Disassembling approaches and quality assurance of electronic components mounted on PCBs

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI:10.1109/ISEE.2005.1437004

Wa Layiding, Xiang Dong, M. Peng, D. Guanghong

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引用次数: 15

Abstract

Disassembly is essential when components on retired PCBs are treated separately to increase the total income of reutilization. By comparing structural characteristics, value distribution and disassembling difficulty of various components, our research set two goals for PCB disassembly: one is to resume functional value of some SMT components with high density of function and the other is to retrieve material value of the rest components. Correspondingly, disassembling approaches can be classified into two categories: quality ensured disassembly for the first goal and destructive disassembly for the second goal. Simultaneous approaches are expected to cut down on cost and time consumption of quality ensured disassembly. However, simultaneous disassembly tends to cause more failures on components than stepwise disassembly. To provide reference for adapting approaches and equipments to simultaneous disassembly, several modes of mechanical failure of disassembled components and their causes are presented based on testing and analysis. We also present a design on adapting the air heating approach to simultaneous disassembly and discuss benefits of applying disassembly in material retrieval of PCBs.

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pcb上电子元件的拆卸方法及质量保证

当对退役pcb上的组件进行单独处理以增加再利用的总收入时，拆卸是必不可少的。通过比较各种元件的结构特点、价值分布和拆解难度，我们的研究确定了PCB拆解的两个目标:一是恢复部分功能密度较高的SMT元件的功能价值，二是恢复其余元件的材料价值。相应地，拆卸方法可分为两类:第一目标的质量保证拆卸和第二目标的破坏性拆卸。同时方法有望降低成本和时间消耗的质量保证拆卸。然而，与逐步拆卸相比，同时拆卸往往会导致更多的部件故障。在试验分析的基础上，提出了被拆卸部件机械失效的几种模式及其原因，为采用同步拆卸的方法和设备提供参考。我们还提出了一种采用空气加热方法同时拆卸的设计，并讨论了在pcb材料回收中应用拆卸的好处。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.

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