2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers最新文献_第4页

A 50mW-TX 65mW-RX 60GHz 4-element phased-array transceiver with integrated antennas in 65nm CMOS 50mW-TX 65mW-RX 60GHz 4元相控阵收发器，采用65nm CMOS集成天线

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487714

Lingkai Kong, D. Seo, E. Alon

引用次数: 29

A 93-to-113GHz BiCMOS 9-element imaging array receiver utilizing spatial-overlapping pixels with wideband phase and amplitude control 一种93 ~ 113ghz BiCMOS 9元成像阵列接收机，利用空间重叠像素，宽带相位和幅度控制

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487674

F. Caster, L. Gilreath, S. Pan, Z. Wang, F. Capolino, P. Heydari

引用次数: 21

A 10Gb/s 6Vpp differential modulator driver in 0.18μm SiGe-BiCMOS 基于0.18μm SiGe-BiCMOS的10Gb/s 6Vpp差分调制器驱动

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487669

Yi Zhao, L. Vera, J. Long, D. Harame

引用次数: 7

A 6nW inductive-coupling wake-up transceiver for reducing standby power of non-contact memory card by 500× 一种6nW电感耦合唤醒收发器，可将非接触式存储卡待机功率降低500x

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487705

N. Miura, Mitsuko Saito, M. Taguchi, T. Kuroda

{"title":"A 6nW inductive-coupling wake-up transceiver for reducing standby power of non-contact memory card by 500×","authors":"N. Miura, Mitsuko Saito, M. Taguchi, T. Kuroda","doi":"10.1109/ISSCC.2013.6487705","DOIUrl":"https://doi.org/10.1109/ISSCC.2013.6487705","url":null,"abstract":"Memory cards are widely used in electronic systems to expand internal storage area or are used as detachable media to carry data. Although cloud computing has recently drawn attention, data transfer consumes significant power (e.g., 1% battery charge of a smartphone when 10 pictures are transferred through WLAN), making local memory card storage still attractive in mobile devices. As storage capacity increases, the I/O speed should also increase accordingly. However, conventional memory cards require strong ESD protection, limiting high-speed data transfer. A non-contact memory card [1] is one of the solutions to this problem. No signal terminals are exposed for mechanical contact, which relaxes ESD constraints. A data transfer rate of 6Gb/s/ch by inductive coupling [1] and 12Gb/s/ch by transmission-line coupling [2] are reported. The post-UHS-II speed over 5Gb/s can be covered with around 10mW power consumption. Moreover, by supplying power wirelessly, mechanical connections can be completely removed, which could provide features such as waterproof capability or a new attach-remove user interface. A >50% high-efficient wireless power delivery has been reported [3]. However, it mainly supplies a large amount of active power, and the efficiency drops to ~10% in low-power standby mode. Shutting down the power delivery in standby would require a power-on sequence and an unacceptably long suspend (~10s) for each new command. For high-speed card access, the power delivery and the wireless data receiver (RX) should always be active, consuming about 2mW in RX and in total 20mW including loss in the wireless power delivery. This standby power is almost identical to that of typical smartphones, tablet-PCs, or camcorders and the battery life halves.","PeriodicalId":6378,"journal":{"name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","volume":"79 5 1","pages":"214-215"},"PeriodicalIF":0.0,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77299603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A 0.18µm CMOS SoC for a 100m-range 10fps 200×96-pixel time-of-flight depth sensor 0.18µm CMOS SoC，用于100m范围10fps 200×96-pixel飞行时间深度传感器

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487827

C. Niclass, M. Soga, H. Matsubara, Masaru Ogawa, M. Kagami

{"title":"A 0.18µm CMOS SoC for a 100m-range 10fps 200×96-pixel time-of-flight depth sensor","authors":"C. Niclass, M. Soga, H. Matsubara, Masaru Ogawa, M. Kagami","doi":"10.1109/ISSCC.2013.6487827","DOIUrl":"https://doi.org/10.1109/ISSCC.2013.6487827","url":null,"abstract":"A number of potentially low-cost time-of-flight (ToF) 3D image sensors aiming at consumer electronics applications have recently appeared in CMOS. Diffused-light sensors taking advantage of SPAD pixels, conventional and pinned-photodiode lock-in pixels demonstrate centimeter-ranging performance in distances of typically up to 6m, and with the exception of, under low background light (BG) conditions. In those approaches, however, performance tends to rapidly deteriorate in severe BG conditions, such as outdoors, and long-distance ranges have yet to be reported. Another common limitation is their inability to cope with multi-echo target environments. Higher optical signal-to-background ratio (SBR), and hence better performance, is typically achieved by laser-scanning approaches, e.g. employing polygonal or MEMS mirrors. With the emerging need for high-resolution light detection and ranging (LIDAR) technologies in advanced driving-assistance systems (ADAS), we introduce an SoC that performs time-correlated single-photon counting (TCSPC) and complete DSP for a 100m-range ToF sensor. The chip provides the system-level electronics with a serial and low-bit-rate digital interface for: multi-echo distance, distance reliability, intensity, and BG-only intensity, thus mitigating system-level complexity and cost.","PeriodicalId":6378,"journal":{"name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","volume":"136 1","pages":"488-489"},"PeriodicalIF":0.0,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77459009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

A 249Mpixel/s HEVC video-decoder chip for Quad Full HD applications 一个249Mpixel/s HEVC视频解码器芯片，用于四元全高清应用

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487682

Chao-Tsung Huang, M. Tikekar, C. Juvekar, V. Sze, A. Chandrakasan

{"title":"A 249Mpixel/s HEVC video-decoder chip for Quad Full HD applications","authors":"Chao-Tsung Huang, M. Tikekar, C. Juvekar, V. Sze, A. Chandrakasan","doi":"10.1109/ISSCC.2013.6487682","DOIUrl":"https://doi.org/10.1109/ISSCC.2013.6487682","url":null,"abstract":"The latest video coding standard High Efficiency Video Coding (HEVC) [1] provides 50% improvement in coding efficiency compared to H.264/AVC, to meet the rising demand for video streaming, better video quality and higher resolutions. The coding gain is achieved using more complex tools such as larger and variable-size coding units (CU) in a hierarchical structure, larger transforms and longer interpolation filters. This paper presents an integrated circuit which supports Quad Full HD (QFHD, 3840×2160) video decoding for the HEVC draft standard. It addresses new design challenges for HEVC (“H.265”) with three primary contributions: 1) a system pipelining scheme which adapts to the variable-size largest coding unit (LCU) and provides a two-stage sub-pipeline for memory optimization; 2) unified processing engines to address the hierarchical coding structure and many prediction and transform block sizes in area-efficient ways; 3) a motion compensation (MC) cache which reduces DRAM bandwidth for the LCU and meets the high throughput requirements which are due to the long filters.","PeriodicalId":6378,"journal":{"name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","volume":"3 1","pages":"162-163"},"PeriodicalIF":0.0,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91043046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 33

F2: VLSI power-management techniques: Principles and applications 2: VLSI电源管理技术:原理与应用

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487601

Leland Chang, S. Morton, Ken Chang, Jin-Man Han, P. Malcovati, V. Stojanović

引用次数: 0

A wideband fractional-N ring PLL with fractional-spur suppression using spectrally shaped segmentation 一个宽带分数n环锁相环与分数杂散抑制利用频谱形状分割

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487795

T. Kao, Che-Fu Liang, H. Chiu, Michael Ashburn

引用次数: 24

A 2.5-to-3.3GHz CMOS Class-D VCO 2.5- 3.3 ghz CMOS d类压控振荡器

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487763

Luca Fanori, P. Andreani

引用次数: 37

A 0.7W fully integrated 42GHz power amplifier with 10% PAE in 0.13µm SiGe BiCMOS 一个0.7W完全集成的42GHz功率放大器，在0.13µm SiGe BiCMOS中具有10%的PAE

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI: 10.1109/ISSCC.2013.6487673

Wei Tai, L. Carley, D. Ricketts

引用次数: 53