2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)最新文献_第3页

Impact of elevated temperature on data center operation based on internal and external IT instrumentation 高温对基于内部和外部IT仪器的数据中心运行的影响

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896916

Mohammad I. Tradat, H. Alissa, K. Nemati, Sadegh Khalili, B. Sammakia, M. Seymour, Russell Tipton

{"title":"Impact of elevated temperature on data center operation based on internal and external IT instrumentation","authors":"Mohammad I. Tradat, H. Alissa, K. Nemati, Sadegh Khalili, B. Sammakia, M. Seymour, Russell Tipton","doi":"10.1109/SEMI-THERM.2017.7896916","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896916","url":null,"abstract":"Today's data centers increasingly rely on environmental data collection and analysis to operate the cooling infrastructure as efficiently as possible and to maintain the reliability of IT equipment. This in turn emphasizes the importance of the quality of data collected and its relevance to the overall operation of the data center. This study presents an experiment based analysis and comparison of environmental and power data collection using two different approaches; one uses a discrete sensor network and smart PDUs, and another uses available data from the installed IT equipment (IPMI data). The comparison looks deeply into the effect of both approaches that are adopted to control data center cooling. In addition, the effect that the Supply Air Temperature (SAT) from the Computer Room Air Handler (CRAH) unit had on the IT equipment was investigated in fully sealed Cold Aisle Containment (CAC) with 100% CPU utilization. It can be observed that the difference between the discrete and IPMI inlet temperature of the IT equipment increased as SAT increased due to the IT fans increasing speed in an attempt to get more cooling and the resulting in negative pressure differential build up inside the containment. Furthermore, the authors identified a value of the supply air temperature at which IT equipment started to ramp up for both approaches of data center cooling and control. The novelty of this study may aid data center operators when making the decision of what monitoring or control scheme to use.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"33 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123250614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

A method of characterising the thermal resistance of high power LEDs 一种表征大功率led热阻的方法

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896943

J. Ellis, Gethn Pickard

引用次数: 1

Enabling faster design/performance decisions for 3D-IC package architectures 为3D-IC封装架构实现更快的设计/性能决策

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896910

Narayanan Terizhandur Varadharajan, M. Ozen, Kazunari Koga, H. Mandavia

引用次数: 0

Study of an innovative multiple fan system with one piezoelectric actuator embedded in a circular heat sink 一种新型圆形散热器内嵌压电致动器的多扇系统研究

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896900

H. K. Ma, C. Hsieh, S. Liao

{"title":"Study of an innovative multiple fan system with one piezoelectric actuator embedded in a circular heat sink","authors":"H. K. Ma, C. Hsieh, S. Liao","doi":"10.1109/SEMI-THERM.2017.7896900","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896900","url":null,"abstract":"In recent years, piezoelectric fans and their feasibility of cooling electronic devices have been widely studied. Nonetheless, there is few study about using piezoelectric fans to generate radial air flow. In this study, a radial multiple fan system (RMFS) was developed for the thermal management of high power LEDs. This system used one piezoelectric actuator and the magnetic repulsive force to activate up to 20 passive fans, which featured low power consumption and a large cooling area. The RMFS was embedded in a circular heat sink in order to evaluate its thermal performance. To find the optimal design of the RMFS, some geometry parameters were investigated. Besides, the performance of different designs was compared with commercially available axial fan. The results showed that design E had the better thermal performance because of its relatively large frequency and amplitude. The thermal resistance and the percentage improvement under 15 W heat flux were 0.84 K/W and 41.9 %, respectively. Moreover, a dimensionless number for the RMFS (MRMFS) was defined to assess the enhancement of the convective heat transfer coefficient. In design E, MRMFS was 2.1 when the power consumption of the RMFS was only 0.2 W.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127507178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Experiments on the thermal resistance of deformable thermal interface materials under mechanical loading 机械载荷作用下可变形热界面材料的热阻试验

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896938

Richard Kenney, Vaidehi Oruganti, A. Ortega, Don Nguyen, Michael Brooks

{"title":"Experiments on the thermal resistance of deformable thermal interface materials under mechanical loading","authors":"Richard Kenney, Vaidehi Oruganti, A. Ortega, Don Nguyen, Michael Brooks","doi":"10.1109/SEMI-THERM.2017.7896938","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896938","url":null,"abstract":"Experiments have been performed to characterize the thermal resistance of thermal interface materials that deform under mechanical loading. TIMs in this category include elastomeric silicon rubber based TIM gap pads and pourable paste-like composite materials that set when cured. This paper reports on extensive experiments performed to characterize the overall thermal resistance of TIM pads composed of a silicon rubber base material enhanced with metallic filler particles. It is found that TIM pad thermal resistance decreases with applied load, reaching an asymptotic minimum thermal resistance which is dependent on initial thickness and material formulation. The critical pressure required to achieve minimum resistance is identified for all tested samples and is strongly dependent on material formulation. It is shown that the minimum thermal TIM resistance is not dependent on the size of the TIM sample under test when it is represented as the unit thermal resistance. Careful examination of the data shows that the apparent density of these TIM materials increases with load. Surprisingly the effective thermal conductivity initially increases with load but then maximizes and decreases as the load and the material strain surpass some critical value.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127337745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Integration of a multiple piezoelectric fans system with a vapor chamber 多压电风扇系统与蒸汽室的集成

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896922

H. K. Ma, S. Liao, Y. S. Lee

引用次数: 0

Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices 嵌入式两相液冷大功率3D兼容电子设备的建模

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896920

P. Parida, A. Sridhar, M. Schultz, Fanghao Yang, M. Gaynes, E. Colgan, B. Dang, Gerard McVicker, T. Brunschwiler, J. Knickerbocker, T. Chainer

引用次数: 8

Numerical modeling and optimization of a V-groove warm water cold-plate v型槽温水冷板的数值模拟与优化

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896948

Yaser Hadad, Bharath Ramakrishnan, S. Alkharabsheh, P. Chiarot, B. Sammakia

{"title":"Numerical modeling and optimization of a V-groove warm water cold-plate","authors":"Yaser Hadad, Bharath Ramakrishnan, S. Alkharabsheh, P. Chiarot, B. Sammakia","doi":"10.1109/SEMI-THERM.2017.7896948","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896948","url":null,"abstract":"In electronics cooling, water is increasingly replacing air for applications requiring high heat flux. Water is the ideal substitute due to its high specific heat capacity and density. Indeed, high values of heat capacity (high density and specific heat capacity) enable water to receive, store and carry higher amounts of energy compared to air. Water's incompressibility and very low specific volume also requires smaller amounts of mechanical work for fluid circulation. Using warm water instead of chilled water makes the cooling process more economical, but requires more efficiently designed cold-plates. Our current work focuses on modeling and optimization of a V-groove mini-channel cold-plate using warm water as the coolant. Our results show that the performance of an impinging channel heat sink is significantly different compared to parallel channel designs. Dividing the flow into two branches cuts the fluid velocity and flow path in half for the impinging design. This reduction in the fluid velocity and flow length affects the developing thermal boundary layer and is an important consideration for a shorter length heat exchanger (where the channel length is comparable to the thermal entrance length). Distributing the coolant uniformly to every channel is a challenge for impinging cold-plates where there are strict limitations on size.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116085867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Design of thermal systems based on combination of Thermoelectric and Vapor Chamber technologies 基于热电和蒸汽室技术相结合的热系统设计

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896899

A. Gurevich, Isaac Steiner, Enhui Huang

引用次数: 3

High temperature submicron SOI CMOS technology characterization for analog and digital applications up to 300°C 高温亚微米SOI CMOS技术表征模拟和数字应用高达300°C

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 1900-01-01 DOI: 10.1109/SEMI-THERM.2017.7896935

K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov, M. Ismail-Zade, P. Ignatov

引用次数: 6