K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov, M. Ismail-Zade, P. Ignatov
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引用次数: 6
摘要
SOI CMOS技术是为扩展高温(HT)范围应用(至300°C)而开发的。mosfet有两种选择:用于最小栅极长度0.18µm和1.8 V供电电压的数字应用,以及最小栅极长度0.5µm和5 V供电的模拟应用。对两种选择的SOI mosfet的电特性测量结果进行了演示、分析和比较。开发了一种改进的SOI MOSFET紧凑型模型,可扩展温度范围至300°C,以提供使用SPICE进行HT SOI CMOS电路模拟的可能性。
High temperature submicron SOI CMOS technology characterization for analog and digital applications up to 300°C
SOI CMOS technology was developed for extended high temperature (HT) range applications (to 300 °C). MOSFETs come in two options: for digital applications with minimum gate length 0.18 µm and 1.8 V supply voltage and for analog applications with minimum gate length 0.5 µm and 5 V supply. Results of electrical characteristics measurement are demonstrated, analyzed, and compared for SOI MOSFETs of both options. A modified SOI MOSFET compact model is developed for extended temperature range up to 300°C to provide the possibility of HT SOI CMOS circuit simulation with SPICE.