2011 IEEE International Symposium on Electromagnetic Compatibility最新文献

{"title":"Benefits of reversing the circuit manufacturing and assembly processes for electronic products","authors":"J. Fjelstad","doi":"10.1109/ISEMC.2011.6038386","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038386","url":null,"abstract":"This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits are numerous. The paper will investigate the topic and look at some of the advantages and risks of electronic assembly both with solder and without.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122042524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electric field coupling suppression using via fences for magnetic near-field shielded-loop coil probes in low temperature co-fired ceramics","authors":"Yien-Tien Chou, Hsin-Chia Lu","doi":"10.1109/ISEMC.2011.6038275","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038275","url":null,"abstract":"Two types of low-cost and robust magnetic near-field probes manufactured in low temperature co-fired ceramics (LTCC) are presented in this paper. The shielded-loop coil and via fences are used in the probes to provide better electric field coupling suppression. Type I probe is designed to receive horizontal magnetic field, via fences are inserted in the loop aperture and along sides of the probe to reduce electric field coupling from sides. The inner size of the loop aperture is 700×380 μm. The flip-chip bonding, which has low insertion loss and the good shielding capability, is also used in this probe. We take this probe over a 2000-μm-wide microstrip line as device under test (DUT) in measurements, the isolation between electric and magnetic field is better than 10 dB up to 11.5 GHz. The spatial resolution of the probe is 300 μm at 11 GHz. Type II probe is designed to receive the vertical magnetic field. The detected signal is passed along a right-angle channel surrounded by cylindrical via fences. Via fences are also set around the loop and give good shielding to reduce the electric field interference. The inner diameter of the loop aperture is 670 μm. For this vertical magnetic field probe, the measured minimum isolation between electric and magnetic field is 15.17 dB at 17.35 GH up to 20 GHz. The spatial resolution of this probe is 600 μm at 16 GHz.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125311353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation on electromagnetic responses of some complex wire-surface composite objects using hybrid TDIE-TDPO based MOT method","authors":"W. Luo, W. Yin, Ming-da Zhu, J. Mao","doi":"10.1109/ISEMC.2011.6038378","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038378","url":null,"abstract":"An efficient hybrid method, based on time-domain integral equation (TDIE) and time-domain physical optics (TDPO), is proposed for investigating on electromagnetic responses of some complex wire-surface composite objects illuminated by an electromagnetic pulse (EMP), respectively. Three triangular-type basis functions are used to represent the currents on the bodies, wires, and wire/surface junctions, respectively. A set of hybrid TDIE-TDPO equations are solved by marching-on-in-time scheme (MOT). In comparison with the full TDIE-based MOT method, computational complexity is reduced drastically using our developed hybrid TDIE-TDPO method, and with the accuracy maintained successfully. Numerical results of EMP responses of some composite objects are given to demonstrate its versatility, accuracy and efficiency.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129315370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Low-frequency characterization of composite panels from a near-field magnetic shielding effectiveness measurement","authors":"G. Andrieu, J. Panh, A. Reineix, P. Pelissou, C. Girard, X. Romeuf, D. Schmitt","doi":"10.1109/ISEMC.2011.6038428","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038428","url":null,"abstract":"This paper presents a simple method allowing to obtain an homogeneous panel model from an inhomogeneous composite panel thanks to a near-field magnetic shielding effectiveness (MSE) measurement in the low frequency range (f <; 1 MHz). The method, which does not require the knowledge of the detailed internal geometry of the panel, consists in determining the “equivalent conductivity” of the homogeneous model. After the validation of the measurement setup on a copper plate of known conductivity, homogenization of 3 different samples is presented. Finally, homogenization of samples made of different inhomogeneous layers previously characterized separately is presented and validated.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128017042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A comparison of Electric Field sensors distortion characteristics in the Hermite-Gauss signal subspaces","authors":"S. S. rizi, B. Kordi","doi":"10.1109/ISEMC.2011.6038383","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038383","url":null,"abstract":"In addition to the classical time-domain distortion characteristic known as fidelity, one can evaluate sensor distortion characteristic using the transformation matrix concept in linear algebra. In this paper, electromagnetic field sensor transformation matrix is calculated based on a set of Hermite- Gauss orthonormal functions. The transformation matrices are calculated for a 5-cm Asymptotic Conical Dipole (ACD), wire monopoles of lengths 5 and 8.5 cm, and L-antennas with the same heights using the simulated voltages. The simulation is performed by solving an Electric Field Integral Equation (EFIE) on wire structures using the Method of Moments (MoM). Transformation matrices are calculated for the sensors with the same level of sensitivity as a measure of distortion. Transformation matrices are compared to each other using a numerical measure.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130012429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Opportunities in the Risk Management of EMC","authors":"K. Armstrong","doi":"10.1109/ISEMC.2011.6038452","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038452","url":null,"abstract":"It is not an exaggeration to say that we are witnessing the birth of a brand new industry Risk Management of electromagnetic compatibility (EMC) - which will be needed in most safety-related and high-reliability applications/industries. But at the moment there are (effectively) no resources available that can satisfy its requirements, either from EMC test laboratories or functional safety assessors. A great deal of work needs to be done to prepare manufacturing industry, test laboratories and safety assessors for these requirements, for which a large demand will build up by 2021. The new opportunities now available include: 1) Academic teaching at all levels 2) Academic research 3) Vocational training courses 4) Computer-aided simulation 5) Test methods and specialized test equipment 6) Verification/validation techniques other than testing 7) Development of policies and procedures 8) Safety Assessor services 9) Accreditation services. This paper briefly introduces the rapidly growing need for the above, and discusses each of these opportunities in turn.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125448229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hazards of electromagnetic radiation to ordnance (HERO) assessment of electro-explosive devices and validation of extrapolation method for estimation of the safety margin at HERO electromagnetic environments","authors":"R. Kichouliya, D. Devender, V. Ramasarma, D. Reddy, V. G. Borkar","doi":"10.1109/ISEMC.2011.6038445","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038445","url":null,"abstract":"HERO is one of the critical electromagnetic environmental effects as defined in the MIL-STD-464A. The HERO electromagnetic environment is very severe for the ship born systems, as it contains the sources of Electromagnetic environments (Radars, HF Transmitters and VHF communication systems etc.) and ordnance systems on the same platforms. Necessarily most of the ordnance system contains the EEDs/EIDs, and these are fired as and when the operation of the ordnance system is desired. HERO environment has the potential threat to cause an inadvertent actuation or firing of these ordnance systems by inducing the sufficient current in the EEDs/EIDs circuits. This results into a disaster and causing the loss of ordnance system along with collateral effects, platform, cost and human being. So now it has become essential to certify every ordnance system to be HERO safe and reliable, when it is on board or when it moving in the stock-pile to safe operation. The HERO environment defined in MIL-STD-464A calls for generation of very high field strength (i.e. 2620 V/m @ 2.7-3.6 GHz), which is really a challenge to generate inside the laboratory. So to overcome this practical difficulty the MIL HDBK-240 suggested to use extrapolation method for high fields, provided the bridge wire should exhibit the linear characteristics. The aim of this paper is to demonstrate the extrapolation method (MIL-HDBK-240) for assessing the induced current on the bridge wires at very high fields. The induced current measurement system on bridge-wire consists of Fibre-optic temperature (FOT-HERO) sensor and the signal conditioner, which works on the principle of Fabry-Perot Interferometery (FPI). To verify the extrapolation FOT-HERO sensor mounted bridge-wire will be exposed to the different electromagnetic field levels at specified spot HERO test frequencies. The measured induced currents at the lower field levels will be extrapolated to higher field level to compute the induced currents at high field levels, and then it will be compared to the actual measured results and finally with the safety margin (i.e. 15% of the Maximum No Fire Current (MNFC)) of the ordnance system.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124038056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design and development of an Equipotential Voltage Reference (grounding) system for a low-cost rapid-development modular spacecraft architecture","authors":"J. Lukash, E. Daley","doi":"10.1109/ISEMC.2011.6038387","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038387","url":null,"abstract":"This work describes the design and development effort to adapt rapid-development space hardware by creating a ground system using solutions of low complexity, mass, & cost. The Lunar Atmosphere and Dust Environment Explorer (LADEE) spacecraft is based on the modular common spacecraft bus architecture developed at NASA Ames Research Center. The challenge was building upon the existing modular common bus design and development work and improving the LADEE spacecraft design by adding an Equipotential Voltage Reference (EVeR) system, commonly referred to as a ground system. This would aid LADEE in meeting Electromagnetic Environmental Effects (E3) requirements, thereby making the spacecraft more compatible with itself and its space environment. The methods used to adapt existing hardware are presented, including provisions which may be used on future spacecraft.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129131117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Solution of time-domain MFIE and CFIE using adaptive MOO Method for transient scattering in the presence of an EMP","authors":"Ming-da Zhu, Xi-Lang Zhou, W. Yin","doi":"10.1109/ISEMC.2011.6038379","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038379","url":null,"abstract":"The adaptive marching-on-in-order method (MOO) to solve time-domain magnetic and combined field integral equations is proposed for capturing transient responses of some 3-D PEC objects illuminated by an EMP. We directly employ an exact temporal Galerkin testing with no central approximation used, and using surface current density of the object as the unknown without employing the Hertz vector. The fast Fourier transform (FFT)-based blocking scheme is further implemented. This method is similar to the improvement over the earlier MOO for solving time-domain eclectic field integral equation. Transient electromagnetic responses of some typical conductive objects are obtained and compared for validating both computational accuracy and applicability of our proposed three TDIE-MOO algorithm.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116867343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Improving the immunity of smart power integrated circuits by controlling RF substrate coupling","authors":"P. Schroter, S. Jahn, F. Klotz","doi":"10.1109/ISEMC.2011.6038282","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038282","url":null,"abstract":"This paper discusses RF substrate coupling in smart power integrated circuits. Analyses have been accomplished by measurements on wafer level. For this purpose test structures have been designed using a BCD technology (Bipolar, CMOS (complementary MOS) and DMOS (double diffused MOS)) for automotive applications. The determining parameters to RF substrate coupling have been evaluated by measuring structures with two transistors. The findings are applied to a typical smart power integrated circuit. It results in controlling RF substrate coupling and a circuit with a high degree of immunity against electromagnetic interference (EMI). The paper closes with appropriate layout recommendations.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134090471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}