2011 International Symposium on Advanced Packaging Materials (APM)最新文献_第7页

Finite element simulation of thermal properties of 40Si-Al alloys for electronics packaging 电子封装用40Si-Al合金热性能的有限元模拟

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105729

Shen Wei, Pu Yu-ping, Zhao Peng, Zhu Li-ran

引用次数: 2

Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG pad after multiple reflows 多次回流后Sn-3.5Ag、Sn-3.0Ag-0.5Cu焊球与ENEPIG焊盘界面反应对比研究

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105717

F. Yang, L. Liu, M. Huang

{"title":"Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG pad after multiple reflows","authors":"F. Yang, L. Liu, M. Huang","doi":"10.1109/ISAPM.2011.6105717","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105717","url":null,"abstract":"Nowadays, with electronic products tending to become shorter, smaller, lighter, and thinner, solder balls used to join chips and substrates are also downsizing. This may have an adverse effect on the reliability of electronic products. The focus of this study is on the effect of solder volume on the interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu lead-free solder balls and electroless nickel electroless palladium immersion gold (ENEPIG) pads on printed circuit board (PCB) after various reflows. The diameters of solder balls were 200, 300, 400 and 500 μm, respectively. In the interfacial reaction between Sn-3.5Ag solder balls and ENEPIG pads, as the diameters of the solder balls changed, obvious changes in Ni3Sn4 intermetallic compound (IMC) morphologies and thickness were not found. We attribute this phenomenon to the limited Ni concentration in the solder. When a small amount of Cu was added into Sn-Ag lead-free solder, changes in type, morphology and growth kinetics of interfacial IMCs occurred. In the case of Sn-3.0Ag-0.5Cu/ENEPIG reaction, volume effect in the form of IMC type transition occurred. Only (Ni, Cu)3Sn4 IMCs with morphologies of needle and chunk shape were observed at the interface of 200 μm solder ball. Interestingly, chunk type (Ni, Cu)3Sn4 IMCs co-existed with the octahedron-type (Cu, Ni)6Sn5 IMCs at the interface between Ni-P layer and 300 μm solder ball. And in the case of 400 μm and 500 μm solder balls, only (Cu, Ni)6Sn5 IMCs in the needle-type shape were formed at the interface. This phenomenon was related to the absolute Cu content in the solder which was changed with solder volume.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"180 1","pages":"280-286"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76941118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Characterization of Al/Cu/W bond pad micro-corrosion Al/Cu/W焊盘微腐蚀的表征

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105706

G. Gong, Li Li, Wei Liu, M. Song, Xue-Song Xu, D.H. Ye, J. Yao

引用次数: 2

Annealing effect and crystallization characteristics of copper wire bonding on pre-plated leadframe 预镀引线框架上铜线键合的退火效果及结晶特性

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105727

B. An, L. Ding, Techun Wang, T. Lu, Yiping Wu

引用次数: 2

20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays 基于铁磁纳米线阵列的20ghz噪声抑制器

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105679

Yanqiu Li, Zheng Chen, Liangliang Li, J. Cai

{"title":"20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays","authors":"Yanqiu Li, Zheng Chen, Liangliang Li, J. Cai","doi":"10.1109/ISAPM.2011.6105679","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105679","url":null,"abstract":"The noise suppressors based on ferromagnetic nanowire arrays were fabricated on the anodic aluminum oxide templates (AAO), and the effects of the width and length of the device and the type of the ferromagnetic nanowire array on the microwave properties of the noise suppressor were investigated. The Co and Co-Ni magnetic nanowires with an average diameter of 200 nm and a length of 10 or 30 μm were electrodeposited in the AAO templates, and the ultrasonic vibration was utilized to promote ionic diffusion and to allow hydrogen to escape easily from the cathode. Scanning electron microscope images showed uniform ferromagnetic nanowires and the hysteresis loops demonstrated that these nanowire arrays had a strong magnetic anisotropy. The resonance frequency of S21 of the noise suppressors reached 25 GHz, indicating that the working frequency of the devices was beyond 20 GHz. The synthetic method of the ferromagnetic nanowires and the fabrication processes of the devices in this work could be applied to other microwave devices such as isolators and circulators. Key words: noise suppressor, S-parameter, ferromagnetic nanowires","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"48 1","pages":"94-98"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82177703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Photoluminescence properties of BaxSryLizSiO4:Ce3+, Mn2+ phosphors for NUV-LED lighting 紫外光led照明用BaxSryLizSiO4:Ce3+， Mn2+荧光粉的光致发光性能

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105689

Yisen Lin, Z. Xiong, L. Hong, H. Xue, Laura Chen

引用次数: 0

Isocyanate-terminated polydimethylsiloxane-modified epoxy resin: Preparation and curing, characterization and mechanical properties 端部异氰酸酯聚二甲基硅氧烷改性环氧树脂:制备、固化、表征及力学性能

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105745

D. Gui, D. Si, B. Chen, J. Li, X. Yu

引用次数: 1

Electromigration behavior of Cu-core/Sn-shell solder joints 铜芯/锡壳焊点的电迁移行为

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105724

Wenkai Mu, Wei Zhou, P. Wu

引用次数: 0

Investigation on cracked inductors based on finite element analysis 基于有限元分析的裂纹电感器研究

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105713

M. Cai, Daoguo Yang, Y. Tao, Cassie Su, Boyi Wu, Zaifu Cui

{"title":"Investigation on cracked inductors based on finite element analysis","authors":"M. Cai, Daoguo Yang, Y. Tao, Cassie Su, Boyi Wu, Zaifu Cui","doi":"10.1109/ISAPM.2011.6105713","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105713","url":null,"abstract":"I-type ferrite inductors are prone to cracking easily after undergoing cooling and heating cycles. It is necessary to work out a method to improve reliability of the device, even if the cracking does not damage the device directly. In this paper, one failure case on product line is investigated deeply by combining finite element analysis, environmental tests and failure analysis methods. Analysis results show the internal fillet radius R of the inductor affects the stress distribution directly. When the radius size gets smaller, the stress is more concentrated, and the cracking occurs easily. The key stress will decrease by 60–90Mpa when R increases from 0.02mm to 0.7mm, which will greatly improve the reliability of the device. Moreover, the results also show the filler material of the inductor is one of key factors of improving cracking phenomenon. So it can improve the stress distribution to select the optimal filler material. To optimize the entire device, it is necessary to use the existing optimization design method of multivariate nonlinear to synthetically optimize parameters of various materials and size parameters of the device and to find out the best materials and sizes that are suitable for the current process.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"11 1","pages":"262-266"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86364112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Progress on thermally conductive adhesive for electronic packaging 电子封装用导热胶的研究进展

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI: 10.1109/ISAPM.2011.6105736

Xibing Zhan, T. Jin, Junying Zhang, Jue Cheng

{"title":"Progress on thermally conductive adhesive for electronic packaging","authors":"Xibing Zhan, T. Jin, Junying Zhang, Jue Cheng","doi":"10.1109/ISAPM.2011.6105736","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105736","url":null,"abstract":"In recent years, with the rapid development of large scale integrated circuit and micro-packaging technology, the electronic components and devices tend to be high miniaturization and intensity. The heat dissipation of electronic components has become more crucial to the overall system because it affects the lifetime, performance and reliability of electronic device[1]. According to survey, the reliability of electronic components decrease by10% with the temperature increase by 2°C[2]. Heat dissipation from microelectronics is most commonly performed by thermal conduction. For this purpose, most of metal materials are used due to their good thermal conductivity, but they have some disadvantages, such as high density, complicated processing technology and poor resistance to corrosion[3]. So many researchers direct their interest to the study of thermal conductive adhesives (TCAs). As we all know, polymer matrix have low heat conductivity, so how to improve the thermal conductivity of TCAs has aroused more and more researcher's attention. In this paper, the thermal conducting mechanism and heat transfer model were introduced. In addition, it's demonstrated in detail that the recent research advances in heat conductive adhesive in the field of fixation and packaging of electronic devices. And then the factors affecting thermal conductivity and methods of enhancing thermal conducting were presented, such as exploiting new filler, modifying the surface of filler and optimizing the technological conditions. Meanwhile, the direction of further development of thermal conductive adhesive in the field of electronics was pointed out.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"154 1","pages":"383-386"},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84985500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0