0.18µm CMOS SoC,用于100m范围10fps 200×96-pixel飞行时间深度传感器

C. Niclass, M. Soga, H. Matsubara, Masaru Ogawa, M. Kagami
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引用次数: 25

摘要

许多潜在的低成本的飞行时间(ToF) 3D图像传感器瞄准消费电子应用最近出现了CMOS。漫射光传感器利用SPAD像素、传统像素和针脚光电二极管锁定像素,在通常高达6米的距离内表现出厘米级的测距性能,在低背景光(BG)条件下除外。然而,在这些方法中,在恶劣的BG条件下(如户外),性能往往会迅速恶化,并且长距离范围尚未报道。另一个常见的限制是它们无法处理多回波目标环境。更高的光信号与背景比(SBR),从而更好的性能,通常是通过激光扫描方法实现的,例如使用多边形或MEMS反射镜。随着先进驾驶辅助系统(ADAS)对高分辨率光探测和测距(LIDAR)技术的需求不断涌现,我们推出了一款执行时间相关单光子计数(TCSPC)的SoC,并为100米范围的ToF传感器提供了完整的DSP。该芯片为系统级电子设备提供串行和低比特率数字接口,可实现多回波距离、距离可靠性、强度和仅bg强度,从而降低系统级复杂性和成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 0.18µm CMOS SoC for a 100m-range 10fps 200×96-pixel time-of-flight depth sensor
A number of potentially low-cost time-of-flight (ToF) 3D image sensors aiming at consumer electronics applications have recently appeared in CMOS. Diffused-light sensors taking advantage of SPAD pixels, conventional and pinned-photodiode lock-in pixels demonstrate centimeter-ranging performance in distances of typically up to 6m, and with the exception of, under low background light (BG) conditions. In those approaches, however, performance tends to rapidly deteriorate in severe BG conditions, such as outdoors, and long-distance ranges have yet to be reported. Another common limitation is their inability to cope with multi-echo target environments. Higher optical signal-to-background ratio (SBR), and hence better performance, is typically achieved by laser-scanning approaches, e.g. employing polygonal or MEMS mirrors. With the emerging need for high-resolution light detection and ranging (LIDAR) technologies in advanced driving-assistance systems (ADAS), we introduce an SoC that performs time-correlated single-photon counting (TCSPC) and complete DSP for a 100m-range ToF sensor. The chip provides the system-level electronics with a serial and low-bit-rate digital interface for: multi-echo distance, distance reliability, intensity, and BG-only intensity, thus mitigating system-level complexity and cost.
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