Prototype development of flip chip MCMs

Abstract

The MIDAS service at USC/ISI interfaces system designers to domestic Multichip Module (MCM) foundries. Users share tooling and manufacturing costs by merging multiple designs onto a fabrication run and through the use of standard module sizes and packages. MIDAS is developing flip chip bumping and assembly services for MCM-D users. Demonstration designs have been developed by North Carolina State University, including a 7-chip noise evaluator for verifying SSN prediction models and a 3-chip Data Encryption Standard (DES) processor which uses the MCM substrate to distribute global power, ground, and clock that is normally done on-chip.