R. Forke, K. Hiller, S. Hahn, S. Konietzka, T. Motl, D. Köhler, S. Heinz, D. Billep, T. Gessner
{"title":"Yet another tuning fork gyroscope","authors":"R. Forke, K. Hiller, S. Hahn, S. Konietzka, T. Motl, D. Köhler, S. Heinz, D. Billep, T. Gessner","doi":"10.1109/ISISS.2015.7102359","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102359","url":null,"abstract":"This paper reports on the development of a micromechanical vibrating mass tuning fork gyroscope with coupled drive and sense modes. The mechanical structure has been designed to have a first anti-phase drive mode and a second anti-phase sense mode. The frequencies of all other modal modes are higher. The micromechanical structure is fabricated with a cavity SOI technology called BDRIE [1]. The analog ASIC for very low noise readout (<; 50 nV/rtHz) is placed on the MEMS and is connected symmetrically with wire bonds. MEMS and ASIC have been co-designed to best fit physically and electrically to each other.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124269246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"How to invent (or not invent) the first silicon MEMS gyroscope","authors":"M. Weinberg","doi":"10.1109/ISISS.2015.7102372","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102372","url":null,"abstract":"Draper designed and constructed traditional mechanical gyroscopes for Apollo and for strategic guidance systems. In 1984, Draper started the double gimbal gyro, which led to the silicon-on-glass tuning fork gyroscope that reported the first useful performance of a silicon MEMS gyroscope in 1992. This work became the basis for the successful Honeywell MEMS inertial measurement units and the starting point for other MEMS angular rate sensors. This paper will discuss considerations that were factored into the first tuning fork. These known factors included the thin, available proof masses, efficient mass use, quadrature stiffness, fluid gas “surf boarding”, noise sources, frequency variation, and modal response. Unconsidered phenomena, such as glass charging, stiffness non-linearity, comb drive cross-coupling and electrical feed through, were designed around on the fly. Other fortuitous events such as material and parameter selection which avoided thermoelastic damping, which was not understood in MEMS until 2003, the limits of quadrature trimming, and the addition of key personnel, will be covered. In summary, demonstrating the first silicon MEMS gyroscope required wellapplied engineering and a bit of serendipity.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126492758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration","authors":"A. Efimovskaya, D. Senkal, Sina Askari, A. Shkel","doi":"10.1109/ISISS.2015.7102373","DOIUrl":"https://doi.org/10.1109/ISISS.2015.7102373","url":null,"abstract":"This paper reports a prototype of miniature, <;50 mm3, Timing and Inertial Measurement Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a wafer-level fabrication of high aspect ratio single-axis sensors, interconnected by flexible polyimide hinges, and then folded into a 3-D configuration, typically in a shape of cube or prism. Co-fabricated thru-wafer interconnects enable interfacing sensors on the device side of the TIMU with signal conditioning electronics potentially integrated inside a folded 3-D structure. We report a TIMU prototype with all 7 sensors operational, thus demonstrating a feasibility of the proposed fabrication approach. In this paper, we emphasize the characterization of the low-noise accelerometers, implemented on the TIMU sidewalls, demonstrating VRW of 0.057 m=s2= p h and bias instability of <;0.2 mg.","PeriodicalId":430128,"journal":{"name":"2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129593864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}