Sensing, Modeling and Simulation in Emerging Electronic Packaging最新文献_第2页

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials 电子封装材料多轴热-机械疲劳试验机

Sensing, Modeling and Simulation in Emerging Electronic Packaging Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0894

Minfu Lu, Sheng Liu

引用次数: 9

Cure Kinetics for Conductive Adhesives 导电胶粘剂的固化动力学

Sensing, Modeling and Simulation in Emerging Electronic Packaging Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0886

Y. Mei, Sean X. Wu, C. Yeh

引用次数: 0

Curing Analysis of a Flip-Chip-on-Board Electronic Package 板上倒装电子封装的固化分析

Sensing, Modeling and Simulation in Emerging Electronic Packaging Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0885

Wenjie Zheng

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引用次数: 1

Thermal Management in Direct Chip Attach Assemblies 直接芯片连接组件的热管理

Sensing, Modeling and Simulation in Emerging Electronic Packaging Pub Date : 1996-11-17 DOI: 10.1115/1.2793844

D. Baldwin, J. T. Beerensson, S. Sitaraman

引用次数: 3

Flow Modeling of Wire Sweep in Transfer Molding 传递成型中扫丝的流动建模

Sensing, Modeling and Simulation in Emerging Electronic Packaging Pub Date : 1996-11-17 DOI: 10.1115/imece1996-0890

X. Chen, Kathy S. Lee, M. Yuen, P. Tong

引用次数: 2