2018 IEEE International Conference on Advanced Manufacturing (ICAM)最新文献

{"title":"A Framework for Implementation of 3D-printing of Manufacturing Equipment","authors":"Kampker Achim, T. Johannes, Kawollek Sebastian","doi":"10.1109/AMCON.2018.8614948","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614948","url":null,"abstract":"The strengths of Additive Manufacturing (AM) lie in particular with components in small quantities. For this reason, manufacturing equipment design seems intuitively predestined for AM. This work deals in detail with why, despite some lighthouse projects, it has not yet been possible to establish additive production on a large scale in special equipment design. Based on this, a methodology for the implementation of AM for special equipment construction is presented.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127809119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Real-Time Collision Avoidance for Five-Axis CNC Machine Tool Based on Cyber-Physical System","authors":"Wen-Yang Chang, Bo-Yao Hsu, Jia-Wei Hsu","doi":"10.1109/AMCON.2018.8615042","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8615042","url":null,"abstract":"In this study, we used the game engine to develop a collision avoidance system of machine tools for low cost and quick setup applications. It can make the physical machine and the virtual reality to approximate the synchronization and realization of the cyber-physical system. Results showed that if the feed rate of the physical machine tools is 150% during processing, the executive speed of virtual machine tools can also run at 1.3 times for pre-reading NC codes. The study realizes the real-time collision avoidance for Five-Axis CNC machine tool based on the cyber-physical system.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127876511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Study on the Education and Learning Path for Construction Engineering Cost Professionals in Science, Technology, Engineering and Mathematics","authors":"Liuqun Dong, Lizhi Cui, W. Hsu","doi":"10.1109/AMCON.2018.8614950","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614950","url":null,"abstract":"This study mainly explores the science, technology, engineering and mathematics (STEM) training courses for the engineering cost professionals. By means of literature review, in-depth interview, expert questionnaire and other research methods, the traditional education courses are summed up and classified; and the stem education courses are systematized by means of the Interpretative Structural Modeling Method, in order to construct the learning path. After gathering the opinions, by analysis of the learning path for stem training courses, the teaching system for the engineering cost professionals in theoretical and practical learning is developed to achieve the better educated effects. The research and analysis results can be used as a reference for the STEM training courses for the engineering cost professionals.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129193051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Application of UVA in Soil and Water Conservation: Preparation of Planting Materials for UVA","authors":"Shih-Yi Fan, Ming-Fa Tsai, L. Chou, Y. Lai, Maw-Tien Lee","doi":"10.1109/AMCON.2018.8615083","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8615083","url":null,"abstract":"Taiwan is an island-type country with possible debris flow in the mountains. Therefore, strengthening soil and water conservation work to prevent natural disasters is a continuous and necessary work. However, people and machines are not easy to reach the bare land on the mountain, so the planting is difficult to do. In this study we intend to develop planting materials that can be carried and spread by UAV for the purpose of carrying out the work of bare ground planting in the mountains. A biodegradable polymer, polyacrylamide (PAM), was chosen as the matrix. By combining other materials, such as grass seeds, fertilizers and other additives, the seeding granules were produced for drone throwing. Because the matrix affects the distribution of the granules on the ground after throwing, in this study the morphology of PAM on silica surface was observed by an optical microscope (OM) and an atomic force microscope (AFM) to understand the interaction between the matrix and the ground. And in order to understand the effects of the matrix on the seed germination, ryegrass seeds were selected for the germination test. OM images show that the PAM film on the glass slide expands outward from the center and branches therefrom, showing a dense dendritic structure, and the closer to the center point, the more the dendritic structure. AFM images depict that the granular structure formed at the central portion is large, the pores between the granular portions are also large, and the granular structure formed at the interval portion is small and dense. PAM solutions on the glass slide do not immediately flow outward due to the large viscosity. However, the evaporation of water induces the stretch of PAM molecule, and makes it gradually deposits and adsorbs on the glass slide. All the facts give the evidences that PAM can be spread on silicon oxide and the adsorption effect is very good. The germination experiment showed that the planting granule formula used had no effect on the germination of ryegrass, and had the effect of promoting growth of the germinated young grass. Finally, the artificial and UVA throwing granule tests showed that the planting granules could successfully attached to the ground or slope, and the grass germinated and grew well.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"267 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122179510","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation of Granular Temperature of Abrasive Particles in the EKF-CMP System","authors":"Li-Shin Lu, Yu-Ming Lin, C. A. Chen","doi":"10.1109/AMCON.2018.8614792","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614792","url":null,"abstract":"Chemical mechanical planarization/polishing (CMP) is an important process in semiconductor manufacturing. This process integrates the chemical energy and physical energy to reduce the thickness and planarize the surface of wafer. In CMP process, the slurry is a key material to use its silica abrasive nanoparticles distributed on the polishing pad to cut the passivation layer of the wafer surface. In our previous researches, electro kinetic force (EKF) is applied to assist CMP process (EKF-CMP system) with great development potential. This study uses COMSOL Multiphysics analysis software with three modules, electric current, laminar flow and particle tracing, to simulate the dynamic behaviors of abrasive nanoparticles in the slurry under the influence of electro osmosis flow. The results show that the design with positive and negative staggered electrodes produces the convection flow pattern of abrasive particle in the slurry. The simulation result of particles’ velocity field is in good agreement with the experimental result by Particle Image Velocimetry (PIV) method. To quantify the random motions of particles, this study defines the granular temperature as the specific fluctuation kinetic energy of particles. The granular temperature is introduced to be an index to measure the strength of particles fluctuation in the slurry. With the design of bidirectional electrode, the granular temperature increase in both Cu-Blanket film CMP and glass CMP systems. For Cu-Blanket film CMP system, EKF can improve 22.29% of material removal rate (MRR). While for glass CMP system, EKF can improve 9.52% of MRR. The Pearson correlation coefficient between granular temperature and MRR in Cu-Blanket film EKF-CMP and glass EKF-CMP systems are 0.94 and 0.91, respectively, so that the granular temperature can indicate the performance of material removal in EKF-CMP process appropriately. Appling the concept of granular temperature to investigate the particle behavior in CMP slurry is very innovative. The results of this study can be used as a reference for the essential design of the EKF-CMP system.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114188800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modeling for Locating Pin Adjustment on Fixtures to Improve Positioning Accuracy of Parts","authors":"Y. Liu, Yuwen Li, Xin Wen","doi":"10.1109/AMCON.2018.8615050","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8615050","url":null,"abstract":"Many machining operations require fixtures for part positioning and clamping on CNC machine tools. To achieve required positioning accuracy of the part relative to the machine tool, the fixture usually provide locating pins which are in contact with some datum surfaces on the part. Traditionally, high precision is required for the manufacturing and assembly of the fixture for the part positioning accuracy. With the development of CNC techniques, the positioning error of the part can be compensated by the machine tool to lower the accuracy requirement for the fixture. However, six or more axes are required for the machine tool to compensate for all the position and orientation errors. This paper focuses on the usage of adjustable sliding pins as an alternative method for positioning error compensation for the machine tools that are lack of sufficient mobility or fixture compensation function. In particular, this paper proposes a generic mathematical model to calculate the amount of locating pin adjustment for compensating given positioning error of part. For this purpose, the kinematic equations of the part in contact with adjustable locating pins are derived, in which the pin positions are taken into account. Then the influence of the deviations in the pin positions on the part position and orientation is formulated. The model can be used to adjust the pins for positioning error compensation for all or some degrees of freedom of the part. A simulation study on a polyhedron part with three fixed and three adjustable pins for a drilling operation has been carried out to demonstrate the effectiveness of the proposed method.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131374284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Preparation of TiO2/Single Layer Grapgene Composite Photoanodes for Dye-Sensitized Solar Cells","authors":"Jyun-Jia Wang, B. Wang, T. Wu, J. Tsai, T. Meen","doi":"10.1109/AMCON.2018.8614975","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614975","url":null,"abstract":"Dye-sensitized solar cells (DSSCs) are low-cost, simple process and promising solar cells. Single Layer Graphene(G) have good electrical conductivity, mechanical and thermal stability, and can be used as the photoanode material for DSSCs. In this study, the DSSCs were fabricated byTiO2/G composites, and compared with the properties of DSSCs which fabricated by different concentrations of Single Layer Graphene. Then the Single Layer Graphene were dispersed and fabricated into the DSSCs, compared with the DSSCs which fabricated by undispersed Single Layer Graphene. Finally, theTiO2 film and theTiO2/G film were mixed coating, and analyzed the effect of different coating sequences on DSSCs. The results indicate that Single Layer Graphene can provide a direct transmission pathway for electrons, which can enhance the transmission speed of electron and reduce the electron/hole recombination. The DSSCs fabricated by theTiO2 film and theTiO2/G film had the highest efficiency 3.6%. The DSSCs prepared by mixing theTiO2/G film with theTiO2 film can slightly improve the efficiency of the dye-sensitized battery. Compared with the DSSCs prepared fromTiO2 film, the efficiency increases slightly and the efficiency is 3.36%.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"72 1-2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114035527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Evaluate Machine Learning Models Used for Upscaling Surface Ocean CO2 Measurements","authors":"J. Zeng, Zheng-Hong Tan","doi":"10.1109/AMCON.2018.8614876","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614876","url":null,"abstract":"Upscaling measurements from ground-based sites or underway monitoring to a regional or global scale provides important information to policy makers for environmental management and to researchers looking for a better understanding of relevant issues. We used the reconstruction of global surface ocean CO2 as an example to evaluate the performance of four machine learning models: Random Forest (RF), Support Vector Machine (SVM), Feedforward Neural Network (FNN), and Self-Organization Map (SOM). The results show the performance from high to low as RF, SVM, FNN, and SOM. However, the overall differences of modelled CO2 among the four models are insignificant. Considering the discrete characteristics of RF, it is recommended to use SVM or FNN when the number of data point is not large and continuous estimations are expected. RF has an advantage particularly when the number of data points is very large and the data include categorial variables.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115593584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Framework for Smart Manufacturing Systems Based on the Stakeholders' Value","authors":"Y. Qu, X. Ming, S. Qiu, Z. W. Liu, X.Y. Zhang, Z. Hou","doi":"10.1109/AMCON.2018.8614782","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614782","url":null,"abstract":"Smart manufacturing systems (SMSs), are proposed in the era of Industry 4.0 and Industry Internet of Things, supported by the Cyber Physical Systems (CPS), Artificial Intelligent (AI), and smart sensing and cognitive technologies, as an autonomous system to better solve the problems such as personalized customization, quick response, and sustainable value added. However, existing analysis and design approaches use a narrower concept, which focuses on either knowledge, business or service aspects, neglecting to consider the stakeholders' value. In this paper, the framework of smart manufacturing systems based on the sustainable added value of stakeholders is presented. It has been suggested that reflecting upon stakeholders’ value may bring a better understanding of analyzing the SMSs paradigms.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123532218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The Development of Smart Manufacturing and Cases Study in Taiwan","authors":"T. Chan","doi":"10.1109/AMCON.2018.8614926","DOIUrl":"https://doi.org/10.1109/AMCON.2018.8614926","url":null,"abstract":"This study was aimed at evaluating the smart manufacturing and cases study in Taiwan. The industry is transforming to focus on smart technologies, high customization, and integration of total solutions. In 2016, The President of Taiwan had announced the policy of “Smart machinery Innovative Industry” initiative, according to the statistics of the International Trade Centre database, the export value of Taiwan's machinery industry was ranked 17th in the world in 2016 years, and the progress reached the 15th in the world in 2017 years. The global ranking increased by 2. According to Gardner's statistics report in 2016, the global export ranking of Taiwan's machine tools was upgraded from the 5th to the 4th. From the above important data, the Taiwan government's smart machinery program has shown initial results.Finally, this paper introduce 4 cases of smart manufacturing system solutions in Taiwan are as follow: Printed circuit board industry 、 Machine tool 、 Vehicle industry 、 Textile industry. Through smart manufacturing, turning over the previous company image as a foundry, improving the working environment, and enhancing the productivity and competitiveness of related industries","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121767348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}