Microelectronic and MEMS Technologies最新文献

{"title":"Experimental investigation, modeling, and simulations for MEMS-based gas sensor used for monitoring process chambers in semiconductor manufacturing","authors":"I. Jafri, F. Dimeo, J. Neuner, S. DiMascio, J. Marchetti","doi":"10.1117/12.425321","DOIUrl":"https://doi.org/10.1117/12.425321","url":null,"abstract":"There is a growing demand from the semiconductor industry for multi-component gas sensing for advanced process control applications. Microelectromechanical systems (MEMS) based integrated gas sensors present several advantages for this application such as ease of array fabrication, small size, and unique thermal manipulation capabilities. MEMS based gas sensors that are produced using a standard CMOS (Complimentary Metal Oxide Semiconductor) process have the additional advantages of being readily realized by commercial foundries and amenable to the inclusion of on-chip electronics. In order to speed the design and optimization of such integrated gas sensors, a commercial software package IntelliSuiteTM was used to model the coupled thermo-electro-mechanical responses of devices known as microhotplates. Models were built based on the GDSII formatted mask layout, process sequences, and layer thicknesses. During these simulations, key parameters such as device design and structure were investigated, as well as their effect on the resultant device temperature distribution and mechanical deflection. Detailed analyses were conducted to study the resonance modes for different sensor configurations, such as fixed-end and springboard arrangements. These analyses also included a study of the effect of absorbed material on device natural frequency. The modeling results from this study predict that the first three resonant frequency modes for these devices are in the 612 to 1530 kHz range for an all pinned device, and 134 to 676 kHz for a springboard arrangement. Furthermore, the modeling suggests that the resonant frequencies will decrease linearly as a function of increasing absorbed mass, as expected for a simple spring model. The change in resonant frequency due to mass absorption is higher for an all-pinned arrangement, compared to a springboard arrangement, with the second and third (twisting mode) showing the largest change. Thermo-electro-mechanical simulations were also performed for these devices, and the predicted mechanical deformations resulting from applied voltage compare favorably with experimental observations.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121237428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Operation cycle modeling for electrostatic-type microrelay","authors":"G. I. Efremov, N. Mukhurov","doi":"10.1117/12.425317","DOIUrl":"https://doi.org/10.1117/12.425317","url":null,"abstract":"Micro-switching devices, in particular, micro-relays occupy a prominent place in the family of MEMS/MOEMS devices. Such devices offer an advantage of insignificant power consumption and good compliance with requirements of integrated microelectronics technology. This paper presents theoretical analysis of the micro-relay operation cycle as a basic process for designing various miniature threshold devices. It is known that operation of electrostatic micro-relays is the result of interaction of active electrostatic forces arising between control circuit electrodes and reactive mechanical forces created by elastic holders of a movable electrode.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127052331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Microwave frequency acoustic resonators implemented on monolithic Si/AIN substrates","authors":"C. Caliendo, E. Verona, A. Cimmino","doi":"10.1117/12.425331","DOIUrl":"https://doi.org/10.1117/12.425331","url":null,"abstract":"Basing on the performances of high quality AlN piezoelectric films, acoustic resonators exploiting the propagation of both surface and bulk waves (SAW, BAW) and operating at microwave frequencies have been studied and experimented. Because of the high values of the acoustic wave velocities in both AlN and Si substrates, high frequency operations can be easily achieved. The expected frequency limit can be so high as 5 GHz and 10 - 15 GHz for SAW and BAW devices, respectively.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117337758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Self-parking fiber and self-latching vertical mirror for fiber optical switch array","authors":"S. Shen, C. Pan, H. Chou","doi":"10.1117/12.425328","DOIUrl":"https://doi.org/10.1117/12.425328","url":null,"abstract":"The paper presents an innovative concept of self-parking ideal in v-groove and self-latching vertical mirror on the suspension diaphragm with technique out of plane fiber-optical switch arrays was fabricated. The self-parking ideal offers an integration by which the distance between optical fiber and mirror can be minimizes. The self-latching vertical mirror located on the suspension diaphragm that is supported by four cantilever beams. At first, it is achieved by bulk micromachining and is ablated by mask projection of 248 nm excimer laser. The vertical mirror structure was fabricated by thick photoresist as SU-8 through UV lithography and then sputters gold films. The fiber-optical switch solves in plane micro-optical that require large moving space, microassembly problem of fiber to mirror distance and reducing the roughness of mirror surface. In the experiment, out of plane micro-optical switch are successfully achieved by above key process. By the measurement of roughness of mirror must be less than 20 nm rms. The reflectivity of the gold films mirror by a wavelength of 1310 nm is higher than 85%. The micro-optical switch has maximum displacement 48 micrometers and switching time is below 0.4 ms with driving voltage 100 V DC.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131224009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Microfabrication and application of reservoir pins for liquid transfer in biotechnology","authors":"Jonathan Pearson, D. Moore, W. Milne, Alastair J. W. Taylor, S. Elmes, Martin Davies","doi":"10.1117/12.425313","DOIUrl":"https://doi.org/10.1117/12.425313","url":null,"abstract":"Microarraying involves laying down genetic elements onto a solid substrate for DNA analysis on a massively parallel scale. Microarrays are prepared using a pin-based robotic platform to transfer liquid samples from microtitre plates to an array pattern of dots of different liquids on the surface of glass slides where they dry to form spots diameter < 200 micrometers . This paper presents the design, materials selection, micromachining technology and performance of reservoir pins for microarraying.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132160775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Suspended substrate stripline structures evaluation for millimeter-wave circuits application","authors":"J. S. Fu, Chao Lu, Boon Chim Kwok, Wendy Y. Lee","doi":"10.1117/12.425305","DOIUrl":"https://doi.org/10.1117/12.425305","url":null,"abstract":"Suspended Substrate Stripline (SSS) is a printed circuit technology that can be used for both broadband and narrowband filters in highpass, lowpass, bandpass, bandstop and multiplexer form. It has been widely adopted in a variety of filter designs in the upper microwave and lower millimeter-wave frequency. This paper discusses two methods of designing a suspended substrate stripline bandpass filter. The first method is based on the design equations for the capacitive transmission line filter. The second method is based on the design procedure for broadside- coupled suspended stripline. Investigation has been made so as to determine which of these two methods is a more suitable choice for incorporating into the final finline mixer design operating at 35 GHz.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122429410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Micro-CT for nondestructive 3D reconstruction of MEMS and sensors","authors":"A. Sasov","doi":"10.1117/12.425326","DOIUrl":"https://doi.org/10.1117/12.425326","url":null,"abstract":"The combination of x-ray microscopy with tomographical reconstruction allows getting 3D information about the internal microstructure by a non-destructive way. A desktop high- resolution X-ray micro-CT (microtomograph) has been developed for 3D reconstruction and realistic visualization of the internal microstructure with spatial resolution in the micron range. The instrument was successfully tested for inspection, defectoscopy and back engineering in MEMS and integrated multichip sensors.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"4407 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129308047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of a laser micromachining toolbox and its application to the production of 3D microstructures","authors":"J. Greuters, N. Rizvi","doi":"10.1117/12.425325","DOIUrl":"https://doi.org/10.1117/12.425325","url":null,"abstract":"As laser micromachining has developed in recent years, there has emerged a need for the simplification of the process to produce MEMS structures where the stages of manufacture do not require an in-depth knowledge of laser micromachining techniques. This paper describes the initial stages of such an approach - the laser micromachining 'toolbox' - which enable the optimum machining choices to be made from various design requirements. Some of the elements of the toolbox are introduced and quantified in the particular case of excimer laser micromachining. These features are then used to produce a 3D microstructure to demonstrate the capabilities of this approach. Future developments in this area are discussed.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131397023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Wireless surface acoustic wave and MEMS-based microsensors","authors":"V. Varadan, V. Varadan","doi":"10.1117/12.425310","DOIUrl":"https://doi.org/10.1117/12.425310","url":null,"abstract":"The integration of SAW (Surface Acoustic Wave), MEMS and required microelectronics and conformal antennas to realize programmable microsensors suitable for many engineering and biomedical applications will be presented in this talk. This unique combination of technologies results in novel conformal sensors that can be remotely sensed by a wireless communication system with the advantage of no power requirements at the sensor site (passive sensor). The required features in many of these applications are high precision, wide dynamic range and wide frequency range. MEMS-SAW based devices presented possess typical advantages of MEMS sensors including the additional benefits of robustness, excellent sensitivity, surface conformability and durability. After a brief overview of SAW sensors and MEMS, the paper is focused on the design and fabrication of MEMS devices for a few engineering applications such as accelerometer and gyroscopes for automobile, inertial navigation sensors and tire pressure sensor.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"4407 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130501347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools","authors":"A. J. Pang, M. Desmulliez","doi":"10.1117/12.425318","DOIUrl":"https://doi.org/10.1117/12.425318","url":null,"abstract":"In this paper, diaphragm deflection and output voltage obtained by applying a series of pressure loads to a silicon piezoresistive micro-diaphragm with built-in edges are presented. A silicon pressure sensor with diaphragm of 1 mm in length and 10 mm in thickness is modelled. Finite Element Analysis results are compare with other experimental and numerical results. A series of simulation on sensor with diaphragm of 3.4-mm in length and various thicknesses, meshing densities and resistor lengths is performed. Discussion of results are based upon (1) effect of different resistor lengths on output voltage and sensitivity and (2) effect of different diaphragm thicknesses on output are presented.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"710 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115126112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}