Integration-The Vlsi Journal最新文献_第10页

Lossless grounded capacitance multipliers using two CFOAs and a grounded capacitor 使用两个cfoa和一个接地电容的无损接地电容乘法器

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-31 DOI: 10.1016/j.vlsi.2025.102375

Tolga Yucehan

{"title":"Lossless grounded capacitance multipliers using two CFOAs and a grounded capacitor","authors":"Tolga Yucehan","doi":"10.1016/j.vlsi.2025.102375","DOIUrl":"10.1016/j.vlsi.2025.102375","url":null,"abstract":"<div><div>Two new lossless grounded capacitance multipliers (GCMs) are proposed, in which a grounded capacitor and two current-feedback operational amplifiers (CFOAs) are used. Nevertheless, two floating resistors are used in the proposed GCMs. The proposed GCMs consist of three passive components. Thus, the proposed GCMs are obtained with a minimal quantity of passive components. The proposed GCMs have a high operating frequency range at a high multiplying factor. Identical passive component requirements are not needed in the proposed GCMs. In addition, the proposed GCMs can be controlled electronically by using the current-controlled current conveyor with a buffer instead of the second CFOA. However, there is no investigation on electronic tunability in this study. 0.18 μm CMOS technology parameters are employed for the CFOAs used in the proposed lossless GCMs. The layout area of the CFOA is 978.75 μm<sup>2</sup>. All simulations are performed with the SPICE program. In all simulations, supply voltages of the CFOA are selected as ±1.25 V. The simulation results verified the theoretical results from about 30 Hz to 3 MHz. The simulation results show that temperature changes do not affect the proposed GCMs much. The proposed circuits consume 1.91 mW power. In addition, the GCMs in this paper are used in the first-order active low-pass filter, and experiments of these circuits are achieved with AD844s, which are commercial devices for the CFOAs. Also, the experimental results confirm the theoretical results from about 2.5 kHz to 1 MHz.</div></div>","PeriodicalId":54973,"journal":{"name":"Integration-The Vlsi Journal","volume":"102 ","pages":"Article 102375"},"PeriodicalIF":2.2,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143146481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

CMOS multifunctional structure, with applications in analog signal processing CMOS多功能结构，具有模拟信号处理方面的应用

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-31 DOI: 10.1016/j.vlsi.2025.102377

Cosmin Radu Popa

引用次数: 0

156 dB low-voltage low-power CMOS exponential function generator circuit 156db低压低功耗CMOS指数函数产生电路

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-31 DOI: 10.1016/j.vlsi.2025.102363

Cosmin Radu Popa

引用次数: 0

Extrinsic calibration of complex machine vision system for mobile robot 移动机器人复杂机器视觉系统的外部标定

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-31 DOI: 10.1016/j.vlsi.2025.102370

Ruben Alaniz-Plata , Fernando Lopez-Medina , Oleg Sergiyenko , Wendy Flores-Fuentes , Julio C. Rodríguez-Quiñonez , Cesar Sepulveda-Valdez , José A. Núñez-López , David Meza-García , José Fabián Villa-Manríquez , Humberto Andrade-Collazo , Vera Tyrsa

{"title":"Extrinsic calibration of complex machine vision system for mobile robot","authors":"Ruben Alaniz-Plata , Fernando Lopez-Medina , Oleg Sergiyenko , Wendy Flores-Fuentes , Julio C. Rodríguez-Quiñonez , Cesar Sepulveda-Valdez , José A. Núñez-López , David Meza-García , José Fabián Villa-Manríquez , Humberto Andrade-Collazo , Vera Tyrsa","doi":"10.1016/j.vlsi.2025.102370","DOIUrl":"10.1016/j.vlsi.2025.102370","url":null,"abstract":"<div><div>Autonomous mobile robots are essential in industry, logistics, and service applications, such as infrastructure inspection, where navigation in dark and narrow environments is one of the most challenging tasks. This project presents the design and development of a patented artificial vision system for a mobile robot, which combines a high-precision laser scanner and a stereo-vision system. The objective is to enhance the robot’s surface scanning capabilities in complex environments. The proposed methodology allows to determine the relative position between systems to integrate data of the laser scanner with stereo-vision cameras and inertial sensors, providing robust and accurate environmental perception that enables the characterization of ventilation ducts surface. Experimental results show a mean correspondence error of <span><math><mrow><mn>7</mn><mo>.</mo><mn>4515</mn><mspace></mspace><mi>mm</mi></mrow></math></span> in absolute terms for the combined data.</div></div>","PeriodicalId":54973,"journal":{"name":"Integration-The Vlsi Journal","volume":"102 ","pages":"Article 102370"},"PeriodicalIF":2.2,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143288287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

O.O: Optimized one-die placement for face-to-face bonded 3D ICs O.O .优化了面对面键合3D集成电路的单模放置

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-31 DOI: 10.1016/j.vlsi.2025.102371

Xingyu Tong , Yuhao Ren , Zhijie Cai , Peng Zou , Min Wei , Yuan Wen , Zhifeng Lin , Jianli Chen

{"title":"O.O: Optimized one-die placement for face-to-face bonded 3D ICs","authors":"Xingyu Tong , Yuhao Ren , Zhijie Cai , Peng Zou , Min Wei , Yuan Wen , Zhifeng Lin , Jianli Chen","doi":"10.1016/j.vlsi.2025.102371","DOIUrl":"10.1016/j.vlsi.2025.102371","url":null,"abstract":"<div><div>As the miniaturization of integrated circuits (ICs) reaches its physical limits, the industry is entering a “more-than-Moore” era, demanding new Electronic Design Automation (EDA) tools. Existing TSV-based 3D placers focus on minimizing cuts while burgeoning F2F-bonded ICs feature dense interconnection between two planar die. Towards this novel structure, we proposed an integrated adaptation methodology upon mature one-die-based placement strategies. First, we instructively utilized a one-die placer to provide a statistical looking-ahead net diagnosis. The netlist henceforth shall be coarsened topologically and geometrically using a multi-level framework. Our multi-objective gain formulation guides a level-by-level refinement of the partition. This formulation considers factors like cut expectation, heterogeneous row heights, and balanced cell distribution, enabling efficient incremental calculations at each level. Given the partition, we synchronized the behavior of analytical planar placers by balancing the density and wirelength objective function among asymmetric layers. Finally, the result will be further improved by heuristic detail placement of bonding terminals and a post-place partition adjustment. Experimental results demonstrate that our fine-grained fusion of partitioning and placement techniques are competitive compared with the top three winners of the 2022 ICCAD CAD Contest, achieving the best normalized average wirelength with competitive runtime under various 3D architectural constraints.</div></div>","PeriodicalId":54973,"journal":{"name":"Integration-The Vlsi Journal","volume":"102 ","pages":"Article 102371"},"PeriodicalIF":2.2,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143419457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Comparison of integer-order chaotic attractors as randomness source in collision-free robotic exploration methods 无碰撞机器人探索方法中作为随机源的整数阶混沌吸引子比较

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-30 DOI: 10.1016/j.vlsi.2025.102372

C. Sánchez-López, R. Ochoa-Montiel, E. Reyes-Pérez, C. Muñiz-Montero

{"title":"Comparison of integer-order chaotic attractors as randomness source in collision-free robotic exploration methods","authors":"C. Sánchez-López, R. Ochoa-Montiel, E. Reyes-Pérez, C. Muñiz-Montero","doi":"10.1016/j.vlsi.2025.102372","DOIUrl":"10.1016/j.vlsi.2025.102372","url":null,"abstract":"<div><div>This article presents a comparison on the use of integer-order chaotic waveforms in collision-free robotic navigation methods. Each state-variable associated with the Lorenz’s, Rossler’s, Chen’s, Liu’s, Chua’s and Saturated Nonlinear Function Series system is used to compute the coverage, which represents the effectiveness over the amount of the total area covered by the mobile robot. As a result, it can be deduced which dynamic system and state-variable are most suitable to be used as randomness source within the robotic exploration methods. All positions of the mobile robot are generated by the state-variable of the chaotic dynamic system and the inverse Jacobian of the mobile robot is used as control law. The position error at each point of the chaotic path is iteratively reduced and the angular velocities for each motion are computed. Numerical simulations were performed in the Matlab environment and illustrate the usefulness of the best collisionless chaotic path generator with the largest coverage, which can be applied to various areas, such as household, agriculture, education, manufacturing, patrolling, medical care, military and so on.</div></div>","PeriodicalId":54973,"journal":{"name":"Integration-The Vlsi Journal","volume":"102 ","pages":"Article 102372"},"PeriodicalIF":2.2,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143146495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation of fractional order chaotic oscillators applying the Grünwald–Letnikov definition and the Adams–Bashforth–Moulton method 应用gr<s:1> nwald - letnikov定义和Adams-Bashforth-Moulton方法模拟分数阶混沌振子

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-27 DOI: 10.1016/j.vlsi.2025.102366

Alejandro Silva-Juarez , Sergio A. Rosales-Nunez , Luis C. Alvarez-Simon , Gregorio Zamora-Mejia , Victor H. Carbajal-Gomez , Alejandro I. Bautista-Castillo , Jose M. Rocha-Perez

引用次数: 0

A broadband low-noise VCO circuit based on a hybrid analog-digital control loop 一种基于模数混合控制回路的宽带低噪声压控振荡器电路

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-27 DOI: 10.1016/j.vlsi.2025.102374

Lixia Zheng, Yuxiao Li, Zilu Zhao, Hehe Tian, Jin Wu, Weifeng Sun

引用次数: 0

High-speed serial interface equalization tuning using metaheuristics 使用元启发式的高速串行接口均衡调谐

IF 2.2 3区工程技术

Integration-The Vlsi Journal Pub Date : 2025-01-25 DOI: 10.1016/j.vlsi.2025.102369

Adán Torralba-Ayance, Astrid Maritza González-Zapata, Alejandro Díaz-Sánchez

引用次数: 0

Third-order resonance networks and their application to chaos generation 三阶共振网络及其在混沌产生中的应用