The effects of Au film thickness on the reliability of Sn-Pb solder joints

2015 16th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2015-09-03 DOI:10.1109/ICEPT.2015.7236822

Xiaorui Lv, P. Lin, Yingzhuo Huang, X. Jiang, B. Lian, Quanbin Yao

{"title":"The effects of Au film thickness on the reliability of Sn-Pb solder joints","authors":"Xiaorui Lv, P. Lin, Yingzhuo Huang, X. Jiang, B. Lian, Quanbin Yao","doi":"10.1109/ICEPT.2015.7236822","DOIUrl":null,"url":null,"abstract":"Ceramic ball grid array (CBGA) modules are high density, high-performance surface mount (SMT) packages. With miniaturization of solder joints in electronic packaging, the intermetallic compound (IMC) which formed at the interface between the solder ball and under bump metallization (UBM) have considerable effects on the reliability of solder joints. In this paper, the effects of Au film thickness on the growth of IMC were studied, including with the type, the composition and the thickness of IMC. And the mechanical properties of IMC were studied using ball shear tests and ball pull tests. Based on the growth of IMC under different aging time, the effects of IMC on Board-Level reliability of solder joints under thermal store load conditions were researched. Finally, the effects of IMC thickness on the thermal fatigue reliability of solder joints under thermal cycling load were analyzed by the electric on-off tests of the daisy chain. The result demonstrate that, the thickness of IMC increase rapidly due to the augment of Au film thickness, which might lead to “black pad” and the strength of solder joints reduce radically, as while as the shorten of the fatigue life.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"202 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236822","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

Abstract

Ceramic ball grid array (CBGA) modules are high density, high-performance surface mount (SMT) packages. With miniaturization of solder joints in electronic packaging, the intermetallic compound (IMC) which formed at the interface between the solder ball and under bump metallization (UBM) have considerable effects on the reliability of solder joints. In this paper, the effects of Au film thickness on the growth of IMC were studied, including with the type, the composition and the thickness of IMC. And the mechanical properties of IMC were studied using ball shear tests and ball pull tests. Based on the growth of IMC under different aging time, the effects of IMC on Board-Level reliability of solder joints under thermal store load conditions were researched. Finally, the effects of IMC thickness on the thermal fatigue reliability of solder joints under thermal cycling load were analyzed by the electric on-off tests of the daisy chain. The result demonstrate that, the thickness of IMC increase rapidly due to the augment of Au film thickness, which might lead to “black pad” and the strength of solder joints reduce radically, as while as the shorten of the fatigue life.

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Au膜厚度对Sn-Pb焊点可靠性的影响

陶瓷球栅阵列(CBGA)模块是高密度、高性能表面贴装(SMT)封装。随着电子封装中焊点的小型化，在焊点球与凹凸金属化(UBM)界面形成的金属间化合物(IMC)对焊点的可靠性有很大影响。本文研究了Au膜厚度对IMC生长的影响，包括IMC的类型、组成和厚度。通过球剪试验和球拉试验研究了IMC的力学性能。基于不同时效时间下IMC的生长情况，研究了IMC在热存储载荷条件下对焊点板级可靠性的影响。最后，通过雏菊链的电通断试验，分析了IMC厚度对热循环载荷下焊点热疲劳可靠性的影响。结果表明:随着Au膜厚度的增加，IMC的厚度迅速增加，可能导致“黑垫”的出现，焊点的强度急剧降低，同时疲劳寿命缩短。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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