Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.最新文献

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New solutions for reusing nonmetals reclaimed from waste printed circuit boards 从废弃印刷电路板中回收再利用非金属的新解决方案
M. Peng, Xiang Dong, Pan Xiaoyong, Wa Layiding, G. Jiangang, D. Guanghong
{"title":"New solutions for reusing nonmetals reclaimed from waste printed circuit boards","authors":"M. Peng, Xiang Dong, Pan Xiaoyong, Wa Layiding, G. Jiangang, D. Guanghong","doi":"10.1109/ISEE.2005.1437026","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437026","url":null,"abstract":"In waste printed circuit boards (PCBs) recycling fields, how to recycle and reuse nonmetals is a challenging problem, and there is no preferable solutions up to now. This paper presents new methods for reusing nonmetals reclaimed from waste PCBs. Nonmetals are used to make formative models, compound boards or related products. When compared with traditional materials, such as talc and silica powder, PCB nonmetals improve the mechanical features of these products greatly with comparable tensile and shearing strength and 30 percent larger flexural strength, which indicates good application prospect for its undoubted potential.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127925900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Disassembling approaches and quality assurance of electronic components mounted on PCBs pcb上电子元件的拆卸方法及质量保证
Wa Layiding, Xiang Dong, M. Peng, D. Guanghong
{"title":"Disassembling approaches and quality assurance of electronic components mounted on PCBs","authors":"Wa Layiding, Xiang Dong, M. Peng, D. Guanghong","doi":"10.1109/ISEE.2005.1437004","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437004","url":null,"abstract":"Disassembly is essential when components on retired PCBs are treated separately to increase the total income of reutilization. By comparing structural characteristics, value distribution and disassembling difficulty of various components, our research set two goals for PCB disassembly: one is to resume functional value of some SMT components with high density of function and the other is to retrieve material value of the rest components. Correspondingly, disassembling approaches can be classified into two categories: quality ensured disassembly for the first goal and destructive disassembly for the second goal. Simultaneous approaches are expected to cut down on cost and time consumption of quality ensured disassembly. However, simultaneous disassembly tends to cause more failures on components than stepwise disassembly. To provide reference for adapting approaches and equipments to simultaneous disassembly, several modes of mechanical failure of disassembled components and their causes are presented based on testing and analysis. We also present a design on adapting the air heating approach to simultaneous disassembly and discuss benefits of applying disassembly in material retrieval of PCBs.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129790891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Recyclability of flame retardant HIPS, PC/ABS, and PPO/HIPS used in electrical and electronic equipment 用于电气和电子设备的阻燃HIPS、PC/ABS和PPO/HIPS的可回收性
R. B. Dawson, S. D. Landry
{"title":"Recyclability of flame retardant HIPS, PC/ABS, and PPO/HIPS used in electrical and electronic equipment","authors":"R. B. Dawson, S. D. Landry","doi":"10.1109/ISEE.2005.1436998","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1436998","url":null,"abstract":"Electrical and electronic equipment (EEE) applications utilize various brominated and phosphorus flame returdants for reasons of fire safety. The use of flame retardants in these applications delays the spread of fires or delays the time of flashover, hence saving lives and property. An estimated 190 lives are saved annually through the use of flame retardants in television cabinets in the US. Research aimed at answering questions related to risk in use and end-of-life options for flame retardant plastics used in EEE applications has been performed and more is currently being performed. European Risk Assessment for several flame retardants is now in progress. Research has been ongoing to study various end-of-life options. This paper is a continuation of previous papers that address issues related to end-of-life, risk in use, and benefits of plastics containing flame retardants. Results of recent research aimed at determining the recyclability of plastics, such as HIPS, PC/ABS, and more recently PPO/HIPS containing brominated or phosphorus flame retardants under a variety of conditions are included.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125566132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Information and energy substitution in the digital economy: an empirical investigation using the input-output approach for Texas 数字经济中的信息与能源替代:基于投入产出方法的德克萨斯州实证研究
Wei Tu, D. Sui
{"title":"Information and energy substitution in the digital economy: an empirical investigation using the input-output approach for Texas","authors":"Wei Tu, D. Sui","doi":"10.1109/ISEE.2005.1437021","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437021","url":null,"abstract":"This paper examines the substitution of information and energy sectors in the Texas economy during the 1990s using an input-output (IO) based approach. On the basis of the analysis of three-segment Texas IO models for the years of 1990, 1994, and 1999, it is concluded that: 1) there is a trend of informatization in the state of Texas during the 1990s; 2) there exists substitution among input factors (economic segments) to produce final outputs in Texas economy. Further analyses with multiple aggregation levels at different geographical and temporal scales are needed before generalizations can be made regarding the empirical relationship between information and energy in the new digital economy.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115150353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Handheld x-ray fluorescence: practical application as a screening tool to detect the presence of environmentally-sensitive substances in electronic equipment 手持式x射线荧光:作为筛选工具的实际应用,检测电子设备中环境敏感物质的存在
P. Shrivastava, S. O'Connell, A. Whitley
{"title":"Handheld x-ray fluorescence: practical application as a screening tool to detect the presence of environmentally-sensitive substances in electronic equipment","authors":"P. Shrivastava, S. O'Connell, A. Whitley","doi":"10.1109/ISEE.2005.1437013","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437013","url":null,"abstract":"As the implementation deadlines approach, the electronics industry is focusing significant efforts on compliance with the restriction of hazardous substances (RoHS) directive and the waste electrical and electrical equipment (WEEE) directive. The intent of the EU RoHS Directive (2002/95/EC) is to restrict the use of six substances (lead, mercury, cadmium, hexavalent chromium, PBBs and certain PBDEs) in certain electronic products. There are a number of methods that companies are employing to validate restricted substance compliance within the supply chain, including analytical testing. Normative test methods are needed for the industry to determine the concentrations of the regulated substances in electronic products. This paper presents the practical application of a handheld x-ray fluorescence (XRF) analyzer to estimate the concentration levels of restricted elements such as lead (Pb) and cadmium (Cd) in electronic components. Through this study, handheld XRF was determined to be a suitable screening tool to estimate the concentration of regulated substances in electronic components with some limitations. Being quick and easy-to-use, XRF has shown to be a useful tool for conducting in-house screening analyses of components to reduce testing time and costs.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116881122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Results from the 2004 iNEMI Environmentally Conscious Electronics (ECE) roadmap 来自2004年iNEMI环境意识电子(ECE)路线图的结果
M. Newton, J. Johnson, R. Pfahl
{"title":"Results from the 2004 iNEMI Environmentally Conscious Electronics (ECE) roadmap","authors":"M. Newton, J. Johnson, R. Pfahl","doi":"10.1109/ISEE.2005.1436982","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1436982","url":null,"abstract":"The 2004 iNEMI Environmentally Conscious Electronics Road map was released to the public in February 2005. This paper outlines the roadmapping process used by the International Electronics Manufacturing Initiative to identify future research, development, and implementation needs to continue the growth of the world-wide electronics industry. It contains nineteen individual technology roadmaps covering all aspects of the global electronics industry and its supply chain. One of these nineteen roadmaps is the Environmentally Conscious Electronics (ECE) Roadmap. The output of this roadmapping process is used to establish projects to close gaps identified in the roadmap. The three generations of NEMI projects to eliminate Pb solder were developed to close identified environmental technology gaps from the 1998, 2000, and 2002 roadmaps. The 2004 ECE roadmap focuses on five key areas: design, energy, recycling, materials, and sustainability. Not only are the technical issues roadmapped in these five areas, but also the regulatory and business issues as well. This paper is the first detailed presentation of the technology and business gaps and research and development needs identified in the five key environmental areas. The paper discusses the findings and recommendations made by the roadmap participants. The paper concludes by discussing the future environmental challenges and recommendations made in the roadmap for the world-wide electronics industry over the next decade.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132341425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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