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2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings最新文献

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Die size reduction by optimizing the dimensions of the vertical feedthrough pitch and sealing area in the advanced MEMS (aMEMS) process 在先进的MEMS (aMEMS)工艺中，通过优化垂直进给通节距和密封区域的尺寸来减小模具尺寸
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102380
M. M. Torunbalci, S. E. Alper, T. Akin
{"title":"Die size reduction by optimizing the dimensions of the vertical feedthrough pitch and sealing area in the advanced MEMS (aMEMS) process","authors":"M. M. Torunbalci, S. E. Alper, T. Akin","doi":"10.1109/ISISS.2015.7102380","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102380","url":null,"abstract":"This paper presents the recent reduction of the die size by 44% in the Advanced MEMS (aMEMS) process, now being compatible in size with most of the available through-wafer packaging processes while offering the unique simplicity of the aMEMS process. Size reduction is achieved by reducing the pitch of vertical feedthroughs from 700 μm down to 350 μm and the bonding area width from 300 μm down to 100 μm, approaching to the process limits and still preserving the hermeticity of the package. Both small and large dies, containing the identical resonance sensors inside for benchmarking, are produced together on the same wafer. The cavity pressures of the both dies are measured to be around 1 mTorr even after thermal cycling tests.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114639611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Shape sensing based on acceleration and magnetic sensor system 基于加速度和磁传感器的形状传感系统
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102383
A. Hermanis, R. Cacurs, M. Greitans
{"title":"Shape sensing based on acceleration and magnetic sensor system","authors":"A. Hermanis, R. Cacurs, M. Greitans","doi":"10.1109/ISISS.2015.7102383","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102383","url":null,"abstract":"We propose a method for real-time shape sensing of thin and flexible materials such as fabric. Method is based on 3-axial acceleration and magnetic sensor nodes that are embedded into the material. It is designed for new emerging applications such as smart textile and flexible electronics. Method allows easy sensor integration in material and shape model reconstruction with at least 10 frames per second utilizing conventional low-power hardware. We developed a prototype consisting of fabric with 63 sensor nodes, Bluetooth data transceiver and shape reconstruction algorithm implemented both on PC and tablet. We compared shape models obtained with our method to commercial Kinect sensor and obtained average standard deviation of less than 1 cm for more than thousand different test shapes.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134123420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Minimal realization of dynamically balanced lumped mass WA gyroscope: dual foucault pendulum 动态平衡集总质量WA陀螺仪的最小实现:双傅柯摆
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102394
D. Senkal, A. Efimovskaya, A. Shkel
{"title":"Minimal realization of dynamically balanced lumped mass WA gyroscope: dual foucault pendulum","authors":"D. Senkal, A. Efimovskaya, A. Shkel","doi":"10.1109/ISISS.2015.7102394","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102394","url":null,"abstract":"We report a new type of MEMS rate integrating gyroscope. The Dual Foucault Pendulum (DFP) gyroscope consists of two dynamically equivalent, mechanically coupled proof masses, oscillating in anti-phase motion, creating a dynamically balanced resonator with x-y symmetry in frequency and damping. Phase synchronization is established by mechanical coupling of the two proof masses, whereas quadrature suppression is achieved by four differential shuttle pairs placed in-between. Dual axis tuning fork behavior provides vibration immunity and anchor loss mitigation, resulting in a Qfactor over 100,000 on both modes at a center frequency of 2.7 kHz. Whole angle mechanization is demonstrated by FPGAbased closed loop control of the gyroscope, showing a scale factor variation of 22 ppm RMS over 2 hours of measurement. We believe Dual Foucault Pendulum is the minimal realization of a dynamically balanced lumped mass whole angle (WA) gyroscope.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115297535","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
A wafer level vacuum packaged silicon vibration beam accelerometer 晶圆级真空封装硅振动束加速度计
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102378
G. Xia, A. Qiu, Q. Shi, Yan Su
{"title":"A wafer level vacuum packaged silicon vibration beam accelerometer","authors":"G. Xia, A. Qiu, Q. Shi, Yan Su","doi":"10.1109/ISISS.2015.7102378","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102378","url":null,"abstract":"This paper gives a detail description of a silicon vibration beam accelerometer which was fabricated by SOI technology and encapsulated in a wafer level vacuum package. The wafer level package gives advantage of small size and low cost, but also produce additional residual stresses that increased the temperature coefficient of the vibration beams. To solve this problem, the sensing structure was redesigned and reduce the temperature coefficient from 50Hz/°C to 10Hz/°C. Moreover, with carefully assembly, control and measure technology, the accelerometer system achieved reliable performance. Experiment result shows that the scale factor was 120Hz/g, measurement rang was ±50g with non-linearity coefficients of 19μg/g2 and 0.06μg/g3, resolution was 10μg/sqrt(Hz), bias Allan variance was 10μg.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116907258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
On the stability of atom chip interferometers 原子芯片干涉仪的稳定性研究
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102388
M. Squires, B. Kasch, S. Olson, James A. Stickney
{"title":"On the stability of atom chip interferometers","authors":"M. Squires, B. Kasch, S. Olson, James A. Stickney","doi":"10.1109/ISISS.2015.7102388","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102388","url":null,"abstract":"We calculate the sensitivity to changes in temperature and current for a resonant atom interferometer device based on oscillations of a cold, magnetically trapped cloud in a two wire harmonic trap. The sensitivity of the trap frequency and area enclosed are estimated for typical trap parame- ters. Based on this analysis, the frequency and area enclosed are both more sensitive to the stability of the current creating the magnetic eld than the thermal expansion of the substrate. Current experimental progress measuring the frequency stability of current atom chip devices is outlined.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121493501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Oxide-coated polysilicon disk resonator gyroscope (DRG) within the wafer-scale encapsulation process 氧化包覆多晶硅圆盘谐振陀螺仪(DRG)的晶圆级封装工艺
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102392
C. Ahn, E. Ng, V. Hong, J. Huynh, T. Kenny, S. Wang
{"title":"Oxide-coated polysilicon disk resonator gyroscope (DRG) within the wafer-scale encapsulation process","authors":"C. Ahn, E. Ng, V. Hong, J. Huynh, T. Kenny, S. Wang","doi":"10.1109/ISISS.2015.7102392","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102392","url":null,"abstract":"This paper reports fabrication and preliminary test results of oxide-coated polysilicon disk resonator gyroscopes (DRG) in a wafer-scale encapsulation. With this thin oxide coating, surface roughness of a fully encapsulated device was reduced by 10 × increasing the uniformity across the wafer. We also demonstrate the effects of oxide coating on key performance parameters of resonant-based sensors such as temperature coefficient of frequency (TCF) and quality factor (Q). Preliminary results show more than 30% increase in Q (75k) at 217 kHz resonant frequency.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116555326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Trends in inertial sensors and applications 惯性传感器及其应用的发展趋势
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102358
E. Benser
{"title":"Trends in inertial sensors and applications","authors":"E. Benser","doi":"10.1109/ISISS.2015.7102358","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102358","url":null,"abstract":"Inertial sensors have now become quite ubiquitous as many devices and systems rely on them to serve a broad variety of applications. Where inertial sensors were once characterized as expensive precision instruments today lower performance inertial sensors are manufactured by the billions of units per year at a cost of a few cents per sensor while higher performance gyros and accelerometers have achieved unprecedented performance and reliability at much reduced prices. This proliferation of inertial sensing has been driven by, and has enabled, advances in sensor technology as well as an interesting diversity of applications. In this paper some observations of the historical trends in inertial sensing and devices will be provided. The significant applications that have stimulated and supported inertial sensor development and manufacturing will also be presented. Extrapolation of these trends into the future will be attempted as a group of promising future inertial sensor technologies and potentially new applications is discussed.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127403430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 33
Continuously self-calibrating CVG system using hemispherical resonator gyroscopes 半球形谐振陀螺仪连续自校准CVG系统
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102362
A. Trusov, M. Phillips, G. H. Mccammon, D. Rozelle, A. D. Meyer
{"title":"Continuously self-calibrating CVG system using hemispherical resonator gyroscopes","authors":"A. Trusov, M. Phillips, G. H. Mccammon, D. Rozelle, A. D. Meyer","doi":"10.1109/ISISS.2015.7102362","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102362","url":null,"abstract":"This paper reports development and validation over temperature of a drift free Coriolis Vibratory Gyroscope (CVG) system using two 30 mm diameter HRGs mechanized as inner electrode milli-HRG with IRAD CVG electronics. The system employs mode reversal for bias and pattern angle modulation for scale factor self-calibration. Mission software runs on a standard PC and performs sequencing of the self-calibration and fusion of the individual gyro data into a single uninterrupted delta-theta stream. Extensive rate table testing of the system was conducted to characterize performance. Tests demonstrated a 2-3 orders of magnitude improvement of stability over individual gyros in a 30 C temperature range, and a stability of 100 micro-deg/hr without temperature control at a week time scale. These results provide a new level of validation for self-calibrated CVG system approach and its revolutionary potential to overcome the CVG accuracy limitations and enable high performance free inertial applications with unprecedentedly low SWaP and factory calibration cost. Although the work is still ongoing, we have not yet discovered the limits of self-calibration.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"5 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132581145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Disk resonator gyroscope with whole-angle mode operation 圆盘谐振陀螺仪与全角度模式操作
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102360
P. Taheri-Tehrani, Oleg Izyumin, I. Izyumin, C. Ahn, E. Ng, V. Hong, Yushi Yang, T. Kenny, B. Boser, D. Horsley
{"title":"Disk resonator gyroscope with whole-angle mode operation","authors":"P. Taheri-Tehrani, Oleg Izyumin, I. Izyumin, C. Ahn, E. Ng, V. Hong, Yushi Yang, T. Kenny, B. Boser, D. Horsley","doi":"10.1109/ISISS.2015.7102360","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102360","url":null,"abstract":"We present a demonstration of a whole-angle mode operation of a 0.6 mm single-crystal silicon disk resonator gyroscope (DRG). This device has a Q factor of ~80,000 and a resonant frequency of ~250 kHz and is fabricated in the epi-seal process. Discrete-time control algorithms for rate-integrating gyro operation were implemented based on Lynch's algorithm. Despite the fact that this DRG is over 5 orders of magnitude smaller than the 58 mm HRG, the device's error sources are shown to be accurately modeled by the basic error models developed by Lynch.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128710795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 44
Effect of metal annealing on the Q-factor of metal- coated fused silica micro shell resonators 金属退火对金属包覆石英微壳谐振器q因子的影响
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings Pub Date : 2015-03-23 DOI: 10.1109/ISISS.2015.7102361
T. Nagourney, J. Cho, A. Darvishian, B. Shiari, K. Najafi
{"title":"Effect of metal annealing on the Q-factor of metal- coated fused silica micro shell resonators","authors":"T. Nagourney, J. Cho, A. Darvishian, B. Shiari, K. Najafi","doi":"10.1109/ISISS.2015.7102361","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102361","url":null,"abstract":"This paper reports on the effect of annealing thin metal films coated on high-Q fused silica shell resonators. While the ring-down time of some resonators improves with annealing, others degrade. Investigations include the effect of annealing on metal film stress, roughness, and elemental composition, as well as the effect of film thickness and roughness on quality factor. Increased tensile stress and film roughness are observed after annealing; it is suspected that these changes are due to formation of intermetallic grain boundaries that result in film densification and the formation of hillocks. Increasing film thickness reduces Q, though it is unlikely due to thermoelastic damping. Surface roughness tends to increase with film thickness, but does not appear to have a direct correlation with Q.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"133 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115931747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
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