{"title":"电子封装材料多轴热-机械疲劳试验机","authors":"Minfu Lu, Sheng Liu","doi":"10.1115/imece1996-0894","DOIUrl":null,"url":null,"abstract":"\n A multi-axial thermo-mechanical mini-fatigue tester has been developed at Wayne State University for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. The testing and calibration of machine is described in this paper. Materials tested include a copper wire, two kinds of polyimide films, a lead-free solder alloy.","PeriodicalId":375055,"journal":{"name":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials\",\"authors\":\"Minfu Lu, Sheng Liu\",\"doi\":\"10.1115/imece1996-0894\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n A multi-axial thermo-mechanical mini-fatigue tester has been developed at Wayne State University for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. The testing and calibration of machine is described in this paper. Materials tested include a copper wire, two kinds of polyimide films, a lead-free solder alloy.\",\"PeriodicalId\":375055,\"journal\":{\"name\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1996-0894\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1996-0894","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
A multi-axial thermo-mechanical mini-fatigue tester has been developed at Wayne State University for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. The testing and calibration of machine is described in this paper. Materials tested include a copper wire, two kinds of polyimide films, a lead-free solder alloy.
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