1","pages":"377-381 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77758655","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 33
Development of a magnetic field measurement system using a tri-axial search coil 三轴搜索线圈磁场测量系统的研制
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513482
T. Tosaka, I. Nagano, S. Yagitani
{"title":"Development of a magnetic field measurement system using a tri-axial search coil","authors":"T. Tosaka, I. Nagano, S. Yagitani","doi":"10.1109/ISEMC.2005.1513482","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513482","url":null,"abstract":"In order to measure the magnetic field noise around electric devices, we developed a measurement system using a tri-axial search coil. The crosstalk of the orthogonal search coils is less than -40 dB between the tri-axial search coil sensors. The measured magnetic sensitivity of the search coil is 10 pT//spl radic/Hz at 1 kHz.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"423 1","pages":"102-106 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76744835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Effective use of EMC analysis tools in the automotive product development process 在汽车产品开发过程中有效使用EMC分析工具
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513623
S. Mee, S. Ranganathan, R. Taylor
{"title":"Effective use of EMC analysis tools in the automotive product development process","authors":"S. Mee, S. Ranganathan, R. Taylor","doi":"10.1109/ISEMC.2005.1513623","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513623","url":null,"abstract":"The pressures of today's markets cause suppliers of automotive electronics to find better ways of developing products. The use of analysis is a highly effective way to bring compliant product to the market place, en time. A workflow is proposed to guide an engineering team through the arduous task of developing a product with often fewer resources and time available than ever before. Predictive analysis provides the ability to create 'virtual' board iterations, saving tune, and costs of development. Additionally, analysis is effective at creating product 'blueprints' and making them available for later design re-use.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"96 1","pages":"744-749 Vol. 3"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77927216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Specifying lifecycle electromagnetic and physical environments - to help design and test for EMC for functional safety 指定生命周期电磁和物理环境-帮助设计和测试功能安全的EMC
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513565
K. Armstrong
{"title":"Specifying lifecycle electromagnetic and physical environments - to help design and test for EMC for functional safety","authors":"K. Armstrong","doi":"10.1109/ISEMC.2005.1513565","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513565","url":null,"abstract":"Certain kinds of equipment must maintain sufficiently low risks to users and third parties over their entire lifecycles, despite at least one fault, and despite foreseeable misuse. Where electromagnetic interference (EMI) could foreseeably have an effect on such equipment, it will need to maintain an adequate level of electromagnetic (EM) immunity over its lifecycle. This is the concern of 'EMC for functional safety'. The EM environment that such equipment could experience over its whole lifecycle can be very different from that tested by standard immunity tests used for EMC compliance. IEMI Intentional EMI - could also be an issue. The physical and climatic environments, plus the wear and tear and misuse that such equipment is subjected to over its lifecycle can cause circuit EM behavior to alter, and can degrade the performance of EM mitigation measures. This paper outlines an approach to specifying the \"lifecycle environment\" for such equipment, as an aid to safe design and appropriate verification testing. Although this paper focuses on safety concerns, the lifecycle EM and physical environment issues discussed here are also important for high-reliability, mission-critical and legal metrology equipment, to help control financial or security risks. Designing and testing to achieve adequate EMC for functional safety will be covered in future papers.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"61 32 1","pages":"495-500 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77369336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Numericlal study of a PIFA mounted on a car compared to measurements 安装在汽车上的PIFA的数值研究与测量比较
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513649
P. Ankarson, J. Carlsson, Yueqiang Liu
{"title":"Numericlal study of a PIFA mounted on a car compared to measurements","authors":"P. Ankarson, J. Carlsson, Yueqiang Liu","doi":"10.1109/ISEMC.2005.1513649","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513649","url":null,"abstract":"The influence of a car structure on the radiation pattern from a dual band planar inverted F-antenna (PIFA) resonant in the 900 and 1800 mobile communication bands has been studied. Numerical simulations using FDTD, FIT and a combination of FEM-FDTD have been used for analyzing the PIFA mounted on a car as well as mounted on infinite and finite sized ground planes. The computed return loss and gain patterns have been compared with measurements for a fabricated PIFA. The results show that the car structure has a large impact on the gain pattern. The achieved agreement between computed and measured gain shows that FIIM-FDTD and FIT programs are suitable for analyzing small and complicated antennas placed on much larger structures, such as a car.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"15 1","pages":"878-882 Vol. 3"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76277273","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis 利用频域和时域分析了去耦电容距离对印刷电路板的影响
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513594
B. Archambeault, S. Connor
{"title":"The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis","authors":"B. Archambeault, S. Connor","doi":"10.1109/ISEMC.2005.1513594","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513594","url":null,"abstract":"This paper demonstrates the effect of decoupling capacitor distance on the amount of EMI noise created at an IC's power pin. As the distance is increased, the amplitude of the noise is increased if the capacitor has been attached to the printed circuit board (PCB) with a low inductance connection. This effect is most apparent when the dielectric thickness of the PCB is greater. Furthermore, this paper demonstrates the need to do this type of analysis in the time domain and not the frequency domain","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"165 1","pages":"650-654"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76934638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 29
A system level enclosure (chassis) resonance evaluation methodology and its applications 系统级机箱(机箱)共振评价方法及其应用
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513499
Jin Zhao
{"title":"A system level enclosure (chassis) resonance evaluation methodology and its applications","authors":"Jin Zhao","doi":"10.1109/ISEMC.2005.1513499","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513499","url":null,"abstract":"This paper presents a methodology of evaluating the resonance inside an enclosure which is caused by the resonance of the printed circuit board (PCB) installed inside the chassis. The radiation emitted from the slots on the surface of the enclosure can also be calculated. The paper demonstrates the elimination of such enclosure resonance by placing decoupling capacitors on board to remove the PCB resonance. As a consequence, the radiation from those slots on the enclosure surface is reduced also. The methodology presented here is useful in system level EMC control. The paper also illustrates that power delivery system design is closely related to system level EMC control.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"12 1","pages":"195-199 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82887211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Improving the behavior of PCB power-bus structures by an appropriate segmentation 通过适当的分段改善PCB电源总线结构的性能
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513664
M. Hampe, S. Dickmann
{"title":"Improving the behavior of PCB power-bus structures by an appropriate segmentation","authors":"M. Hampe, S. Dickmann","doi":"10.1109/ISEMC.2005.1513664","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513664","url":null,"abstract":"An effective and cost efficient method for suppressing cavity mode resonances within the power-bus of high-speed printed circuit boards is presented. It is shown that resonant modes can be completely suppressed by segmenting the power-bus into rectangular parts of smaller dimensions and connecting these parts suitably. For the case of identically shaped segments a double summation expression of the resulting voltage distribution within each part is derived. Furthermore, the impact of different connections between the segments is investigated. The theoretical results are well confirmed by measurements.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"21 1","pages":"961-966 Vol. 3"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81043943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
The measurement of broad band over power line emissions 宽频带电力线发射的测量
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Pub Date : 2005-10-03 DOI: 10.1109/ISEMC.2005.1513669
L. Cohen, J. de Graaf, A. Light, F. Sabath
{"title":"The measurement of broad band over power line emissions","authors":"L. Cohen, J. de Graaf, A. Light, F. Sabath","doi":"10.1109/ISEMC.2005.1513669","DOIUrl":"https://doi.org/10.1109/ISEMC.2005.1513669","url":null,"abstract":"This paper is a report on measurements taken of broadband over power line (BPL) signals at two US test sites in October 2004. The investigation sought to: (1) discriminate between BPL emissions and power line noise in the near field; (2) determine the maximum level of magnetic field intensity levels (H FIELD) at a given distance in the near field and (3) utilizing the CONCEPT II method of moments routine develop a numerical electromagnetic model of the power line emission (H/sub y/ and E/sub x/ ) characteristics.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"2008 1","pages":"988-991 Vol. 3"},"PeriodicalIF":0.0,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82552708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
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