InfomatPub Date : 2026-02-24Epub Date: 2025-10-27DOI: 10.1002/inf2.70097
Junchang Wang, Jie Cao, Dongzi Yang, Xuanyu Wang, Yue Zhang, Yan Chen, Mengyang Liu, Jie Qiu, Zhiwei Chen, Qian Xu, Xumeng Zhang, Xianzhe Chen, Chenxin Zhu, Ming Wang
{"title":"Solder-free room-temperature multichannel integration for soft hybrid electronics","authors":"Junchang Wang, Jie Cao, Dongzi Yang, Xuanyu Wang, Yue Zhang, Yan Chen, Mengyang Liu, Jie Qiu, Zhiwei Chen, Qian Xu, Xumeng Zhang, Xianzhe Chen, Chenxin Zhu, Ming Wang","doi":"10.1002/inf2.70097","DOIUrl":"10.1002/inf2.70097","url":null,"abstract":"<p>Soft hybrid electronics that interconnect soft modules and rigid circuit components hold significant promise for applications in wearables, robotics, and biomedicine. However, existing interconnection methods face critical challenges, including thermal damage from high-temperature welding, complicated chemical processing, and inadequate mechanical bonding, which often lead to interfacial deformation and electrical failure. Here, we introduce a room-temperature direct interconnection (RTDI) technique that leverages hydrogen bonding and molecular chain entanglement to form robust, solder-free, multichannel interfaces between soft and rigid modules. The resulting interface achieves an exceptional mechanical bonding strength of 210.4 N m<sup>−1</sup> (24.7-fold higher than conventional silver paste), and an electrical stretchability of 173.6% with relatively stable resistance at 110% strain. As a proof of concept, we demonstrate the RTDI technique in two applications: multi-channel interconnections for stretchable displays and vertical chip integration for logic-controlled display systems. Owing to its simplicity and scalability, this method provides a powerful pathway for advancing multifunctional hybrid electronic integration.</p><p>\u0000 <figure>\u0000 <div><picture>\u0000 <source></source></picture><p></p>\u0000 </div>\u0000 </figure></p>","PeriodicalId":48538,"journal":{"name":"Infomat","volume":"8 3","pages":""},"PeriodicalIF":22.3,"publicationDate":"2026-02-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/inf2.70097","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147569728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
InfomatPub Date : 2026-02-24Epub Date: 2026-01-13DOI: 10.1002/inf2.70116
Mengjie Wang, Yanan Ma, Jia Liu, Li Xu, Li Wen, Ranyun Wu, Yongfa Cheng, Liang Li, Siliang Wang, Yang Yue, Zhixiang Huang
{"title":"Flexible ionic pressure sensors: From migration-electronic mechanisms to emerging iontronic paradigms","authors":"Mengjie Wang, Yanan Ma, Jia Liu, Li Xu, Li Wen, Ranyun Wu, Yongfa Cheng, Liang Li, Siliang Wang, Yang Yue, Zhixiang Huang","doi":"10.1002/inf2.70116","DOIUrl":"https://doi.org/10.1002/inf2.70116","url":null,"abstract":"<p>Flexible ionic pressure sensors (FIPS) have emerged as promising candidates for bridging the gap between electronics and biologically compatible interfaces. Unlike previous reviews, which focused primarily on materials or devices, this review presents a classification of FIPS based on mechanisms into two distinct categories: the migration-electronic type and the emerging iontronic type. Eight representative sensing mechanisms are systematically analyzed, including ionic piezoresistive, capacitive, piezoelectric and triboelectric effects (migration-electronic), as well as ionic diode, potentiometric transduction, nanofluidic and coupled nanofluidic–potentiometric transduction mechanisms (emerging iontronic). The basic force-electric response principles of each type of sensor have been described, combining theoretical derivation formulas followed by a comparative analysis of advantages, disadvantages, and key performance indicators, which have both comprehensiveness and originality. Furthermore, we highlight advanced engineering approaches integrating ionic transport materials, flexible substrates, and novel electrodes to enhance sensitivity, stability, and multi-modal responsiveness. Finally, we outline current challenges and future prospects of wearable electronics, healthcare monitoring, and intelligent robotics. By mapping the evolution of sensing mechanisms and their associated architectures, this review provides a comprehensive and forward-looking perspective on the development of next-generation ionic sensing systems.</p><p>\u0000 <figure>\u0000 <div><picture>\u0000 <source></source></picture><p></p>\u0000 </div>\u0000 </figure></p>","PeriodicalId":48538,"journal":{"name":"Infomat","volume":"8 3","pages":""},"PeriodicalIF":22.3,"publicationDate":"2026-02-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/inf2.70116","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147565731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
InfomatPub Date : 2026-02-24Epub Date: 2025-10-28DOI: 10.1002/inf2.70095
Yuchen Wang, Kun Liu, Henghui Xiao, Zhaorun Zhu, Chenqun Hong, Hongzhen Lin, Jian Wang, Decai Guo, Meinan Liu
{"title":"Delicate design of lithium-ion bridges in hybrid solid electrolyte for wide-temperature adaptive solid-state lithium metal batteries","authors":"Yuchen Wang, Kun Liu, Henghui Xiao, Zhaorun Zhu, Chenqun Hong, Hongzhen Lin, Jian Wang, Decai Guo, Meinan Liu","doi":"10.1002/inf2.70095","DOIUrl":"10.1002/inf2.70095","url":null,"abstract":"<p>Hybrid solid electrolytes have emerged as promising candidates for next-generation high-energy-density solid-state lithium metal batteries owing to the enhanced safety and processability. Nevertheless, the practical implementation remains hindered by severe interfacial Li<sup>+</sup> transport barriers at ceramic-polymer junctions, particularly under ambient low-temperature or high-power-density surroundings. Herein, the lithium-ion bridge concept has been proposed to accelerate Li<sup>+</sup> transport kinetics across the ceramic-polymer interphase through the delicate design of a chemical bonding strategy. As demonstrated, the poly(vinylidene fluoride-co-hexafluoropropylene) (PH) chain with Li<sub>6.4</sub>La<sub>3</sub>Zr<sub>1.4</sub>Ta<sub>0.6</sub>O<sub>12</sub> (LLZTO) particles can be connected by lithium benzene sulfonate as Li<sup>+</sup> conductive bridges. With these Li<sup>+</sup> bridges, this unique hybrid PH-LLZTO solid-state electrolyte exhibits an exceptional ionic conductivity of 0.71 mS cm<sup>−1</sup> at 25°C with a superior Li<sup>+</sup> transference number of 0.67. Impressively, this advanced solid-state electrolyte empowers high-voltage LiNi<sub>0.8</sub>Co<sub>0.1</sub>Mn<sub>0.1</sub>O<sub>2</sub>/Li cells under fast charge/discharge capability as high as 4C and a wide temperature range from −20°C to 60°C. Consequently, the optimal solid-state Li metal battery could stabilize at −20°C with a high discharge specific capacity of 130 mAh g<sup>−1</sup>. Moreover, a bipolar pouch cell by stacking 4 units can be successfully assembled using this advanced solid-state electrolyte with fast Li<sup>+</sup> transport kinetics and delivers an ultra-high voltage of 15.12 V, showcasing the great potential of integrated module application in the future.</p><p>\u0000 <figure>\u0000 <div><picture>\u0000 <source></source></picture><p></p>\u0000 </div>\u0000 </figure></p>","PeriodicalId":48538,"journal":{"name":"Infomat","volume":"8 3","pages":""},"PeriodicalIF":22.3,"publicationDate":"2026-02-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/inf2.70095","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147569902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}