2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Degradation Prediction of Electronic Packages using Machine Learning","authors":"A. Prisacaru, Ernesto Oquelis Guerrero, P. Gromala, B. Han, Guo Qi Zhang","doi":"10.1109/EUROSIME.2019.8724523","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724523","url":null,"abstract":"The piezoresistive silicon based stress sensor has the potential to detect a precursor for the Prognostics and Health Management (PHM) implementation in automotive electronics. One solution to enforce reliability in automotive electronics is the use of Machine Learning (ML). One or more physical parameters are being monitored, and algorithms are used to illustrate the health state and predict remaining useful life based on the current and past health information. Piezo-resistive stress sensors are employed to measure the internal stresses of electronic packages, an Acquisition Unit (AU) to read out sensor data and a Raspberry Pi as PHM server to perform evaluation. Accelerated tests in air thermal chamber are performed to get time series data of the stress sensor signals, with which we can know better about how delamination develops inside the package. In this study stress measurements are performed in several electronic packages during the delamination. The delamination is detected by the stress sensor due to the continuous change of the stiffness and the local boundary conditions causing the stresses to change. Moreover, the stress change in multiple cells can give more information regarding the delamination such as the location and its state. Data preprocessing methods to remove outliers and filter raw measurement results, and feature extraction methods to capture only meaningful information by reducing the data are chosen and applied to raw data. A logical assumption is made regarding the data behavior and delamination state, based on data analytics and with Scanning Acoustic Microscope (SAM) images confirmed the delaminated area. FEM simulation are used to provide a qualitatively physical explanation of the stress change due to the delamination. A prognostic model using neural network is trained to estimate the degradation grade. Back Propagation Neural Networks are chosen to provide a fast and quick training for the mechanical stress data.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115301400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Measurement and Simulation of Test Structures Dedicated to the Investigation of Heat Diffusion at Nanoscale","authors":"M. Janicki, Jedrzej Topilko, A. Sobczak, P. Zając, P. Pietrzak, A. Napieralski","doi":"10.1109/EUROSIME.2019.8724545","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724545","url":null,"abstract":"This paper presents the measurement results of test structures dedicated to the investigation of heat diffusion at nanoscale. These structures contain thin film platinum resistors deposited on an oxidized silicon wafer. Initially, the manufactured structures were carefully characterized. Then, their detailed thermal model was created in a FEM simulation environment and optimized so as to obtain the agreement between measurements and simulations. After these preliminary tests, dynamic thermal responses of the structures will be investigated.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130800118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Advanced Electro-Thermal Analysis of IGBT Modules in a Power Converter System","authors":"Xiang Li, Daohui Li, Fang Qi, M. Packwood, H. Luo, Guoyou Liu, Yangang Wang, X. Dai","doi":"10.1109/EUROSIME.2019.8724574","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724574","url":null,"abstract":"An advanced electro-thermal analysis approach is introduced in this paper. The method is based on the reduced order modelling technique in which the zero dimensional (0D) thermal network is extracted from the three dimensional (3D) IGBT module packaging structure and dynamically coupled with the electro-thermal model of the chips. By this multi-physics coupling technique, the electro-thermal behaviour of the IGBT module can be revealed with much more details, with potential for accurate reliability assessment. The circuit-fashion analysis approach also helps to greatly reduce the computational time and resource required. The schematic, simulation and validation of the approach will be described in detail.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"63 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114094453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Degradation of Bisphenol-A-polycarbonate (BPA-PC) Optical Lenses under Simulated Harsh Environment Conditions","authors":"M. Y. Mehr, W. V. van Driel, Kouchi Zhang","doi":"10.1109/EUROSIME.2019.8724524","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724524","url":null,"abstract":"This paper investigates degradation and failure mechanisms of BPA-PC lenses in simulated harsh environment conditions. Exposure of secondary optics in Light Emitting Diode LED-based systems or any other similar applications to environmental stresses can adversely effect the performance and lifetime of products. This paper simulates a harsh environment condition, using a salt bath oven. Salt spray exposure/ageing tests at $45 ^ { circ } mathrm { C }$ were carried out up to four months. Fourier transform infrared-attenuated total reflection FTIR-ATR spectrometer and Lambda 950 Ultraviolet-Visible (UV-VIS) spectrophotometer were used to study the optical and chemical characteristics of aged plates. Results showed that salt bath exposure test resulted in the severe deterioration of optical characteristics BPA-PC samples. Degradation of optical properties of BPA-PC plates is attributable to the oxidation of samples.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124430794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Finite element method simulation of graphene phononic crystals with cross-shaped nanopores","authors":"Seiya Kubo, Marek E. Schimidt, M. Muruganathan, H. Mizuta","doi":"10.1109/EUROSIME.2019.8724552","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724552","url":null,"abstract":"Control of heat transport in materials is extremely important for advanced applications in hyper-sound and heat control, acoustic and thermal cloaking, thermal diodes etc. However, for such applications, the realization of terahertz frequency band gaps is highly desired. In this report, finite element simulation, with continuum approximation is utilized to induce phononic band gaps (PnBG) in graphene phononic crystals (GPnC). The cross-shaped hole structure results show that the PnBG depends on the size of the pitch and neck of the GPnC, showing higher frequency band gaps at a smaller pitch size and more PnBG with decreasing neck size. The PnBG was most strengthened at single nanometer neck size, and was completely lost at 10 nm neck size. Furthermore, circular-hole and square-hole shaped structures did not exhibit any PnBG for 25 nm pitch size.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116786372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Virtual Prototyping and Simulation of Electro-Thermal Systems","authors":"T. Hauck, V. Jha","doi":"10.1109/EUROSIME.2019.8724572","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724572","url":null,"abstract":"Virtual prototyping is the way forward to shorten development cycles and deliver optimized design solutions for semiconductor components and electronic modules. It allows us to make virtual experiments for devices that have never been built before. We can predict safe operating areas and on the other hand identify critical use conditions. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains (e.g. thermal, electrical, mechanical) along with complex 3-D structures. The focus of the current paper is to present an efficient simulation flow for prediction of three-dimensional temperature fields at transient operating conditions with multiple heat sources and associated thermal cross talk at component and system levels. In what follows, we will demonstrate the virtual assembly of an electronic control unit (ECU) and its transient thermal simulation in time domain. We will decompose the unit into its major components for which fast mathematical models will be derived by means of model order reduction techniques. We will then create a reduced mathematical model of the entire ECU by simply interconnecting all component models at predetermined I/Os. We will demonstrate a stimulus-response analysis of the interconnected system and a subsequent result expansion path for 3-D visualization of temperature fields. Finally, we will compare simulation results of the reduced system model with the corresponding full-scale finite element model.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2017 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127565313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints","authors":"Andreas Lövberg, P. Tegehall","doi":"10.1109/eurosime.2019.8724507","DOIUrl":"https://doi.org/10.1109/eurosime.2019.8724507","url":null,"abstract":"Lifetime predictions of lead-free solder joints remain a challenging task in assuring reliability of electronic packaging. Due to the complex interaction of a wide range of as-soldered microstructures, strong an isotropic properties and a failure mechanism that is not completely understood, life time predictions of SnAgCu solder joints remain a challenging task.In this work, we present experimental findings of transgranular crack propagation of SnAgCu solder joints in thermal cycling. These findings are in contrast with the established picture of a recrystallization-assisted intergranular crack propagation failure mechanism.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"51 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116261901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of Stress State on Fatigue Characterization of SAC305 Solder Joints","authors":"A. Deshpande, Hannah Kaeser, A. Dasgupta","doi":"10.1109/EUROSIME.2019.8724547","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724547","url":null,"abstract":"In this study, room temperature cyclic mechanical tests are performed at different load levels on three types of SAC305 joint-scale solder specimens: (i) M90 specimen (tensile stress state), where the solder joint is oriented perpendicular to the loading axis; (ii) M0 specimen (shear stress state), where the solder joint is oriented parallel to the loading axis; and (iii) M45 specimen (with multiaxial stress state), where the solder joint is oriented at an angle of 45° to the loading axis. Digital Image Correlation (DIC) technique is used to measure solder deformation. Cyclic equivalent strain range is estimated for each of the three loading conditions and used for comparing fatigue durability (by constructing strain-life fatigue curves) under these three different stress states. Failure analysis is conducted on the tested specimens, using SEM to understand and document the observed failure modes. Preliminary results indicate significant difference in fatigue life and failure modes of solder joints in tensile vs. shear mode. Few-grained SAC solder joints are found to exhibit poor tensile fatigue resistance compared to shear fatigue resistance. The multiaxial fatigue durability (M45 specimen) is found to be slightly worse than the shear fatigue durability. Findings of this study will provide better understanding of the contribution of axial loads and stress multiaxiality to damage and degradation mechanisms in few-grained SAC solder joints.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"308 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124383282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation and Design of an Optical Accelerometer","authors":"V. Rochus, W. Westerveld, B. Figeys, X. Rottenberg, R. Jansen","doi":"10.1109/EUROSIME.2019.8724569","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724569","url":null,"abstract":"This paper presents a new type of accelerometer, the Micro-Opto-Mechanical Accelerometer (MOMA). Micro-opto-mechanical pressure sensors and microphones demonstrated already the excellent sensitivity on a very large pressure range which is possible thanks to their photonic read-out (1Pa precision over kPa range). In this paper, we design in the same technology an optical accelerometer using analytical equations as well as Finite Element simulations. The model takes into account the mechanical deformation of the device, its effect on the elongation of the waveguide, and also includes the optical losses. Using the opto-mechanical model, an optimum design is obtained varying device dimensions and waveguide positions in order to increase the accelerometer sensitivity.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125790688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments","authors":"F. Rost, S. Huber, H. Walter, M. van Dijk, T. Cramer, J. Jaeschke, O. Wittler, M. Schneider-Ramelow","doi":"10.1109/EUROSIME.2019.8724588","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724588","url":null,"abstract":"The focus of this study concerns the thermo-mechanical understanding of prepreg materials during the lamination process in order to predict the correct warpage behavior of a multi-layer stack-up, and with that, the corresponding mechanical stress state. During the lamination process, under temperature and pressure, the polymeric resin reacts and forms a three-dimensional structure. This process causes the material to reduce its volume and initiates stress. The part of the volume shrinkage, which causes these stresses, are in this work referred to the process induced shrinkage of the prepreg, and is determined by combining thermo-mechanical Finite Element (FE) simulations and warpage measurements of a two-layer stack-up. This stack-up consists of a core (fully cured) with a second, pre-cured prepreg layer identical to the core material. After characterization of the temperature and time dependent mechanical properties, the warpage is characterized by topographic measurements based on phase shifting line patterns. A parameter identification approach will be introduced to determine the unknown process induced shrinkage of the pre-cured prepreg.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134473178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}