{"title":"一种先进的电源模块封装方法","authors":"B. Ozmat, C. Korman, R. Fillion","doi":"10.1109/IWIPP.2000.885167","DOIUrl":null,"url":null,"abstract":"Chip-on-flex power overlay technology, the advanced power electronic packaging technology developed at GE CRD, eliminates the need for wire bonds, offers low inductance strip-lined power electrodes, and low parasitic impedance. In addition, the planarity of the top layer structure and the thermal base provide double-sided cooling capability and improve the size, weight, cost, and thermal and electrical performance of the package.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"An advanced approach to power module packaging\",\"authors\":\"B. Ozmat, C. Korman, R. Fillion\",\"doi\":\"10.1109/IWIPP.2000.885167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Chip-on-flex power overlay technology, the advanced power electronic packaging technology developed at GE CRD, eliminates the need for wire bonds, offers low inductance strip-lined power electrodes, and low parasitic impedance. In addition, the planarity of the top layer structure and the thermal base provide double-sided cooling capability and improve the size, weight, cost, and thermal and electrical performance of the package.\",\"PeriodicalId\":359131,\"journal\":{\"name\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWIPP.2000.885167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2000.885167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
摘要
GE CRD开发的先进电力电子封装技术芯片柔性电源覆盖技术消除了对线键的需求，提供了低电感带衬里功率电极和低寄生阻抗。此外，顶层结构和热基的平面性提供了双面冷却能力，并改善了封装的尺寸、重量、成本和热电性能。
Chip-on-flex power overlay technology, the advanced power electronic packaging technology developed at GE CRD, eliminates the need for wire bonds, offers low inductance strip-lined power electrodes, and low parasitic impedance. In addition, the planarity of the top layer structure and the thermal base provide double-sided cooling capability and improve the size, weight, cost, and thermal and electrical performance of the package.
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