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Proceedings 1997 IEEE Multi-Chip Module Conference最新文献

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Precision embedded thin film resistors for multichip modules (MCM-D) 用于多芯片模块(MCM-D)的精密嵌入式薄膜电阻
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569344
Chang-Ming Lin, E. A. Logan, D. Tuckerman
{"title":"Precision embedded thin film resistors for multichip modules (MCM-D)","authors":"Chang-Ming Lin, E. A. Logan, D. Tuckerman","doi":"10.1109/MCMC.1997.569344","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569344","url":null,"abstract":"A precision integral resistor process has been successfully developed using a 10 /spl Omega//sq. tantalum nitride thin film. Although the integral resistors are overcoated by 6 /spl mu/m of PECVD silicon dioxide, a precision laser trimming process was developed which is capable of trimming the embedded resistors to 50 /spl Omega/ with an accuracy of better than /spl plusmn/0.5 /spl Omega/ (1%) and with no damage to the surrounding structure. The stability of the trimmed resistors has been demonstrated and the average post-trim TCR value can be improved by up to 33%, depending upon the characteristics of the laser system. Trimmed integral resistors have also been examined by transmission electron microscope (TEM). Secondary grain growth within the trimmed resistor and spherical inclusions in the oxide near to trimmed resistor regions were observed by this analysis. As part of a reliability evaluation, the trimmed resistors were subjected to a severe manual thermal shock test over a /spl Delta/T of /spl sim/500/spl deg/C without catastrophic failure.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122473886","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Prototype development of flip chip MCMs 倒装mcm的原型开发
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569358
W. Hansford, J. Peltier, P. Franzon, S. Lipa, J. Schaeffer
{"title":"Prototype development of flip chip MCMs","authors":"W. Hansford, J. Peltier, P. Franzon, S. Lipa, J. Schaeffer","doi":"10.1109/MCMC.1997.569358","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569358","url":null,"abstract":"The MIDAS service at USC/ISI interfaces system designers to domestic Multichip Module (MCM) foundries. Users share tooling and manufacturing costs by merging multiple designs onto a fabrication run and through the use of standard module sizes and packages. MIDAS is developing flip chip bumping and assembly services for MCM-D users. Demonstration designs have been developed by North Carolina State University, including a 7-chip noise evaluator for verifying SSN prediction models and a 3-chip Data Encryption Standard (DES) processor which uses the MCM substrate to distribute global power, ground, and clock that is normally done on-chip.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133710899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Area I/O flip-chip packaging to minimize interconnect length 区域I/O倒装芯片封装，以尽量减少互连长度
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569337
R. Lomax, R.B. Brown, M. Nanua, T. D. Strong
{"title":"Area I/O flip-chip packaging to minimize interconnect length","authors":"R. Lomax, R.B. Brown, M. Nanua, T. D. Strong","doi":"10.1109/MCMC.1997.569337","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569337","url":null,"abstract":"This paper discusses an approach using area interconnect to achieve high performance for an experimental multichip microprocessor. The described method is being used in the PUMA project at the University of Michigan to design a processor that has a clock speed goal of 1 GHz. The approach relies on the coordinated placement of functional blocks on chips, and the resulting chips on the MCM. The use of area array pads to provide high bandwidth interconnections between the chips, and low inductance power connection to the MCM is also essential. Three stages of MCM development for the project are described.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114202107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
An 8-bit 2.5 gigasample A/D converter multichip module for all-digital radar receiver for AN/APS 145 radar on Navy E2-C Airborne Early Warning Aircraft 一种用于海军E2-C机载预警机An /APS 145雷达全数字雷达接收机的8位2.5千兆位A/D转换器多芯片模块
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569340
R. Thompson, M. Degerstrom, W. Walters, M.E. Vickberg, P. Riemer, Eric L. H. Amundsen, B. Gilbert
{"title":"An 8-bit 2.5 gigasample A/D converter multichip module for all-digital radar receiver for AN/APS 145 radar on Navy E2-C Airborne Early Warning Aircraft","authors":"R. Thompson, M. Degerstrom, W. Walters, M.E. Vickberg, P. Riemer, Eric L. H. Amundsen, B. Gilbert","doi":"10.1109/MCMC.1997.569340","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569340","url":null,"abstract":"This paper will discuss multichip module (MCM) technology as it is applied to a prototype high performance direct digitizing channelized radar receiver system under development for the Navy's E2-C Airborne Early Warning Aircraft, which encompasses both analog signals at UHF frequencies and multi-gigahertz digital signals. Critical issues which arise in the design of such a system will be discussed, including thermal management, transmission line, voltage standing wave ratio, and simultaneous switching noise analyses. This paper will also describe the various simulation and analysis software tools employed in the development of the MCM containing the analog-to-digital converter (A/D converter) and demultiplexer for this system, and the roles of these tools in providing insight into the design of the MCM.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124813102","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Comparative cost analysis for smart-substrate MCM system 智能基板MCM系统的成本比较分析
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569361
H. Werkmann, B. Hofflinger
{"title":"Comparative cost analysis for smart-substrate MCM system","authors":"H. Werkmann, B. Hofflinger","doi":"10.1109/MCMC.1997.569361","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569361","url":null,"abstract":"A cost model for silicon-carrier based MCM systems is presented. The purpose of this cost model is the comparison of test methods for silicon carriers regarding passive substrates and active substrates with integrated test capabilities. Modular models of the different system fabrication steps are developed and combined to a model covering the whole fabrication process. Emphasis is put on the cost modules for substrate fabrication comparing active to passive silicon substrates and on the substrate and system test comparing different test approaches for silicon substrates using test circuitry integrated into an active silicon substrate and the test of passive silicon carriers with conventional test methods.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122888383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Delay models for MCM interconnects when response is nonmonotone 响应非单调时MCM互连的延迟模型
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569352
A. Kahng, K. Masuko, S. Muddu
{"title":"Delay models for MCM interconnects when response is nonmonotone","authors":"A. Kahng, K. Masuko, S. Muddu","doi":"10.1109/MCMC.1997.569352","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569352","url":null,"abstract":"Elmore delay has been extensively used for interconnect delay estimation because its simplicity of evaluation makes it appropriate for layout design. However, since Elmore delay does not take into account the effect of inductance, the discrepancy between actual delay and Elmore delay becomes significant for long RLC transmission lines, such as for MCM and PCB interconnects. We describe a simple two-pole based analytic delay model that estimates arbitrary threshold delays for RLC lines when the response is nonmonotone; our model is far more accurate than the Elmore model. We also describe an application of our model for controlling response undershoot/overshoot and for the reduction of interconnect delay through constraints on the moments.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130474633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Switched optical transmission: exploration of trade-offs between packaging options 交换光传输:探索包装选项之间的权衡
Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI: 10.1109/MCMC.1997.569362
B. Kaminska, G. Fortin, E. Sokolowska, C. Roy
{"title":"Switched optical transmission: exploration of trade-offs between packaging options","authors":"B. Kaminska, G. Fortin, E. Sokolowska, C. Roy","doi":"10.1109/MCMC.1997.569362","DOIUrl":"https://doi.org/10.1109/MCMC.1997.569362","url":null,"abstract":"This paper presents an approach to switched electrical and optical transmissions using a pseudo-optical switching system. Packaging alternatives for the switching matrix are explored for OC-3 and OC-12 norms, with the aim of achieving a low system noise. The characteristics of a prototype pseudo-optical switch composed of transimpedance and differential amplifiers, multiplexers and GaAs laser drivers are also presented.","PeriodicalId":412444,"journal":{"name":"Proceedings 1997 IEEE Multi-Chip Module Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-02-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116701014","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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