{"title":"Comparison of the Continuous Constrained Double Bending process with Equal Channel Angular Extrusion Conform process by simulation modelling","authors":"V. Kamburov, A. Nikolov","doi":"10.1109/ELECTRONICA55578.2022.9874408","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874408","url":null,"abstract":"This paper investigates the possibility of creating conditions for severe plastic deformation by continuous constrained double bending (CCDB Conform) with a small relative bending radiuses Rb/T of 0.7 to 0.1 in trapezoidal calibers, developed using virtual tools in the CAD/CAE software environment. The CCDB Conform process was analyzed and compared with the ECAE Conform process using the accumulated effective strains, the workability parameter by SPD, the distribution of mean stresses and strain rates determined by simulation modelling. It is found that the equal channel angular extrusion is a special case of the constrained double bending process with a very small relative bending radius ($R_{b}/Tleq 0.1$).","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134191266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Modelling of Dual Active Bridge Converter for Application in EVs Charging Station","authors":"Gergana Vacheva, N. Hinov","doi":"10.1109/ELECTRONICA55578.2022.9874424","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874424","url":null,"abstract":"In modern electric vehicles, more and more attention is paid to recuperation. This requires the implementation of bidirectional converter topologies. The usage of dual active bridge topology can be implemented for the construction of a charging station with the ability to store energy in the grid or other energy storage element such as a supercapacitor or battery. The usage of the one topology would improve the energy efficiency and optimal use of the power electronic converter. This research presents a mathematical model, realized in PSIM environment, of dual active bridge converter for charging station application. That environment is oriented towards the design of different electronic circuits and allows for various simulation studies.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126714621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Study of a Phase-Shifted Full-Bridge LLC Resonant Converter Operating at ZVS/ZCS","authors":"A. Vuchev, T. Grigorova","doi":"10.1109/ELECTRONICA55578.2022.9874367","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874367","url":null,"abstract":"The present paper examines the switching mechanisms in power transistors when regulating the output voltage in a full-bridge LLC resonant converter by applying phase-shift modulation in continuous conduction mode and discontinuous conduction mode at ZVS/ZCS. The theoretical studies are verified with an OrCad Pspice simulation.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116822972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Overview and Comparison of Methodologies for Design in Deep Submicron CMOS Processes","authors":"A. P. Radev","doi":"10.1109/ELECTRONICA55578.2022.9874371","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874371","url":null,"abstract":"The paper makes an overview and comparison of three popular methodologies used for design and sizing of analog CMOS circuits in deep submicron technologies. The following methodologies are considered: design with models, based on the threshold voltage; design with simplified EKV models; design with the gmJID methodology. The goal of the paper is to evaluate the use of these methodologies and their accuracy when used for hand calculations in the early stage of the design. For this purpose, the application of these three methodologies is demonstrated in the design of current mirror OTA in 45nm CMOS technology. The results from the sizing and the simulation of the circuit are analyzed and summarized.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133745635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Measurement and Analysis of the Peel Strength for Solder Joints in LGA Electronic Assembly Using Statistical Methods","authors":"V. Tsenev, Nedvalko Peshev","doi":"10.1109/ELECTRONICA55578.2022.9874402","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874402","url":null,"abstract":"This work examines the strength of solders after LGA (Land grid array) soldering. The strength of the solders is evaluated with the maximum breaking strength. The methodology for measuring the breaking force and the implementation of the intelligent measuring system for this are presented herein. With the application of intelligent measuring systems and the use of machine learning, results have been obtained that meet the specification of the studied process. The results obtained by statistical processing are analyzed. An assessment has been made in terms of a specific application. Conclusions are drawn on the basis of the obtained results and future work for stabilization and guarantee of the soldering process with Hot bar is considered.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124704584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electroless Deposition of Cu-Ni-P Alloy Coatings on a Dielectric Surface for Application in Electronic","authors":"M. Georgieva","doi":"10.1109/ELECTRONICA55578.2022.9874400","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874400","url":null,"abstract":"The present work investigates the impact of the concentration of nickel sulfate and the thickness of electroless deposited Cu-Ni-P alloy coatings on their uniformity. The obtained alloy coatings are compared with electroless deposited copper and nickel coatings. The following methods were used to study the morphology, structure and deposition rate of the obtained layers: atomic force microscopy and X-ray fluorescence analysis, as well adhesion, roughness and sheet resistance were measured. The resulting alloy coatings are characterized by good uniformity and are suitable to replace conventional electrolytes for use in electronics application.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114958758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"FPGA Based Edge Detection: Integer Division Algorithm with a Constant Divisor","authors":"Dimitre Kromichev","doi":"10.1109/ELECTRONICA55578.2022.9874362","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874362","url":null,"abstract":"The paper presents an integer division algorithm with a constant divisor. Its application is focused on the computation of Gaussian weighted average function in FPGA based edge detection. Investigated are the algorithm's highest clock frequency and the smallest count of clock cycles required to provide the integer division result. Proved is the algorithm's capability to guarantee mathematical exactness for the entire range of values computed in Gaussian filtering. Ten FPGA families of Intel (Altera) are used to obtain the experimental data.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125014383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Gergana Mateeva, D. Parvanov, Ioan Dimitrov, I. Iliev, T. Balabanov
{"title":"Android Content Providers in Mobile Distributed Computing","authors":"Gergana Mateeva, D. Parvanov, Ioan Dimitrov, I. Iliev, T. Balabanov","doi":"10.1109/ELECTRONICA55578.2022.9874360","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874360","url":null,"abstract":"Distributed computing and volunteer computing became very popular in the last two decades. Both are used for problems easily separable for simultaneous calculations on many heterogeneous machines. The only difference is that volunteer computing has been done on a donated calculating power. With the rise of smart mobile devices, volunteer computing appeared in the world of mobile distributed computing. With its capabilities, the Android OS became an attractive environment for such computations. AndroidContent Providers became a valuable tool for information transfer in mobile distributed computing applications. The goal of this research is to demonstrate the modularity in the software architectures given by Android Content Providers.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128822434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Sotir S. Sotirov, N. Kafadarova, A. Stoynova, S. Stoyanova-Petrova, D. Stoyanova, N. Mileva, Stefan M. Rizanov
{"title":"Battery Thermal Image Sequence Processing","authors":"Sotir S. Sotirov, N. Kafadarova, A. Stoynova, S. Stoyanova-Petrova, D. Stoyanova, N. Mileva, Stefan M. Rizanov","doi":"10.1109/ELECTRONICA55578.2022.9874375","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874375","url":null,"abstract":"The operating temperature of a lithium-ion battery is one of the key factors significantly affecting its performance. Heat is generated within the battery during the charging and discharging processes. On the other hand, battery internal faults lead to an increase in their temperature. Therefore, monitoring battery temperature can aid the identification of these faults and warn of their presence prior to the occurrence of permanent thermal damaging. When the battery heats up, at best there will be some mechanical distortion of the battery surface or changes in its chemical composition. In the worst case, the battery may burst, explode, or leak electrolytes. This paperpresents a specialized software, developed for the analysis of thermographic images of batteries, via which extraction and visualization of necessary information regarding the resulting temperature changes over the entire battery surface or certain parts of it is made possible. Python version 3.9 was used during the software development. This software can successfully beimplemented in systems aimed towards monitoring and controlling the temperature of batteries and evaluating their state of health and remaining useful life.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125329583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Inventory Modeling for Resource Optimization","authors":"T. Stoilov, K. Stoilova","doi":"10.1109/ELECTRONICA55578.2022.9874418","DOIUrl":"https://doi.org/10.1109/ELECTRONICA55578.2022.9874418","url":null,"abstract":"This research derives a quantitative model for the management of the amount of available working capital for the current payments of a husbandry. The optimal amount of the needed financial resources is evaluated, which have to cover daily the wages of labor workers. The optimal moment for taking a loan to maintain working capital has been determined, taking into account the time delay from incoming funds to cover the loans. Numerical simulations and results are presented, which use current available financial data from the domains of agricultural and animal husbandries.","PeriodicalId":443994,"journal":{"name":"2022 13th National Conference with International Participation (ELECTRONICA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129985605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}