2015 16th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第3页

Low temperature hermertic packaging with Ag sintering process 银烧结低温密封包装工艺

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236821

Lingen Wang

{"title":"Low temperature hermertic packaging with Ag sintering process","authors":"Lingen Wang","doi":"10.1109/ICEPT.2015.7236821","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236821","url":null,"abstract":"MEMS devices often require to be hermetically packaged under a certain environment. In particular, hermetic packaging provides protection of MEMS structure from dust, humidity, corrosion, etc, isolation from thermo-mechanical stress on the package (during handling, die bonding, during operation. Some MEMS devices is sensitive to the related process temperature. The Hermetic packaging can be realized with soldering, electrode or laser welding, etc. However, local process temperature for welding temperature can up to more than 1000 °C, the soldering process is also more than 300 °C, some temperature sensitive MEMS device can not stand the process temperature more than 200-250 °C. This paper introduces lowcost and low temperature hermetic sealing process. During the sintering process, the sintering material is heated to a temperature below the melting point, the atoms in the powder particles diffuse across the boundaries of the particles, fusing the particles together and creating one solid piece Ag. The final Sintered Ag Structure is with uniform microstructure with typically 85% densification, even pure silver. This paper also introduces real-time dynamic insert control technology to control precisely pressure applied on the sintering Ag paste or film. With the dynamic insert, each device is applied the same pressure independent on the large tolerance.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115996962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

W2W wafer level vacuum packaging of MEMS devices using solder W2W晶圆级真空封装MEMS器件采用焊料

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236607

Honglin Zhang, B. An, Chenxu Niu

引用次数: 0

Low loss CCTO@Fe3O4/epoxy composites with matched permeability and permittivity for high frequency applications 低损耗CCTO@Fe3O4/环氧复合材料具有匹配的磁导率和介电常数，适用于高频应用

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236795

Ming Wang, Wenhu Yang, Shuhui Yu, R. Sun, W. Liao

{"title":"Low loss CCTO@Fe3O4/epoxy composites with matched permeability and permittivity for high frequency applications","authors":"Ming Wang, Wenhu Yang, Shuhui Yu, R. Sun, W. Liao","doi":"10.1109/ICEPT.2015.7236795","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236795","url":null,"abstract":"With the rapid development of science and technology progress, the study and preparation of polymer composite materials with multiple properties has become a hot research topic. In this paper, nano-sized CCTO (CaCu3Ti4O12) and CCTO@Fe3O4 core-shell nanoparticles were prepared using wet chemical method. The CCTO@Fe3O4 nanoparticles were characterized by XRD and SEM. The results suggested that the diameter of CCTO is about 500 nm and a Fe3O4 shell layer was deposited on the surface of CCTO particles. The epoxy composites consisting of CCTO and CCTO@Fe3O4 fillers were prepared, respectively. The dielectric and magnetic properties of the composites were discussed and analyzed at 108-109 Hz. The results show that the permittivity of the composites decreases with the increasing weight ratio of Fe3O4/CCTO, while the permeability was enhanced. The dielectric and magnetic loss tangent were increased because of Fe3O4 magnetic shell. All these results suggest that the CCTO@Fe3O4/epoxy composite films may be used as an new electromagnetic shielding material.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"62 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117225036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Preparation and characterization of a two-component silicone gel sealant 双组份硅胶密封胶的制备与表征

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236711

Shibin Li, Dayong Gui, Weijian Xiong, Wei Chen, Yangyang Zong, Huan Zhang, Jinglong Ma

引用次数: 1

Research on the impact of heat treatment on coating quality and reliability of welding after plating nickel 热处理对镀层质量及镀镍后焊接可靠性的影响研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236825

Dongmei Li, Jinchun He, Xiaocheng Feng, B. Lian, Yong Wang

引用次数: 0

Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills 深入了解二氧化硅填料的表面羟基在产生的下填料的体积特性中的作用

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236580

Gang Li, Pengli Zhu, Q. Guo, T. Zhao, D. Lu, R. Sun, C. Wong

{"title":"Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills","authors":"Gang Li, Pengli Zhu, Q. Guo, T. Zhao, D. Lu, R. Sun, C. Wong","doi":"10.1109/ICEPT.2015.7236580","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236580","url":null,"abstract":"The advances of flip-chip technology have driven the development of both underfilling processes and underfill materials. Current underfill material is mainly silica filled liquid epoxy encapsulant and their properties depends to a large extent on the filler factors such as loading, size and size distribution, shape, and especially surface chemistry state. To illustrate this point, in our study, monodisperse spherical SiO2 particles with plenty of hydroxyl groups have been synthesized via the Stöber process and further thermally treated to obtain -OH-free SiO2 particles. Then the anhydride based underfill filled with the two types of silica filler were prepared and their performances were evaluated comparatively in order to provide insights into the role of intrinsic surface hydroxyl of the silica fillers in the bulk properties of resulting underfills. We found that as compared to the -OH-free SiO2 filled epoxy underfills, the presence of the surface -OH groups of silica lead to negative effects on the rheological, thermomechanical as well as reliability properties of resulting underfills, such as a sharper viscosity increase with time, an obvious decrease in glass transition temperature (Tg), the interfacial thermal stresses harder to eliminate, a much higher moisture absorption. Therefore it was necessary to remove the surface -OH groups of SiO2 fillers through pre-heat treatment to develop high performance underfills.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130180976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

A novel dsign of UWB microstrip high-pass filter 一种新型超宽带微带高通滤波器的设计

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236856

Huijun Feng, Honglun Yang, Weiqin Chen

引用次数: 1

Design and experimental study on droplet-on-demand jetting system for multi-materials 多材料按需喷射液滴系统设计与实验研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236777

Xiayun Shu, Dan Xie, Xue-feng Chang, Jian Wang, An Xie, Liang Yang

{"title":"Design and experimental study on droplet-on-demand jetting system for multi-materials","authors":"Xiayun Shu, Dan Xie, Xue-feng Chang, Jian Wang, An Xie, Liang Yang","doi":"10.1109/ICEPT.2015.7236777","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236777","url":null,"abstract":"To satisfy the increasing demand for multi-material dispensing in microelectronics industry, this paper presents a multi-dispensing-module droplet-on-demand printing machine. The dispensing- module consist a pneumatic diaphragm droplet generator for molten metal, a piezoelectric piston droplet generator for low viscosity fluid and a mechanical valve droplet generator for high viscosity fluid. Image acquisition system with digital and analog camera for the visual guiding and droplet producing process image collection are established. A three dimensional stage and a rotary stage with motion card and PC (personal computer) forms the positioning system to realize the accurate position of droplet jetting. This data-driven nature of proposed structure greatly improves the system flexibility with which the user can dynamically configure the desired materials for microelectronics manufacturing and assembling. Experimental study on the printing machine for molten metal, mixture of DI water and glycerin solution, and epoxy resin was carried out. The result of the present work implied that the developed multi-dispensing-module droplet-on-demand system can achieve a flexible and friendly user interface, while dispensing a wide range of functional materials using various types of droplet generators.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131984119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Study on the oil-filled isolated pressure sensor by a fluid-solid coupling method 充油隔离压力传感器的流固耦合研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236690

Qiang Dan, Xuebing Yuan, Quan Zhou, Sheng Liu

{"title":"Study on the oil-filled isolated pressure sensor by a fluid-solid coupling method","authors":"Qiang Dan, Xuebing Yuan, Quan Zhou, Sheng Liu","doi":"10.1109/ICEPT.2015.7236690","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236690","url":null,"abstract":"Although MEMS (Micro Electro-Mechanical System) pressure sensor has been a considerably mature technology and successfully applied in various fields, Packaging is still a major challenge. For the application in harsh environment such as electrolysis, polarization, particulate contamination, corrosion, stiction and excessive heat dissipation, usually, the oil-filled isolated packaging strategy with a steel corrugated diaphragm would be used. Packaging effects of corrugated diaphragm characteristics and volume expansion of oil on sensor performance were studied by some researchers, while, previous researches simply focused on the corrugated plate or just considered the oil as an elastic material without the coupling effect between them. In this paper, a fluid-solid coupling model with the oil as a compressible fluid being simulated by the hydrostatic fluid element was established. The geometric features of corrugated diaphragm and the compression performance of oil were taken into consideration. The results show that more waves, smaller volume of oil would be preferred, and for a low pressure range, almost several kilopascal, the volume is the dominant factor for given specific oil. In order to verify the accuracy of the simulation method, an experiment was conducted, and a special-designed ceramic cubic can be attached around the pressure chip to decrease the oil volume. The output data of packaged modules were recorded under the temperature range from -40°C to 125°C, The trend of data is in good agreement with the prediction of simulation model. This simulating method can be an excellent tool for the research and development of similar packaged sensor.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129257080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints 尺寸和几何形状对倒装Sn3.5Ag焊点电迁移行为的影响

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236670

H. Qin, W. Yue, Xin-Ping Zhang, Dao-Guo Yang

{"title":"Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints","authors":"H. Qin, W. Yue, Xin-Ping Zhang, Dao-Guo Yang","doi":"10.1109/ICEPT.2015.7236670","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236670","url":null,"abstract":"With the increasing miniaturization of electronic devices and systems, the dimension of solder joints and pitches has been continuously scaling down, while the current density carried by solder joints increasing significantly, consequently a critical issue, electromigration (EM), has become a key reliability concern. The EM behavior in the solder joint is mainly dependent on the magnitude and distribution of the current density, and may be influenced by the temperature distribution induced by Joule heating effects in the solder. In this study, three-dimensional thermo-electrical finite element analysis is employed to characterize the current density and temperature distributions, current crowding effects as well as thermal gradients in micro-scale Sn3.5Ag solder joints with different sizes and geometries. Results show that, both the maximum and average current densities in the solder increase dramatically by power functions with the scaling down of the solder size. Accordingly, as the solder size is reduced, the serious Joule heating effect takes place and both temperatures and thermal gradients of solder joints increase significantly. Moreover, with increasing standoff height, the maximum current density increases, while the average current density decreases, which results in the increase of the crowdedness of current density defined by the ratio of the maximum current density to average current density (i.e., the crowding ratio). In addition, the thermal gradient in the solder decreases with increasing standoff height. However, compared with the increase of standoff height, the increase of contact angle has quite opposite effect on the maximum and average current densities, crowding ratios as well as thermal gradients in solder joints, respectively. Further, both the standoff height and contact angle have very limited influence on the temperature of solder joints.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121292773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3