IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)最新文献_第2页

Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs 嵌入式电源是一种用于ipem和pebb封装的多层集成技术

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885179

Zhenxian Liang, F. Lee, G. Lu, D. Borojevic

引用次数: 14

Electromagnetic compatibility: bench testing for power assemblies 电磁兼容性:电力组件台架试验

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885183

T. McMillan

引用次数: 0

Polymer thick film (PTF) and flex technologies for low cost power electronics packaging 用于低成本电力电子封装的聚合物厚膜(PTF)和柔性技术

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885178

A. B. Lostetter, Fred Barlow, A. Elshabini, K. Olejniczak, S. Ang

{"title":"Polymer thick film (PTF) and flex technologies for low cost power electronics packaging","authors":"A. B. Lostetter, Fred Barlow, A. Elshabini, K. Olejniczak, S. Ang","doi":"10.1109/IWIPP.2000.885178","DOIUrl":"https://doi.org/10.1109/IWIPP.2000.885178","url":null,"abstract":"Electronic power converters have been designed, produced, and disseminated in mass quantities using a number of fabrication techniques, from standard PCB technologies for low cost applications, to thick film on ceramic, to direct bond copper (DBC) for high power, higher cost applications. Each approach holds a share of the power packaging market, but they all restrict, for the most part, circuit and package designs to 2D boards. One potential pathway into the third dimension is by the use of multilayers, an approach which becomes increasingly difficult with each additional layer added beyond the first, and with the exception of high performance solutions is typically cost prohibitive for the majority of applications. This paper demonstrates the feasibility and viability of an alternative low cost power packaging option which uses familiar industry technologies in a unique manner: flexible polymer substrates. Flex technology uses industry standard PCB and/or thick film processes, offers the lower cost, higher performance solutions inherent with the majority of polymer plastics, and as a final bonus, frees the designer to more efficiently use all three dimensions. The researchers have shown the feasibility of this low cost alternative solution through the fabrication and testing of integrated power modules (IPMs) which use flex polymer substrates in conjunction with both surface mount and bare dice. These DC/DC power converters transform 120 V/240 V inputs to 9V, 7 W outputs, and illustrate the miniaturization advantages of fully utilizing the 3D space offered by flex circuitry.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117301401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

An integrated architectural framework for power conversion systems 电力转换系统的集成架构框架

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885169

G. Venkataramanan

引用次数: 3

High power IGBT modules: thermal fatigue resistance evaluation of the solder joints 大功率IGBT模块:焊点抗热疲劳性能评估

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885186

J.-M. Thebaud, E. Woirgard, C. Zardini, K. Sommer

{"title":"High power IGBT modules: thermal fatigue resistance evaluation of the solder joints","authors":"J.-M. Thebaud, E. Woirgard, C. Zardini, K. Sommer","doi":"10.1109/IWIPP.2000.885186","DOIUrl":"https://doi.org/10.1109/IWIPP.2000.885186","url":null,"abstract":"Extensive accelerated aging tests have been carried out with representative test structures in order to evaluate the thermal fatigue resistance of five solder alloys intended for high power IGBT modules. With regard to the chip-to-substrate samples, Pb-free preforms have given excellent results since the thermal impedance of these hybrid assemblies has hardly changed during thermal cycling, even after 2000 shocks between +125/spl deg/C and -55/spl deg/C (less than 5%). The best results have been clearly obtained with the finest solder microstructures. In addition, the analysis of the results has led to an evaluation of the acceleration factor of the thermal fatigue tests. Finally, SEM observations of cross-sectioned samples have shown crack propagation during thermal cycling which is responsible for the increased thermal impedance. However, with regard to substrate-to-baseplate samples, the best results have been obtained with a Pb-bearing solder alloy strongly subject to coarsening during thermal cycling. Moreover, it has been demonstrated that fast cooling can cut crack growth rate in the solder joints by half. In addition, EDX analyses have shown copper diffusion all over the solder joint when the DBC (direct bonded copper) substrate is not nickel-plated, which seems to slightly improve its fatigue resistance. Finally, these experiments have shown that fine solder microstructures do not necessarily lead to good fatigue performances at high levels of stress or strain.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127851553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Characterization of solderable metallization on power devices for 3-D packaging 3-D封装电源器件上可焊金属化的表征

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885188

S. Haque, G. Lu

引用次数: 1

Low stress anhydride molding compound for RF applications 用于射频应用的低应力酸酐成型化合物

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885187

P. Procter, T. R. Miles

引用次数: 1

MCM-D package for power applications 电源应用的MCM-D封装

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885184

A. Collado, X. Jordà, E. Cabruja, P. Godignon

引用次数: 10

An advanced approach to power module packaging 一种先进的电源模块封装方法

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885167

B. Ozmat, C. Korman, R. Fillion

引用次数: 14

Fabrication of thin-film V-groove inductors using composite magnetic materials 复合磁性材料制备薄膜v型槽电感器

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI: 10.1109/IWIPP.2000.885191

S. Prabhakaran, D.E. Kreider, Yu Lin, C. Sullivan, C. Levey

引用次数: 17