MCM-D package for power applications

Abstract

The aim of this work is the development of a new intelligent power module, called IPMCM (intelligent power multichip module). This module combines the fabrication technology of multichip modules on silicon substrates with that of power transistors. The fabricated IPMCM includes a VDMOSFET at the substrate level and a gate driver at the flip-chip level, in addition to two temperature sensor chips for thermal assessment of the module. A DC-DC converter, an H-bridge circuit, has been implemented by using four of these IPMCMs mounted onto an IMS substrate with some other SMD components for a motor control application.