2023 46th International Spring Seminar on Electronics Technology (ISSE)最新文献_第9页

Die attachment Process Overview for High Power Semiconductors 高功率半导体模具贴装工艺概述

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168484

M. Myśliwiec, R. Kisiel

引用次数: 0

Towards Textile Thermopiles 走向纺织热电堆

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168518

Jan Kalčík, R. Soukup, B. Malengier, Michaela Radouchová, Pavel Rous

引用次数: 0

Field Failure Investigation of Power LEDs caused by Bond Wire Defect 键合线缺陷引起的大功率led现场故障研究

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168475

S. Schuh, B. Czerny

{"title":"Field Failure Investigation of Power LEDs caused by Bond Wire Defect","authors":"S. Schuh, B. Czerny","doi":"10.1109/ISSE57496.2023.10168475","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168475","url":null,"abstract":"LED lighting is an energy-efficient, durable, and eco-friendly solution that has become increasingly important in recent years. Advancements in LED technology have greatly improved the longevity of LED lights and they have become an indispensable part of lighting solutions, making them a popular choice for residential, commercial, and industrial applications. Although LEDs are known to have a long service life, in practice the occurrence of various degradation mechanisms can significantly shorten the lifetime. Factors such as humidity, electrostatic discharge damage and an unstable power supply can accelerate the degradation process. In this study, an LED spotlight that had failed prematurely under real operating conditions was examined to determine the failure mechanism. The structural degradation of the LEDs was qualified and located by ultraviolet illumination with optical microscopy and detailed analysis using scanning electron microscopy. VI characteristics measured for each individual LED revealing the integrity and higher current in the low-forward-bias for damaged LEDs. These damaged LEDs were not detected by electroluminescence spectrum analysis. The investigation showed that two LEDs were not functional and at least one LED driver was defective. One defect LED showed a broken phosphor layer. This LED, as well as the LEDs in the immediate vicinity, showed a white structure on the phosphor layer with strongly reduced or absent photoluminescent properties. The defects detected indicate destruction by a current/voltage spike, assumed to be caused by voltage peaks on the mains side.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133410109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates 用甲酸蒸气在厚印刷铜基板上焊接接头的热冲击老化

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168336

M. Hirman, D. Michal, J. Řeboun, F. Steiner

{"title":"Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates","authors":"M. Hirman, D. Michal, J. Řeboun, F. Steiner","doi":"10.1109/ISSE57496.2023.10168336","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168336","url":null,"abstract":"This article addresses the soldering of larger components onto ceramic substrates with printed copper patterns with a reduced amount of flux. The main aim of the research was to find a suitable soldering method and study the reliability of soldered joints on ceramic substrates under thermal shock ageing. The mock-up chips were used in the test and for this reason the test was primarily focused on bottom joint in the structure or sandwich structures. In the experiment, vacuum soldering using formic acid vapors to reduce oxides was used. Then the samples were observed under X-RAY radiation and submitted for thermal shock testing (-40 °C / 125° C / 1000 cycles). After the shock testing, another X-RAY scan with void area measurement and shear strength testing were realized. The results showed that our contacting soldering process on ceramic substrates is applicable and the samples also endures the shock ageing, especially bottom joint between ceramic substrate with Cu layer and solder alloy. The results also showed that void area and mechanical shear strength of soldered ceramic samples are relatively comparable with standard samples (FR-4).","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131501194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Characterization of the Interconnection of Semiconductors on Thin Copper and Silver Layers Using Infrared Thermography 用红外热成像技术表征薄铜和银层上半导体互连的热特性

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168463

Mirko Kirchhoff, Henry Barth, L. Rebenklau

引用次数: 0

A Comparison Between Pressure-less and Pressure-assisted Cu Sintering for Cu Pillar Flip Chip Bonding 无压与助压烧结铜柱倒装芯片键合的比较

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168441

A. Rodrigues, A. Roshanghias

{"title":"A Comparison Between Pressure-less and Pressure-assisted Cu Sintering for Cu Pillar Flip Chip Bonding","authors":"A. Rodrigues, A. Roshanghias","doi":"10.1109/ISSE57496.2023.10168441","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168441","url":null,"abstract":"As the most promising candidate for heterogeneous and 3D integration, Copper (Cu)-based interconnect are gaining prominence, due to superior characteristics (e.g., low resistivity, high electromigration resistance, high-temperature performance and low cost). Cu pillars allow for finer pitch, by providing higher control of bump diameter and height when compared to solder bumps. Flip chip bonding of Cu pillars can be conducted directly through thermocompression bonding or indirectly by employing solder caps. While the former imposes high temperature and pressures on the interface, the latter face reliability issues due to the formation of brittle intermetallic and thermal mismatches. Correspondingly, in this study, an alternative approach for solder-free Cu pillar bonding using Cu sinter pastes was investigated. To achieve an all-Cu interconnect between Cu pillars and Cu pads, a recently developed pressure-less Cu sinter paste was used in this study. The electrical and mechanical properties of the flip-chip bonded Cu pillars using pressure-less Cu paste were further compared with a pressure-assisted Cu paste. The long-term reliability of the bonded samples was assessed using thermal cycling tests.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134576213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

AQI monitoring system for intelligent transport systems 智能交通系统AQI监测系统

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168384

R. Miletiev, R. Yordanov, I. Damyanov

{"title":"AQI monitoring system for intelligent transport systems","authors":"R. Miletiev, R. Yordanov, I. Damyanov","doi":"10.1109/ISSE57496.2023.10168384","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168384","url":null,"abstract":"The intelligent transport systems (ITS) potentially contribute towards eco-driving by reducing carbon and pollutant emissions, such as particulate matter, carbon monoxide, ozone, nitrogen dioxide and sulfur dioxide, are detrimental to the environment and human health. Nowadays the Vehicle-to-Infrastructure (V2I) communication is used in the ITS to send bi-directional an information for the lane markings, traffic congestion, weather advisories, road signs, traffic light status, etc. Simultaneously the increased level of air pollution in the cities requires real – time monitoring of the air quality, so the integrated V2I communication may be also used to send the air quality data to the remote server and the traffic infrastructure behavior and the vehicle flows to be optimized to achieve better Air Quality Index (AQI). On the basis of the vehicle information such as a vehicle type (e-car, hybrid or petrol car) and the air quality analysis the intelligent transport system may reduce the emissions by switching the operating modes of the hybrid cars or reduce the traffic speed to decrease the particulate matter emissions. The paper represents the air pollution monitoring systems for the intelligent transport systems capable of real-time monitoring based on V2I communication via cellular networks","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128702360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Realization of Stretchable Conductive Traces on Textile Substrate Utilizing Direct Ink Writing 利用直接墨水书写在纺织基材上实现可拉伸导电痕迹

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168501

M. Janda, S. Pretl, Michaela Radouchová, D. Michal, S. Lotfi, J. Řeboun

引用次数: 0

Exploring Gold Contacts on Novel Carbyne-enriched Material 新型富碳物质上金触点的探索

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168392

R. Tomov, Mariya Aleksandrova

引用次数: 1

Optimization for Power Supplies Thermal Regime 电源热状态的优化

2023 46th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2023-05-10 DOI: 10.1109/ISSE57496.2023.10168343

Corina Ruxandra Mitulescu, Madalin Moise, B. Mihailescu, P. Svasta

引用次数: 0