利用频域和时域分析了去耦电容距离对印刷电路板的影响

B. Archambeault, S. Connor
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引用次数: 29

摘要

本文演示了去耦电容距离对集成电路电源引脚处产生的EMI噪声量的影响。当距离增加时,如果电容器以低电感连接连接到印刷电路板(PCB)上,则噪声的幅度会增加。当PCB的介电厚度较大时,这种效应最为明显。此外,本文还论证了在时域而不是频域进行这类分析的必要性
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis
This paper demonstrates the effect of decoupling capacitor distance on the amount of EMI noise created at an IC's power pin. As the distance is increased, the amplitude of the noise is increased if the capacitor has been attached to the printed circuit board (PCB) with a low inductance connection. This effect is most apparent when the dielectric thickness of the PCB is greater. Furthermore, this paper demonstrates the need to do this type of analysis in the time domain and not the frequency domain
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