{"title":"逆转电子产品的电路制造和组装过程的好处","authors":"J. Fjelstad","doi":"10.1109/ISEMC.2011.6038386","DOIUrl":null,"url":null,"abstract":"This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits are numerous. The paper will investigate the topic and look at some of the advantages and risks of electronic assembly both with solder and without.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Benefits of reversing the circuit manufacturing and assembly processes for electronic products\",\"authors\":\"J. Fjelstad\",\"doi\":\"10.1109/ISEMC.2011.6038386\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits are numerous. The paper will investigate the topic and look at some of the advantages and risks of electronic assembly both with solder and without.\",\"PeriodicalId\":440959,\"journal\":{\"name\":\"2011 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2011.6038386\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2011.6038386","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Benefits of reversing the circuit manufacturing and assembly processes for electronic products
This paper presents concepts for assembling electronic products without solder by building circuit layers directly atop the components, obviating the need for solder and its many associated problems. Interconnects are made by copper plating directly to the component terminations. The potential mechanical, electrical, and high-frequency performance benefits are numerous. The paper will investigate the topic and look at some of the advantages and risks of electronic assembly both with solder and without.
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