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2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)最新文献

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Radiation-hardened Test Design for Aerospace SoC 航空SoC抗辐射测试设计
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292308
Dan‐dan Cheng, Dan Qi, Mo Chen
{"title":"Radiation-hardened Test Design for Aerospace SoC","authors":"Dan‐dan Cheng, Dan Qi, Mo Chen","doi":"10.1109/ICICM50929.2020.9292308","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292308","url":null,"abstract":"Due to space application scenarios, radiation hardening techniques should be applied on aerospace SoC. This paper introduces an integrated test method for radiation-hardened SoC, which combines traditional scan chain and Memorybist designs, and new TMD chain and RAM test designs to verify the performance of rad-hardened SoC. The design of scan chain and Memorybist can be applied to the rapid screening of chips after tapeout. TMD chain and RAM test can verify the radiation-hardened performance of the chip in radiation experiments. The whole test design is flexible and configurable with high test coverage, and it is helpful to analyze the malfunction and radiation resistance of the chip.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121119676","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Identification of Series Fault Arc of Low-voltage Power Cables in Substation Based on Wavelet Transform 基于小波变换的变电站低压电力电缆串联故障电弧识别
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292218
Ning Xu, Yong Yang, Yongtao Jin, Jian He
{"title":"Identification of Series Fault Arc of Low-voltage Power Cables in Substation Based on Wavelet Transform","authors":"Ning Xu, Yong Yang, Yongtao Jin, Jian He","doi":"10.1109/ICICM50929.2020.9292218","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292218","url":null,"abstract":"Low-voltage cable in substation is easy to cause fire accident due to fault arc. The current of series fault arc is similar to the current under normal load fluctuation in waveform, so it is difficult to identify it directly. The AC load characteristic test of low-voltage cable was carried out in the UHV Lanjiang station of Zhejiang power grid, and the arc simulation test of series fault of low-voltage cable was carried out in the laboratory. Based on wavelet transform, the original current signals of the two working conditions are decomposed by 5-level wavelet transform and the key features are extracted. By comparing the wavelet details of each decomposition scale, it is found that the ratio of the maximum absolute value to the mean absolute deviation of the series fault arc current signal is significantly higher than that of the load characteristic current signal. Therefore, it can be used as the detection basis for the series fault arc of low-voltage power cables in Substation.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129348251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
The Property of ITO Produced by Optical Thin Film Coating for Solar Cell 太阳能电池用光学薄膜涂层制备ITO的性能研究
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292192
Dai Pan, Cheng Feixue, Long Jun-hua, Lu Shulong
{"title":"The Property of ITO Produced by Optical Thin Film Coating for Solar Cell","authors":"Dai Pan, Cheng Feixue, Long Jun-hua, Lu Shulong","doi":"10.1109/ICICM50929.2020.9292192","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292192","url":null,"abstract":"We studied the crystal quality and optical properties of ITO produced with optical thin film coatings to replace conventional metal electrodes as electrodes for III-V solar cells. ITO films were grown on glass, GaAs and silicon substrate. ITO is a polycrystalline with predominant (222) crystalline plane. A smooth surface with protruding nano-crystallite was observed. The light transmittance of ITO has a strong relationship with thickness and annealing temperature. The transmittance was obviously enhanced after being annealed at 500 °C. With the thickness increase, the transmittance decreases in total. The band gap of the ITO film was estimated 3.8 eV by extrapolating the linear part of the Tauc plot curves to intercept the energy axis. The refractive index n of ITO film is was measured. The reflectivity is greatly influenced by the thickness of ITO.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114706047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Research on Partial Discharge Localization in 252kV GIS Using Ultrasonic Associated with Electromagnetic Wave Method 超声波结合电磁波法在252kV GIS局部放电定位中的应用研究
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292221
Lin Zhao, Liya Ye, Bing Yu, Haofan Lin, Yong Yang, Wenzhe Zheng
{"title":"Research on Partial Discharge Localization in 252kV GIS Using Ultrasonic Associated with Electromagnetic Wave Method","authors":"Lin Zhao, Liya Ye, Bing Yu, Haofan Lin, Yong Yang, Wenzhe Zheng","doi":"10.1109/ICICM50929.2020.9292221","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292221","url":null,"abstract":"According to a live detection of 252kV GIS, this paper describes the principles and technical advantages of UHF-based and ultrasonic-based GIS partial discharge detection methods; in addition, it analyzes the spectrogram information of portable PD analyzer to preliminarily judge the defect type. At last, the discharge source is precisely located by means of time difference positioning method and ultrasonic associated with electromagnetic wave method. Through the on-site basin-type insulator fastening screw inspection, the judgment is consistent with the test conclusion, which verifies the accuracy of the onsite live detection. Practice shows that UHF and ultrasonic partial discharge detection technique can recognize partial discharge due to GIS defects, and timely discover and prevent GIS insulation faults to ensure the operation security and stability of GIS.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124475168","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A 25Gb/s Burst Mode Optical Receiver Front-End in 0.13 mumathrm{m}$ BiCMOS Technology 基于0.13 mumath {m}$ BiCMOS技术的25Gb/s突发模式光接收机前端
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292258
Gan Pang, Yingmei Chen, Jiakai Xiao, Yigang Chen, J. Peng, Tong Wang, En Zhu
{"title":"A 25Gb/s Burst Mode Optical Receiver Front-End in 0.13 mumathrm{m}$ BiCMOS Technology","authors":"Gan Pang, Yingmei Chen, Jiakai Xiao, Yigang Chen, J. Peng, Tong Wang, En Zhu","doi":"10.1109/ICICM50929.2020.9292258","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292258","url":null,"abstract":"A new 25Gb/s burst mode optical receiver front-end is proposed in this paper, which consists of a transimpedance amplifier (TIA), an automatic gain control (AGC) and a DC offset cancellation (DCOC) buffer. High transimpedance gain of the TIA is designed to decrease input noise and acquire appropriate AGC gain range. Without conventional peak detector, a feedforward AGC stage is adopted to shorten the stabilization time and adapt to burst signal. Simulation results show that the proposed front-end circuit achieves low noise of $1.6 mu text{AAMS}$, setting time of 70ns. In 0.13 mumathrm{m}$ BiCMOS technology, the optical receiver front end consumes 300mW from a 3.3V supply.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"205 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132349922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 5-GHz Phase Compensation Spread Spectrum Clock Generator for High Speed SerDes Application 一种用于高速伺服器的5ghz相位补偿扩频时钟发生器
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292180
X. Guan, Tongbei Yang, Fang Tang
{"title":"A 5-GHz Phase Compensation Spread Spectrum Clock Generator for High Speed SerDes Application","authors":"X. Guan, Tongbei Yang, Fang Tang","doi":"10.1109/ICICM50929.2020.9292180","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292180","url":null,"abstract":"In this paper, a phase compensated spread spectrum clock generator (SSCG) with triangular modulation profile is presented. The phase interpolator (PI) based on 32 phase selectors (PS) with wired- AND logic is proposed to implement phase interpolation. This structure has lower power consumption and no static current. The SSCG exhibits 630-fs and 640-fs rms jitter with SSC-off and SSC-on at 5-GHz, and EMI reduction is 18.97-dB under the down spread modulation of 5000-ppm. The power consumption of this design is 46.54-mW. The design has been implemented in 55-nm CMOS process and occupies an area of 0.42times 0.22 text{mm}^{2}$.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130067347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 5.3-nV/√Hz Noise Density Switched-Capacitor Programmable Gain Amplifier with kT/C Noise Reshaping and Ping-Pong Topology 基于kT/C重构和乒乓拓扑结构的5.3 nv /√Hz噪声密度开关电容可编程增益放大器
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292137
Shizhe Wang, N. Tan, Zhong Tang, Ling Lin
{"title":"A 5.3-nV/√Hz Noise Density Switched-Capacitor Programmable Gain Amplifier with kT/C Noise Reshaping and Ping-Pong Topology","authors":"Shizhe Wang, N. Tan, Zhong Tang, Ling Lin","doi":"10.1109/ICICM50929.2020.9292137","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292137","url":null,"abstract":"This paper presents an implementation of a 5.3-n V/√Hz noise density switched-capacitor (SC) programmable gain amplifier (PGA) with a 500-uA current consumption under a single 3.3 V supply. It employs a kT/C noise reshaping technique to reduce the kT/C noise caused by sampling at a lower frequency. The common-mode sampling (CMS) is also used to achieve the split between the input common-mode voltage sampling and the noise sampling that ensures the kT/C noise is reshaped. The CMS guarantees that the kT/C noise introduced by the input chopper switches only has an impact on the common-mode noise. In addition, a ping-pong topology is used to attenuate the output aliased noise and obtain a fast settling.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124716661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of Verification Platform for CAN-FD IP Customized SRAM Controller Based on UVM 基于UVM的CAN-FD IP自定义SRAM控制器验证平台设计
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292225
Shuaiqi Yan, Shuqin Geng, Xiaohong Peng, Haonan Tang, Yan Zhang, Zifeng Wang
{"title":"Design of Verification Platform for CAN-FD IP Customized SRAM Controller Based on UVM","authors":"Shuaiqi Yan, Shuqin Geng, Xiaohong Peng, Haonan Tang, Yan Zhang, Zifeng Wang","doi":"10.1109/ICICM50929.2020.9292225","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292225","url":null,"abstract":"This article focuses on the design of a system-level verification platform for a static random-access memory (SRAM) module. The SRAM module is in a CAN-FD SOC chip. The SRAM memory controller verified by the verification platform in this paper is an important module integrated on the APB SOC chip bus for basic communication with CAN-FD IP. By adopting UVM universal verification methodology, a complete verification platform and verification environment suitable for the module are designed and built; by generating constrained random test excitation signals, the function of the controller is fully verified, and the results can be automatically compared with the data. The results show that the verification platform can greatly reduce the development time of verification incentives, simplify the verification process, shorten the verification cycle and have good reusability.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"1959 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129534750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Jitter Elimination and Data Compression Algorithm for Pressure Sensor Array 压力传感器阵列抖动消除与数据压缩算法
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292244
R. Li, Xueping Zou, Xu Liu, Deepu John
{"title":"A Jitter Elimination and Data Compression Algorithm for Pressure Sensor Array","authors":"R. Li, Xueping Zou, Xu Liu, Deepu John","doi":"10.1109/ICICM50929.2020.9292244","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292244","url":null,"abstract":"This paper proposes an algorithm to process data of high-precision sensor array with data compression. To eliminate the jitter in pressure sensing, the Speeded-up Robust Features(SURF), Fast Approximate Nearest Neighbor Search Library(FLANN), RANdom SAmple Consensus(RANSAC), Gaussian filter and motion compensation are implemented. Moreover, data compression is conducted based on JPEG-LS and Run-length coding. As a result, the proposed algorithm achieves the jitter eliminating and high compression ratio.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127048700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Fully-Differential Ka-band Driver Amplifier For 77GHz Automotive Radar 77GHz汽车雷达全差分ka波段驱动放大器
2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2020-10-23 DOI: 10.1109/ICICM50929.2020.9292293
Bingbing Liao, Yan Wang, Zongming Duan, Bowen Wu, Wei Lv, Yuying Zhang
{"title":"A Fully-Differential Ka-band Driver Amplifier For 77GHz Automotive Radar","authors":"Bingbing Liao, Yan Wang, Zongming Duan, Bowen Wu, Wei Lv, Yuying Zhang","doi":"10.1109/ICICM50929.2020.9292293","DOIUrl":"https://doi.org/10.1109/ICICM50929.2020.9292293","url":null,"abstract":"This paper presents a fully-differential Ka-band amplifier driver using a 65nm CMOS technology for 77GHz Automotive Radar. Principles of its matching circuit and System architecture of amplifier are presented. Finally, Results of measurements are given.","PeriodicalId":364285,"journal":{"name":"2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130042888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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