电源变换器中IGBT模块的高级电热分析

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI:10.1109/EUROSIME.2019.8724574

Xiang Li, Daohui Li, Fang Qi, M. Packwood, H. Luo, Guoyou Liu, Yangang Wang, X. Dai

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引用次数: 2

摘要

本文介绍了一种先进的电热分析方法。该方法基于降阶建模技术，从三维IGBT模块封装结构中提取零维热网络，并与芯片的电热模型动态耦合。通过这种多物理场耦合技术，可以更详细地揭示IGBT模块的电热行为，并有可能进行准确的可靠性评估。电路时尚分析方法也有助于大大减少所需的计算时间和资源。本文将详细描述该方法的原理图、仿真和验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Advanced Electro-Thermal Analysis of IGBT Modules in a Power Converter System

An advanced electro-thermal analysis approach is introduced in this paper. The method is based on the reduced order modelling technique in which the zero dimensional (0D) thermal network is extracted from the three dimensional (3D) IGBT module packaging structure and dynamically coupled with the electro-thermal model of the chips. By this multi-physics coupling technique, the electro-thermal behaviour of the IGBT module can be revealed with much more details, with potential for accurate reliability assessment. The circuit-fashion analysis approach also helps to greatly reduce the computational time and resource required. The schematic, simulation and validation of the approach will be described in detail.

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来源期刊

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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