电子介质表面化学沉积Cu-Ni-P合金镀层

M. Georgieva
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引用次数: 1

摘要

本文研究了硫酸镍浓度和化学沉积Cu-Ni-P合金镀层厚度对镀层均匀性的影响。将所得合金镀层与化学镀铜镀层和化学镀镍镀层进行了比较。采用原子力显微镜和x射线荧光分析等方法研究所得层的形貌、结构和沉积速率,并测量附着力、粗糙度和薄片电阻。所得合金涂层具有良好的均匀性,适合取代传统的电解质用于电子应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electroless Deposition of Cu-Ni-P Alloy Coatings on a Dielectric Surface for Application in Electronic
The present work investigates the impact of the concentration of nickel sulfate and the thickness of electroless deposited Cu-Ni-P alloy coatings on their uniformity. The obtained alloy coatings are compared with electroless deposited copper and nickel coatings. The following methods were used to study the morphology, structure and deposition rate of the obtained layers: atomic force microscopy and X-ray fluorescence analysis, as well adhesion, roughness and sheet resistance were measured. The resulting alloy coatings are characterized by good uniformity and are suitable to replace conventional electrolytes for use in electronics application.
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