Selectivity investigation of HfO/sub 2/ to oxide using wet etching

T. Kang, Chih-Cheng Wang, B. Tsui, Yuan-Hsin Li
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引用次数: 5

Abstract

Experiments indicate that higher HfO/sub 2//oxide etching selectivity in IPA/HF solution as compared to DI water/HF solution. Although DI water/HF solution is acceptable for some HfO/sub 2/ and CVD oxide films, from an integration point of view, the process window is smaller than IPA/HF solution. It is believed that adequately damaged HfO/sub 2/ and annealed CVD oxides will result in considerably high HfO/sub 2//CVD oxide etching selectivity in IPA/HF solution.
湿法蚀刻研究HfO/sub /对氧化物的选择性
实验表明,相对于DI水/HF溶液,IPA/HF溶液中HfO/sub 2//氧化物的刻蚀选择性更高。虽然对于某些HfO/sub /和CVD氧化膜,DI水/HF溶液是可以接受的,但从集成的角度来看,工艺窗口小于IPA/HF溶液。认为充分破坏HfO/ sub2 /和退火CVD氧化物可使HfO/ sub2 //CVD氧化物在IPA/HF溶液中具有相当高的蚀刻选择性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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