Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510)最新文献_第2页

Microwave characterization and modeling of packaged HEMTs by a direct extraction procedure at cryogenic temperatures 在低温下直接提取封装hemt的微波表征和建模

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351529

N. Donato, A. Caddemi, G. Crupi, E. Calandra

引用次数: 6

Imaging of absorbers in turbid media using visible light 混浊介质中吸收剂的可见光成像

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351256

Edgar Scherleitner, Bernhard G. Zagar

引用次数: 0

Control of heating pattern from interstitial instrumentation [thermal patient therapy] 间质仪器加热模式的控制[热疗病人]

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351364

B. Jarosz

{"title":"Control of heating pattern from interstitial instrumentation [thermal patient therapy]","authors":"B. Jarosz","doi":"10.1109/IMTC.2004.1351364","DOIUrl":"https://doi.org/10.1109/IMTC.2004.1351364","url":null,"abstract":"Interstitial instrumentation (ultrasound, radiofrequency, microwave) is used in clinics for thermal therapy of many maladies (cancer, thrombosis, hemorrhage, etc.). This presentation focuses on the usefulness of the interstitial instrumentation in thermal therapy of brain cancers. We show that appropriate placement of the applicators in the array can produce an irregular heating pattern. Using the example of a waveguide ultrasonic applicator array, we consider array geometry of vertical applicators and applicators at 20/spl deg/ to the horizontal. Acoustic scans for the two systems make evident that evaluation of the heating pattern from measurement of the instrumentation power deposition is reliable only for the case of simple array geometry. We demonstrate that an FEA approach, however, enables prediction of the heating patterns for any array geometry. Our FAE computations for the case of complicated array geometry gave intricate heating patterns that are impossible to predict from measurement of the instrumentation power deposition. Also, the FEA approach illustrates that the heating with more complex array reduces incidental heating, an undesired effect. We demonstrate that power measurements and FEA computations have to be integral steps in evaluation of an instrumentation efficacy for heating.","PeriodicalId":386903,"journal":{"name":"Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125296953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A study of the deviations in thickness as detected by a laser measuring instrument in a stainless steel production line 用激光测量仪检测不锈钢生产线厚度偏差的研究

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351238

C. Spínola, J. M. Bonelo, C. Martín-Pérez, J. Vizoso

引用次数: 1

Portable high-end instrument for in-vivo infrared spectroscopy using spread spectrum modulation 使用扩频调制的便携式高端体内红外光谱仪器

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351197

M. Giardini, S. Trevisan

引用次数: 5

Smart two-element PTC wind sensor 智能双元PTC风传感器

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351001

H. Ruser, M. Horn

引用次数: 1

A new method for the estimation and measurement of traffic packet loss for virtual private networks services 一种虚拟专用网业务流量丢包估计与测量的新方法

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351074

C. Lambiri, D. Ionescu, V. Groza

引用次数: 5

Characterization and modeling of sub-nH integrated inductances 亚nh集成电感的表征与建模

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351480

T. Biondi, A. Scuderi, E. Ragonese, G. Palmisano

引用次数: 2

A CMOS compatible active thermopile with high frequency measurement 具有高频测量功能的CMOS兼容有源热电堆

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351087

Chih-Hsiung Shen, Wei-Feng Chen, Shih-Han Yu

{"title":"A CMOS compatible active thermopile with high frequency measurement","authors":"Chih-Hsiung Shen, Wei-Feng Chen, Shih-Han Yu","doi":"10.1109/IMTC.2004.1351087","DOIUrl":"https://doi.org/10.1109/IMTC.2004.1351087","url":null,"abstract":"A considerable number of measurements for microsensors and system characterisations rely on the analysis of its step response. Device parameters of thermal microsensors are essential for evaluating the sensor performances and their simulation modelling. For the thermal microsensors, the thermal parameters are sometimes show important relations to the package, which is not an ideal heat sink. By decoupling the heat equations for the membrane of sensor and package, we first build a multiple-time-constant modelling of thermal microsensors, which describes a more realistic thermal behaviour. The behaviour on spectrum domain and time domain are predicted and been proved by our experiments. An investigation of high frequency response for CMOS compatible thermoelectric infrared sensors is proposed and fabricated. The sensors are fabricated by a 1.2 /spl mu/m industrial CMOS IC technologies combined with a subsequent anisotropic front-side etching stop. To reach a larger response signal, we fabricated a large floating membrane structure with a built-in polysilicon resistor as a signal modulator. It consists of a heating polysilicon resistor and an Al/ n-polysilicon thermopile, embedded in an oxide/nitride membrane. High frequency response of a test sample shows unexpected large signal, which is quite interesting and never reported before. We have made a thoroughly measurement and analysis, and give some interesting results.","PeriodicalId":386903,"journal":{"name":"Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114276862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Dynamic force calibration method for force transducers 力传感器的动态力标定方法

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI: 10.1109/IMTC.2004.1351062

Y. Fujii

引用次数: 12