Thermal Characterization of the Interconnection of Semiconductors on Thin Copper and Silver Layers Using Infrared Thermography

Abstract

Power electronics play a crucial role in the ongoing energy transition and in the fast-growing market of electric vehicles. Power semiconductor devices are used to convert electric energy. Losses occur in the device, especially during switching operations, which means that electrical energy is converted into heat. Since all electrical systems have an operating temperature limit, thermal management is an issue. This work is focused on a test setup for thermal-electric characterization of all kinds of power electronic substrates, mostly metal-ceramic composites. Special features of the set up are the infrared thermography and power control.