2015 16th International Conference on Electronic Packaging Technology (ICEPT)最新文献

A new method for reducing warpage due to reflow in IGBT module 提出了一种减少IGBT模块回流翘曲的新方法

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236816

Yang Zhou, Ling Xu, Miaocao Wang, Z. Qian, Sheng Liu

{"title":"A new method for reducing warpage due to reflow in IGBT module","authors":"Yang Zhou, Ling Xu, Miaocao Wang, Z. Qian, Sheng Liu","doi":"10.1109/ICEPT.2015.7236816","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236816","url":null,"abstract":"Warpage in Insulated Gate Bipolar Transistor (IGBT) module is induced by the unavoidable mismatch of materials and asymmetric structure in almost every packaging process. The high level of warpage and thermal stress is introduced during reflow processes, which can impact the IGBT reliability. Pre-warping substrate method has been used as industry practice for reducing warpage due to reflow. The method still faces challenges of low cost and process simplification. With the development of copper bonding technique, IBP (Integrate base plate) was recently developed for reducing the warpage. However, the method is not cost-effective. In this paper, a low-cost and simple method of embedding DBC plates into copper substrate has been proposed as alternative solution for the warpage reduction. A 1200V IGBT module prototype was selected for benchmarking the warpage reduction methods. Finite element method with viscoplastic solder model and large deformation theory was used to investigate the solder reflow process. Anand constitutive model available in FEM tools for modeling the viscoplastic behaviors of solder materials was used for SAC305 solder layers. The whole reflow process was simulated by advanced element “death and activation” technique. Three package assembly methods for reducing warpage were investigated by advanced finite element analyses. The FEA result shows that the proposed new method can effectively reduce the warpage of IGBT module to industry-acceptable level.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115319220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

The effects of Au film thickness on the reliability of Sn-Pb solder joints Au膜厚度对Sn-Pb焊点可靠性的影响

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236822

Xiaorui Lv, P. Lin, Yingzhuo Huang, X. Jiang, B. Lian, Quanbin Yao

{"title":"The effects of Au film thickness on the reliability of Sn-Pb solder joints","authors":"Xiaorui Lv, P. Lin, Yingzhuo Huang, X. Jiang, B. Lian, Quanbin Yao","doi":"10.1109/ICEPT.2015.7236822","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236822","url":null,"abstract":"Ceramic ball grid array (CBGA) modules are high density, high-performance surface mount (SMT) packages. With miniaturization of solder joints in electronic packaging, the intermetallic compound (IMC) which formed at the interface between the solder ball and under bump metallization (UBM) have considerable effects on the reliability of solder joints. In this paper, the effects of Au film thickness on the growth of IMC were studied, including with the type, the composition and the thickness of IMC. And the mechanical properties of IMC were studied using ball shear tests and ball pull tests. Based on the growth of IMC under different aging time, the effects of IMC on Board-Level reliability of solder joints under thermal store load conditions were researched. Finally, the effects of IMC thickness on the thermal fatigue reliability of solder joints under thermal cycling load were analyzed by the electric on-off tests of the daisy chain. The result demonstrate that, the thickness of IMC increase rapidly due to the augment of Au film thickness, which might lead to “black pad” and the strength of solder joints reduce radically, as while as the shorten of the fatigue life.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"202 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123040382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Spot welding process research of fine pitch micro-rectangular connectors based on pu enameled wire 基于pu漆包线的细间距微矩形连接器点焊工艺研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236567

Xiaole Kuang, Haibing Zhang, Wei Zhu, Xiaobai Xie

引用次数: 0

Effect of viscoelastic behavior of EMC on predicting QFN fatigue life 电磁兼容粘弹性特性对QFN疲劳寿命预测的影响

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236804

Shen Hui-qiang, Q. Fei, Wu Wei, Xia Guofeng

引用次数: 2

Fast single mode microwave-assisted synthesis of porous carbon aerogel for supercapacitors 超级电容器用多孔碳气凝胶的快速单模微波辅助合成

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236578

Xueqing Cai, Dayong Gui, Jianhong Liu, Guiming Tan, Wei Chen, Weijian Xiong

{"title":"Fast single mode microwave-assisted synthesis of porous carbon aerogel for supercapacitors","authors":"Xueqing Cai, Dayong Gui, Jianhong Liu, Guiming Tan, Wei Chen, Weijian Xiong","doi":"10.1109/ICEPT.2015.7236578","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236578","url":null,"abstract":"Carbon materials are, in general, very good absorbents of microwaves. The microwave-assisted synthesis illustrated in this work allows carbon aerogels (CA) to be synthesized in a much shorter time than by conventional methods. Resorcinol-formaldehyde xerogels were synthesized using single mode microwave synthesis system at 85°C for less than an hour. Then, carbonization was performed to obtain carbon xerogels. The effect of the microwave radiation time involved in the process on the textural and electrochemical performance of the final materials was evaluated. It can be concluded that it is possible to control their textural characteristics of carbon xerogels by modifying radiation time. The electrochemical performance of synthesized carbon xerogels as electrode materials in electric double-layer capacitors was studied by cyclic voltammetry and charge/discharge experiments in an alkali medium (6MKOH). It can be seen that single mode microwave-assisted synthesis helps the carbon xerogels display good cycle durability and the specific capacitance of the CA which was radiation for 40minutes is 96.22F/g even without any activation and doping treatments.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124842570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Ab initio studies of the differences in the chemical reactivity and electronic properties of polyaniline and its derivatives 从头算研究聚苯胺及其衍生物的化学反应性和电子性质的差异

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236739

Junke Jiang, Q. Liang, Chun-Jian Tan, M. Cai, Yiping Huang, Daoguo Yang, Xianping Chen, T. Ren

{"title":"Ab initio studies of the differences in the chemical reactivity and electronic properties of polyaniline and its derivatives","authors":"Junke Jiang, Q. Liang, Chun-Jian Tan, M. Cai, Yiping Huang, Daoguo Yang, Xianping Chen, T. Ren","doi":"10.1109/ICEPT.2015.7236739","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236739","url":null,"abstract":"The chemical reactivity and electronic properties of polyaniline (PANI) and its derivatives are systematically investigated using density functional simulations (DFT). The results indicate that carbonic acid (H2CO3) doping emeraldine base polyaniline (EB-PANI) or its derivatives are unspontaneous endothermic reactions. EB-PANI shows better chemical reactivity after the modification by different functional groups -OH and -NaSO3, the energy of reaction (Er) and energy of barrier (Ebar) are both decreased. The band gap are shows dissimilar trends by introducing different functional groups which -OH decrease and -NaSO3 increase. However, the band gap of EB-PANI and its derivatives are dramatic decrease when doping by hydrochloric acid (HCl) or H2CO3 which tend to increase the conductivity at finite temperatures. Especially, the band gap of H2CO3 doped Na-SPANI is far below the EB-PANI and OH-PANI even close to the HCl doped EB-PANI. These simulation results are helpful for further study and application of PANI and its derivatives.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114919942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Power QFN device bump ball lift issue study 电源QFN装置撞球提升问题研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236855

Hanmin Zhang, M. Hu, Ting Li, B. Yin, Q. He, D. Ye

引用次数: 0

Electrical simulation of a shielding structure in 3D package 三维封装中屏蔽结构的电学模拟

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236703

Gengxin Tian, Jun Li, Yi He, Zhihua Li, Liqiang Cao, D. Shangguan, L. Wan

引用次数: 1

The modeling of DC current crowding for Through-silicon Via in 3-D IC 三维集成电路中硅通孔直流电流拥挤的建模

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236732

Song Liu, Guangbao Shan, Chengmin Xie, Long-Sheng Wu, Lei Yi

引用次数: 2

The research of lead-free dispensing solder paste 无铅点焊锡膏的研究

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236637

Sai Yang, Y. Lei, Jian Lin, Qin Li, Baoquan Liu, Hailong Bai, J. Qin

{"title":"The research of lead-free dispensing solder paste","authors":"Sai Yang, Y. Lei, Jian Lin, Qin Li, Baoquan Liu, Hailong Bai, J. Qin","doi":"10.1109/ICEPT.2015.7236637","DOIUrl":"https://doi.org/10.1109/ICEPT.2015.7236637","url":null,"abstract":"The process of solder paste dispensing is considered as a popular coating method in solder paste applications currently. The properties of dispensing solder paste are easily effected by the changes of proportions. The research of Sn-Ag-Cu lead-free dispensing solder paste mainly focuses on the ratios of Sn-Ag-Cu alloy powder and flux, and the ratios of components in flux. In this paper, the mass ratio of alloy powder and flux in dispensing solder paste was 86:14wt %. On the basis of multi-ingredient in flux, the study had adopted four-factor and three-level of L9 (34) orthogonal designing method to design the mass percent of four main ingredients in flux, and achieved a set of optimizing parameters quickly. The four selected factors were rosin, thixotropic agent, solvent, and surfactant. Their effects on viscosity were investigated in this study. With formula of the flux optimized by orthogonal designs and range analysis, investigations on property of the dispensing solder paste had been made. The experiments of viscosity, spreading and slump showed that the methods were effective and feasible to form parameter optimization of dispensing solder paste. The experimental results indicated that the Sn-Ag-Cu lead-free dispensing solder paste would gain moderate viscosity and excellent spreadability when the mass percent of rosin, thixotropic agent, solvent, and surfactant in the flux was 40%:5%:25%:6%.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129844654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0