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The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package 63Sn37Pb焊料中添加钯对CCGA封装工艺的影响
2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-10-01 DOI: 10.1109/ISAPM.2011.6105728
Yingzhuo Huang, P. Lin, Yusheng Cao, Quanbin Yao
{"title":"The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package","authors":"Yingzhuo Huang, P. Lin, Yusheng Cao, Quanbin Yao","doi":"10.1109/ISAPM.2011.6105728","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105728","url":null,"abstract":"Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85291305","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 1971-09-01 DOI: 10.1109/SC.2014.3
Yixiong Huang
{"title":"Copyright page","authors":"Yixiong Huang","doi":"10.1109/SC.2014.3","DOIUrl":"https://doi.org/10.1109/SC.2014.3","url":null,"abstract":"Copyright and Reprint Permission: Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of U.S. copyright law for private use of patrons those articles in this volume that carry a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. For other copying, reprint or republication permission, write to IEEE Copyrights Manager, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1971-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84054290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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