2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)最新文献_第4页

Learning software agent design for semiconductor tool group dispatching 半导体工具组调度学习软件代理设计

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393705

Shi-Chung Chang, Yu-Ting Lin, Yi-Ju Chang, Shy-Kang Jeng, B. Hsieh

引用次数: 2

Defect tool monitoring of process equipment by AIT fusion AIT融合对工艺设备缺陷工具的监控

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393747

L. Lin, F. Kuo, C. Lee, C. Broughton, R. Yang, J. Liao, J. Wang

引用次数: 0

Risk management strategy for semiconductor fabs - started from game theory 半导体晶圆厂的风险管理策略——从博弈论出发

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393763

E. Liu, Chun-Cheng Yi

{"title":"Risk management strategy for semiconductor fabs - started from game theory","authors":"E. Liu, Chun-Cheng Yi","doi":"10.1109/SMTW.2004.1393763","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393763","url":null,"abstract":"The ever changing and the more competitive hi-tech environment, the business units always have the profit and product as first priority. But normally the wishes are not always come true, some outrages can prohibit the managers to reach their business goal. One of the example is the semiconductor business are very good in 1999. No one will expect that there will be a power outage (once in a 10 years Taipower history in Hsin Chu area). The following is the 100 years catastrophic earthquake in September 21. Around the world, there are lots of catastrophic events like Iraq wars, 911 terrorist attack and nature disaster, which might impact the business. The question that is raised by senior managers is: (1) are the events predictable? (2) any strategies to control the damages? (3) does the events cause crisis or opportunity? This work discusses game theory developed by John Von Neumman and Oskar Morgenstern on the strategic management to combine with the theory of risk management to see any opportunity that a business can turn the risk into opportunity. The game theory includes: (1) how to be insight in the chaos (2) decision model in the uncertainty (3) cost-effectiveness analysis in the risk control. Four risk management strategies are adopted as (1) risk avoidance (2) risk mitigation (3) risk transfer and (4) risk reduction are assessed in different scenarios by using the game theory. It is a new logic regarding to implement the strategic management methodology in risk management which intend to help senior managers to use their business habit which include concerns of the risk in their decision making process. And the paper will provide some ideas of planning and implementation of the risk management strategies in the decision making process.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130106033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Study of junction leakage caused by cobalt silicide defects 硅化钴缺陷引起结漏的研究

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393765

L. Wang, B. Bridgman, G. Klein, Liying Wu, J. Darilek

引用次数: 1

Metal corrosion and passivation swelling defect study of ultra low pattern density thick metal etch process 超低图案密度厚金属蚀刻工艺中金属腐蚀与钝化膨胀缺陷的研究

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393753

F. Chang, Hsien-Ching Huang, Szu-Hung Yang, S. Kuo

{"title":"Metal corrosion and passivation swelling defect study of ultra low pattern density thick metal etch process","authors":"F. Chang, Hsien-Ching Huang, Szu-Hung Yang, S. Kuo","doi":"10.1109/SMTW.2004.1393753","DOIUrl":"https://doi.org/10.1109/SMTW.2004.1393753","url":null,"abstract":"In thick metal process with ultra low pattern density, the defined metal line easily suffered metal corrosion defect and passivation swelling defect (can not detect Cl element) issue. Poor metal sidewall profile or the profile with much polymer remaining was the suspected root cause of metal corrosion defect. The defect showed the reliability concern, so an improved method was necessary to reduce the defect. For improving the corrosion defect, dry etch recipe and strip procedure optimization showed be the solution to reduce the defect. Dry etch recipe was the major focus because the evidence showed poor sidewall profile would trap more polymer by-product. Thus, dry etch recipe developing specially focused on metal sidewall profile improvement and polymer by-product reduction. The optimized etch recipe passed corrosion test, even at high RF hours of dry etchers. Optical microscope inspection also couldn't detect any swelling defect. All testing items including WAT (wafer acceptance test) and yield got comparable or even better result to the condition before improvement. The paper mainly described how to improve metal corrosion and passivation swelling defect. It also provided some hints to understand the two kinds of defects further.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131835481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The outsourcing of SoC product development: Taiwan as the global center for SoC implementation SoC产品开发外包:台湾作为全球SoC实施中心

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393698

D. Yang

引用次数: 0

An efficient yield enhancement from inline defect control and in-situ advanced process control 通过在线缺陷控制和现场先进工艺控制有效提高良率

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393722

Yi-Ko-Chen, S. Tso, Chung-I Chang, Tings Wang

引用次数: 0

An effective one-trap-level CAD model for the general SOC integration platform - particle-beam stand (PBS) - when modeling proton-caused local semi-insulating regions 一种适用于SOC集成平台的有效的单阱级CAD模型——粒子束架(PBS)，用于对质子引起的局部半绝缘区域进行建模

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393756

C. Liao, T. Duh, T. Yang, S. Lan, C.W. Liu, T.T. Yang, J. Hsu, H.Y. Shao

引用次数: 0

An optical interference model to analyze interferometry endpoint signal for process control of polysilicon gate etch 一种用于多晶硅栅极蚀刻过程控制的干涉测量端点信号分析的光学干涉模型

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393740

L. Hsu

引用次数: 0

Selectivity investigation of HfO/sub 2/ to oxide using wet etching 湿法蚀刻研究HfO/sub /对氧化物的选择性

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI: 10.1109/SMTW.2004.1393729

T. Kang, Chih-Cheng Wang, B. Tsui, Yuan-Hsin Li

引用次数: 5